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PowerPC IBM roadmap updated

Microprocessor Forum: IBM PowerPC 970

5.1-channel ABIT SP 53: specs and pricing

Legend QDI announces new i845PE/845GE mobos

Specifications of dual-processor Tyan Thunder K7X Pro (S2469)

APAC IDF Fall 2002: Intel announces new Xscale processors, packaging, and flash memory

DFI announces NB80-EA mobo on Granite Bay chipset

Intel announced new 400 MHz ULV Celeron for embedded systems

NEC-Mitsubishi cuts LCD prices

NVIDIA announces GeForce4 460 Go for notebooks

ABIT announces NV7-8X mobo on NVIDIA nForce2 chipset

Conexant Systems announces HomePlug 1.0: 14 Mbps over electric main

Ceatec 2002: Philips announces micro DVD

ARM1136J-S and ARM1136JF-S: two new ARM11 cores

Sony announces new 3.8-inch LCD panel with integrated electronics

PowerPC IBM roadmap updated

Introducing the updated IBM PowerPC roadmap. Details are to follow after processors are announced.

Microprocessor Forum: IBM PowerPC 970

This week should bring us a new wave of 64-bit processors for desktop and embedded systems: at Microprocessor Forum IBM is expected to announce the first 64-bit PowerPC. Featuring 1.8 GHz clock and supporting Altivec instructions for multimedia data processing and operation in up to 16-unit systems, it will become the base for new Apple Macintosh computers, that might appear in the market late next year.

Besides, NEC Electronics this week is to announce 64-bit MIPS processor, positioned as a system-on-chip core. Tensilica Inc. will describe architecture, incorporating user-defined 64-bit instructions for better parallelism, though featuring the same 32-bit core architecture.

PowerPC 970 32/64-bit architecture is realized rather simply: a special instruction flag enables 32-bit mode and upper instruction and data bits are ingnored. Both 32/64-bit modes feature 8 instructions per cycle. Besides, all 32-bit PowerPC specifications have remained the same.

Source: EE Times

5.1-channel ABIT SP 53: specs and pricing

In the near future ABIT is to sell its new 5.1-channel SP 53 acoustics.

Introducing you its brief specifications:

  • Subwoofer: wood, 20W 4-inch speaker, 4 Ohm, 154x198x290 mm, 3.5 kg weight;
  • Satellites: plastic, 5x5W 3-inch, 4 Ohm, 87x125x116 mm, 0.2 kg each, magnetic shielding;
  • SNR: >80 dB subwoofer and satellites
  • Frequency range: 30-300 Hz subwoofer, 100 Hz — 20 kHz satellites
  • Distortion factor: <1%, all channels
  • Channelizing: >60 dB
  • Expected price: $80-90

Legend QDI announces new i845PE/845GE mobos

Chinese Legend QDI announced two Platinix 2E/333 and Platinix 8/333 mobos, based on i845PE/845GE, respectively, supporting DDR333 and Hyper-Threading.

PlatiniX 2E/333 features ATX design and Intel 82845PE MCH + Intel 82801DB ICH4 bundle. It has AGP 4 slot, 6 PCI slots, 2 DIMM sockets (up to 2GB DDR 266/333), 6 USB2.0 ports, 5.1-channel AC´97 codec (only P2E/333-6A).

PlatiniX 8/333 differs by Intel 82845GE(MCH) + Intel 82801DB(ICH4) bundle, implying Intel Extreme graphics.

Both support QDI´s Hyper-Threading Detector, SpeedEasy II, LogoEasy II ,RecoveryEasy II, BIOS-ProtectEasy, BootEasy, StepEasy II, BootEasy, Hardware Doctor. Optionally board may feature 10/100 Mbps LAN (P2E/333-L and P8/333-L) and 1GbE LAN (P2E/333-K and P8/333-K).

Specifications of dual-processor Tyan Thunder K7X Pro (S2469)

Tyan posted the specifications of new Thunder K7X Pro dual-processor board on AMD-760 MPX, the advanced version of Thunder K7X. It will feature two variants: standard S2469GN and S2469UGN with integrated SCSI controller.

Thunder K7X Pro specifications:

  • Extended ATX (330.2x304.8 mm)
  • 2 mPGA462 AMD Athlon MP with 200/266 MHz FSB
  • AMD-760 MPX chipset: AMD-762 Northbridge and AMD-768 Southbridge
  • Dual-channel memory bus; 4 DDR DIMM sockets angled 25° for rackmounting, up to 4GB Registered DDR 200/266, ECC (72-bit) support
  • AGP Pro50 slot; AGP 4x/2x
  • Two 64-bit 66 MHz PCI slots
  • Three 32-bit 33 MHz PCI slots
  • 4 USB 1.1 ports
  • UDMA 33/66/100 IDE support
  • 8MB ATI RAGE XL PCI graphics
  • Fast Ethernet / Gigabit Ethernet (Intel 82545EM, 10/100/1000Mbps and Intel 82551QM, 10/100Mbps)
  • SCSI: 2-channel Ultra160/320 SCSI Adaptec AIC-7899W/AIC-7902W, up to 15 LVD SCSI devices per channel, Adaptec and Intel Zero-Channel RAID support

APAC IDF Fall 2002: Intel announces new Xscale processors, packaging, and flash memory

At Intel Developer Forum in Taipei, Intel announced new Xscale processors and flash memories. New chips are based on system-in-a-package (SIP) technology, in its turn, based on multi-level-cell (MLC) packaging.

Before the end of 2002 the company is to present fully integrated Manitoba chip, including flash memory, DSP, and XScale PXA core. Today Intel announced two new PXA261 and PXA262 processors, featuring XScale PXA250 RISC core and Intel StrataFlash memory. Intel´s first SIP products feature chip-scale package (CSP) of 13x13x1 mm dimensions. Intel PXA261, featuring 200 MHz XScale PXA250 and 16MB flash memory, will cost $36.10 in over 10,000-unit quantities. Intel PXA262, featuring 200 or 300 MHz core and 32MB flash memory will cost $54.60 and $62.60, respectively.

Besides, the company announced new 1.8V StrataFlash Wireless Memory samples, made using 0.13-micron process technology (such memory is used in new integrated Xscale processors). The previous StrataFlash generation required 3.3V voltage and was made using 0.18-micron process. New 64, 128, and 256 Mbit StrataFlash are to appear in the market in Q2 2003. 128 Mbit samples are available now for $17.75 in over 10,000-unit quantities. 64 Mbit and 256 Mbit chips are to appear early in 2003.

DFI announces NB80-EA mobo on Granite Bay chipset

DFI is to release new NB80-EA mobo on Intel E7205 chipset, known as Granite Bay.

NB80-EA specifications:

  • Intel Pentium 4 with 400/533 MHz FSB, HyperThreading support
  • Intel Celeron with 400 MHz FSB support
  • Intel E7205 Memory Controller Hub (MCH) + Intel 82801DB I/O Controller Hub (ICH4) bundle
  • Dual-channel (144-bit bus) DDR266 interface
  • 2 DIMM sockets per memory channel
  • Up to 4GB non-ECC (x64) or ECC (x72) DDR266 DIMM
  • Integrated LAN (Realtek RTL8100)
  • AGP 8x slot
  • 5 PCI slots
  • CNR slot
  • 6-layer PCB
  • ATX design

Pricing is unavailable yet. Shipments might start after November 4...

Source: INpact-Hardware

Intel announced new 400 MHz ULV Celeron for embedded systems

Today Intel announced new 400 MHz Ultra Low Voltage Celeron for embedded systems — storage devices, industrial PCs, etc.

The new chip dissipates nominal of 3.4W, up to 4.2W. It´s designed for working together with Intel RadiSys 82600 chipset, base for RadiSys EPC-6315 mobo for embedded systems. The chip can also be used with Intel 440MX and Intel 815E systems.

New 400 MHz Ultra Low Voltage Celeron features 256 Kb L2 cache, supports 100 MHz FSB, and is made using 0.13-micron process technology in FCBGA package. Core voltage makes 0.95V, temperature range is 0°C to +1000°C.

The shipments have already started, in over 1,000-unit quantities 400 MHz ULV Intel Celeron costs $38.

NEC-Mitsubishi cuts LCD prices

Today NEC-Mitsubishi Electronics Display of America announced significant price cut for the NEC MultiSync LCD line, touching 15-, 17-, 18-, 19-, and 21-inch models.

New price
Old price
NEC MultiSync LCD1550V $359.99 $449.99
NEC MultiSync LCD1550M $409.99 $449.99
NEC MultiSync LCD1700V $579.99 $699.99
NEC MultiSync LCD1720M $629.99 $749.99
NEC MultiSync LCD1850E $749.99 $849.99
NEC MultiSync LCD1855NX $849.99 $999.99
NEC MultiSync LCD1880SX $1149.99 $1299.99
NEC MultiSync LCD1920NX $949,99 $1299,99
NEC MultiSync LCD2110 $2799.99 $3799.99

NVIDIA announces GeForce4 460 Go for notebooks

Today NVIDIA announced new NVIDIA GeForce4 460 Go mobile GPU.

GeForce4 460 Go is mainly designed for thin, light notebooks with a balance of performance and energy consumption. GeForce4 460 Go memory controller bandwidth is up to 8 GB/s at up to 1 billion texel/s performance and 250 MHz clock. Using NVIDIA PowerMizer, GeForce4 460 Go features one of the industry best performance/W ratios.

Toshiba was the first to announce GeForce4 460 Go solutions, having presented Satellite 5205-S703 notebook line.

ABIT announces NV7-8X mobo on NVIDIA nForce2 chipset

ABIT posted specifications of new NV7-8X mobo on NVIDIA nForce2 chipset.

The board features ATX design, and bases on NVIDIA nForce2 SPP + MCP2-T chipset bundle. It supports Socket A Duron/Athlon/Athlon XP with 200/266/333 MHz FSB, has AGP 8 slot, 3 DIMM sockets (up to 3GB DDR 200/266/333 or up to 2GB (in two sockets) DDR 400), 5 PCI slots, 2-port Serial ATA interface, 6-channel audio codec, 24-bit S/PDIF, integrated 10/100Mb LAN, IEEE 1394, and USB 2.0 ports.

Conexant Systems announces HomePlug 1.0: 14 Mbps over electric main

Conexant Systems announced the certified HomePlug 1.0 router gateway for accessing local and global networks over wiring harness. Data transfer speed is claimed to make 14 Mbps.

Conexant HomePlug utilizes CX82100 HNP (home network processor) and CX11656 transceiver reference design.

In over 25,000-unit quantities HomePlug will cost $18.

Ceatec 2002: Philips announces micro DVD

At Ceatec 2002, that took place in Japan, Toshiba announced next-generation DVD discs, featuring 15GB single-sided, and 30, 40 GB double-sided. Laser read/write speed makes 36 Mbps. Toshiba DVD utilizes blue laser, emitting at 405 nm wavelength.

At the same time Hitachi, JVC, Matsushita, Pioneer, Philips, Sharp, Sony, supporting Blu-ray Disk, already announced their prototypes. Philips presented the most interesting product: 30-mm disc, providing up to 1GB capacity. The drive has 50x36x7 mm dimensions.

Source: EE Times

ARM1136J-S and ARM1136JF-S: two new ARM11 cores

Yesterday at Microprocessor Forum English ARM announced two new ARM1136J-S and ARM1136JF-S processor cores. The new chips are the first products with ARM11 processor architecture, first announced in April at Embedded Processor Forum. Both support ARMv6 instruction set.

Besides, ARM announced the new ARM11 PrimeXsys platform, based on mentioned ARM11 chips.

ARM1136J-S and ARM1136JF-S are designed for a wide variety of consumer electronics, wireless, comm devices: consoles, digital cameras, 2.5/3G mobiles, VoIP tools, broadband modems, WLAN access points, etc.

New ARM11 chips, already offered for licensing, feature 533 MHz and higher clocks and will be made using 0.13-micron process technology. Their performance is estimated 600 Dhrystone MIPs (w/o optimizations) at up to 200 mW power consumption. Typical power consumption of 0.13-micron ARM1136J-S and ARM1136JF-S at 400 MHz, 1V voltage makes 160 mW.

Chips feature 8-stage pipeline with 2-cycle cache, enabling to raise clocks in the future. Both feature flexible high-performance memory engine with programmable instruction set, data cache, and TCM DMA memory for realtime data processing. Memory management unit (MMU) is supported by Microsoft, Symbian, WindRiver, and Linux. Chips feature four 64-bit ports, connected to the memory controller, support 32-bit DDR, and feature 32-bit peripheral bus.

The letter F in ARM1136JF-S marking means built-in floating-point coprocessor. Both cores support ARM Jazelle extensions for faster Java processing, and ARM "E" extensions for DSP optimization. Both cores are supported by ARM RealView, featuring RealView Compilation Tools, RealView Debugger, Multi-ICE, RealView ICE, and RealViewTrace.

The new ARM11 PrimeXsys Platform includes developer tools for infrastructure development and verification with 64/32-bit bus, DDR, SDRAM, ROM, flash, and sync flash support; ARM MBX HR-S and MBX R-S 3D-graphics core support, Windows CE .NET, Symbian OS 7.0, and VxWorks binary level support.

Sony announces new 3.8-inch LCD panel with integrated electronics

Sony announced the development of 3.8-inch LCD, based on low-temperature polycrystal silicon, with all the electronic circuitry integrated into the screen. Now amplitude level generators, timers, interface RGB chip, and voltage stabilizer are located inside the glass substrate. Naturally, this reduces price cost due to fewer chips and enables to produce more low-power and compact panels.

Brief specifications:

  • LCD: 6-bit color composite, low-temperature polycrystal silicon
  • Image size: 96.9 mm (3.82 inch)
  • Size: 320x480 pixels (Half-VGA)
  • Pixel size: 56 (horizontal) x 168 (vertical) micron
  • Colors amount: 262,144
  • Interface: 45-pin
  • Bus width: 18-bit
  • Voltage: 6.5V, 3.3V, —3.3V
  • Power consumption: 110 mW

The company plans to launch the volume production in January 2003.

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