IBM PowerPC roadmap. Details are to follow after processors are announced.
IBM is expected to announce the first 64-bit PowerPC. Featuring 1.8 GHz clock and supporting Altivec instructions for multimedia data processing and operation in up to 16-unit systems, it will become the base for new Apple Macintosh computers, that might appear in the market late next year.
Besides, NEC Electronics this week is to announce 64-bit MIPS processor, positioned as a system-on-chip core. Tensilica Inc. will describe architecture, incorporating user-defined 64-bit instructions for better parallelism, though featuring the same 32-bit core architecture.
PowerPC 970 32/64-bit architecture is realized rather simply: a special instruction flag enables 32-bit mode and upper instruction and data bits are ingnored. Both 32/64-bit modes feature 8 instructions per cycle. Besides, all 32-bit PowerPC specifications have remained the same.
Source: EE Times
Introducing you its brief specifications:
Legend QDI announced two Platinix 2E/333 and Platinix 8/333 mobos, based on i845PE/845GE, respectively, supporting DDR333 and Hyper-Threading.
PlatiniX 2E/333 features ATX design and Intel 82845PE MCH + Intel 82801DB ICH4 bundle. It has AGP 4È slot, 6 PCI slots, 2 DIMM sockets (up to 2GB DDR 266/333), 6 USB2.0 ports, 5.1-channel AC´97 codec (only P2E/333-6A).
PlatiniX 8/333 differs by Intel 82845GE(MCH) + Intel 82801DB(ICH4) bundle, implying Intel Extreme graphics.
Both support QDI´s Hyper-Threading Detector, SpeedEasy II, LogoEasy II ,RecoveryEasy II, BIOS-ProtectEasy, BootEasy, StepEasy II, BootEasy, Hardware Doctor. Optionally board may feature 10/100 Mbps LAN (P2E/333-L and P8/333-L) and 1GbE LAN (P2E/333-K and P8/333-K).
Thunder K7X Pro specifications:
Intel announced new Xscale processors and flash memories. New chips are based on system-in-a-package (SIP) technology, in its turn, based on multi-level-cell (MLC) packaging.
Before the end of 2002 the company is to present fully integrated Manitoba chip, including flash memory, DSP, and XScale PXA core. Today Intel announced two new PXA261 and PXA262 processors, featuring XScale PXA250 RISC core and Intel StrataFlash memory. Intel´s first SIP products feature chip-scale package (CSP) of 13x13x1 mm dimensions. Intel PXA261, featuring 200 MHz XScale PXA250 and 16MB flash memory, will cost $36.10 in over 10,000-unit quantities. Intel PXA262, featuring 200 or 300 MHz core and 32MB flash memory will cost $54.60 and $62.60, respectively.
Besides, the company announced new 1.8V StrataFlash Wireless Memory samples, made using 0.13-micron process technology (such memory is used in new integrated Xscale processors). The previous StrataFlash generation required 3.3V voltage and was made using 0.18-micron process. New 64, 128, and 256 Mbit StrataFlash are to appear in the market in Q2 2003. 128 Mbit samples are available now for $17.75 in over 10,000-unit quantities. 64 Mbit and 256 Mbit chips are to appear early in 2003.
Pricing is unavailable yet. Shipments might start after November 4...
The new chip dissipates nominal of 3.4W, up to 4.2W. It´s designed for working together with Intel RadiSys 82600 chipset, base for RadiSys EPC-6315 mobo for embedded systems. The chip can also be used with Intel 440MX and Intel 815E systems.
New 400 MHz Ultra Low Voltage Celeron features 256 Kb L2 cache, supports 100 MHz FSB, and is made using 0.13-micron process technology in ÞFCBGA package. Core voltage makes 0.95V, temperature range is 0°C to +1000°C.NEC-Mitsubishi Electronics Display of America announced significant price cut for the NEC MultiSync LCD line, touching 15-, 17-, 18-, 19-, and 21-inch models.
NVIDIA announced new NVIDIA GeForce4 460 Go mobile GPU.
GeForce4 460 Go is mainly designed for thin, light notebooks with a balance of performance and energy consumption. GeForce4 460 Go memory controller bandwidth is up to 8 GB/s at up to 1 billion texel/s performance and 250 MHz clock. Using NVIDIA PowerMizer, GeForce4 460 Go features one of the industry best performance/W ratios.
Toshiba was the first to announce GeForce4 460 Go solutions, having presented Satellite 5205-S703 notebook line.
The board features ATX design, and bases on NVIDIA nForce2 SPP + MCP2-T chipset bundle. It supports Socket A Duron/Athlon/Athlon XP with 200/266/333 MHz FSB, has AGP 8È slot, 3 DIMM sockets (up to 3GB DDR 200/266/333 or up to 2GB (in two sockets) DDR 400), 5 PCI slots, 2-port Serial ATA interface, 6-channel audio codec, 24-bit S/PDIF, integrated 10/100Mb LAN, IEEE 1394, and USB 2.0 ports.
Conexant HomePlug utilizes CX82100 HNP (home network processor) and CX11656 transceiver reference design.
At the same time Hitachi, JVC, Matsushita, Pioneer, Philips, Sharp, Sony, supporting Blu-ray Disk, already announced their prototypes. Philips presented the most interesting product: 30-mm disc, providing up to 1GB capacity. The drive has 50x36x7 mm dimensions.
Source: EE Times
Besides, ARM announced the new ARM11 PrimeXsys platform, based on mentioned ARM11 chips.
ARM1136J-S and ARM1136JF-S are designed for a wide variety of consumer electronics, wireless, comm devices: consoles, digital cameras, 2.5/3G mobiles, VoIP tools, broadband modems, WLAN access points, etc.
New ARM11 chips, already offered for licensing, feature 533 MHz and higher clocks and will be made using 0.13-micron process technology. Their performance is estimated 600 Dhrystone MIPs (w/o optimizations) at up to 200 mW power consumption. Typical power consumption of 0.13-micron ARM1136J-S and ARM1136JF-S at 400 MHz, 1V voltage makes 160 mW.
Chips feature 8-stage pipeline with 2-cycle cache, enabling to raise clocks in the future. Both feature flexible high-performance memory engine with programmable instruction set, data cache, and TCM DMA memory for realtime data processing. Memory management unit (MMU) is supported by Microsoft, Symbian, WindRiver, and Linux. Chips feature four 64-bit ports, connected to the memory controller, support 32-bit DDR, and feature 32-bit peripheral bus.
The letter F in ARM1136JF-S marking means built-in floating-point coprocessor. Both cores support ARM Jazelle extensions for faster Java processing, and ARM "E" extensions for DSP optimization. Both cores are supported by ARM RealView, featuring RealView Compilation Tools, RealView Debugger, Multi-ICE, RealView ICE, and RealViewTrace.
The new ARM11 PrimeXsys Platform includes developer tools for infrastructure development and verification with 64/32-bit bus, DDR, SDRAM, ROM, flash, and sync flash support; ARM MBX HR-S and MBX R-S 3D-graphics core support, Windows CE .NET, Symbian OS 7.0, and VxWorks binary level support.
The company plans to launch the volume production in January 2003.
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