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Intel Corporation today announced expanded offerings for embedded market segments with new processors with extended, 7-year life cycle support, a new chipset and a carrier-grade server. The processors, based on Intel's high-k, metal gate transistor formula and manufactured on the company's 45-nanometer (nm) process, include the Quad-Core Intel Xeon processor 5400 Series and Dual-Core Intel Xeon processor 5200 Series.
These new processors, coupled with the new power-optimized Intel 5100 Memory Controller Hub (MCH) chipset, comprise the first 45nm CPU platforms for thermally constrained bladed applications. When using the Intel 5000P chipset, the 45nm processors are ideal for full-performance and memory-intensive applications such as storage, routers, security and medical solutions, as well as communications applications such as IP Multimedia Subsystems (IMS).
The processors take advantage of Intel's Hafnium-based, high-k metal gate transistor formula, which reduces power consumption, increases switching speed and significantly increases transistor density over the company's previous 65nm manufacturing technology. These 45nm CPU-based platforms, based on the Intel 5100 MCH chipset, are well-suited for 200 watt maximum power envelope specifications such as AdvancedTCA and also for NEBS Level-3 requirements.
Intel is offering extended lifecycle support for 7 years for the Dual-Core Intel Xeon processor 5200 series (E5240, E5220, L5238) and the Quad-Core Intel Xeon processor 5400 series (E5440 and L5408). This represents an expansion from previous minimum support of 5 years.
Intel also announced enhancements for the Intel Carrier Grade Server TIGW1U, Intel IP Network Server NSW1U and Intel IP Network Server NSC2U. These communication rack-mount servers now support the Quad-Core Intel Xeon processor 5400 Series and are well-suited for telco and network applications in harsh environments with NEBS Level-3 requirements that demand high performance, energy efficiency and high I/O throughput.
The 45nm processors with extended lifecycle support are available today, and prices range from $321 to $690. The dual-core Intel Xeon processor L5238 at 35 watts will be available in April. The Intel 5100 MCH chipset is available today, starting at $76.
Source: Intel Corporation
ASUS released the new Rampage Formula motherboard that features the innovative Pin-Fin Thermal Module for more efficient cooling. Additionally, the CPU Level Up overclocking technology lets users obtain flexible CPU overclocking easily even without prior overclocking knowledge.
The new Pin-Fin thermal design breaks the "Boundary-layer" phenomenon for effective airflows and results in better overall thermal performance when compared with traditional stacked-fin heatpipe solutions. It also features an enlarged "heat-exchange" surface area enabling more efficient heat dissipation. This new thermal design is also claimed to be able to lower system temperatures at a lower fan speed for reduced noise, providing a quieter environment.
The aforementioned CPU Level Up feature allows users to upgrade CPU performances without prior overclocking knowledge. Simply pick the processor you need, and the motherboard will do the rest. In just 3 easy steps (entering BIOS -> choosing the CPU Level Up -> reboot), this handy feature will allow you to achieve higher levels of performance.
ASUS announced the new release of 3,200 sets of limited-edition Triton 79 AMAzing CPU coolers. The name AMAzing represents achievements of this flagship cooler in terms of performance, stylish outlook and packaging. Made just for this limited-edition package, every component is protected by Polyurethane foam plastic; and each owner of the ASUS Triton 79 AMAzing will have an exclusive identification card marked with a limited-edition serial number.
The Triton 79 AMAzing is able to support Intel Core 2 Extreme / Core 2 Quad Quad-Core CPUs (LGA775) and AMD Athlon 64 FX/X2 Dual-Core processors (939/940/AM2/AM2+/1207+).
The Triton 79 AMAzing incorporates a nickel-plating copper base, 4 copper heat pipes and aluminum fins. Additionally, the cooler incorporates a PWM function 12cm fan that automatically modulates fan speeds according to the CPU temperature and delivers quiet cooling at 18dBA.
The voltage regulation shield inside the cooler directs airflow created by the 12cm LED fan to surrounding VRM (voltage regulation modules) that are critical to processor operations and overall system reliability. This design effectively reduces VRM temperatures by 10-15°C for smooth and stable operations.
The original assembly with specially designed push pins and clips make fastening the cooler even easier than ever before. The Triton 79 AMAzing can also be easily installed in 2 steps without removing the motherboard from the system.
Specifications (product page):
AMD, working together with its research partner, IBM, announced it has produced a working test chip utilizing Extreme Ultra-Violet (EUV) lithography for the critical first layer of metal connections across the entire chip. Previous projects utilizing EUV to produce working chip components were only "narrow field", covering just a very small portion of the design.
Lithography is how highly complex chip designs with millions of transistors, like microprocessors, are transferred onto the silicon wafer for the many layers required to build a chip. As chip designers continue to add functions and increase the performance of their products, making the transistors smaller and smaller makes more transistors available within a given area. How small transistors and the metal lines that connect them can be made is directly related to the wavelength of light that is used to project a chip design onto a wafer. EUV lithography uses a wavelength of 13.5 nm, significantly shorter than today's 193 nm lithography techniques, allowing the traditional scaling of chip feature sizes to continue.
The AMD test chip first went through processing at AMD's Fab 36 in Dresden, Germany, using 193 nm immersion lithography. The test chip wafers were then shipped to IBM's Research Facility at the College of Nanoscale Science and Engineering (CNSE) in Albany, New York where AMD, IBM and their partners used an ASML EUV lithography scanner installed in Albany through a partnership with ASML, IBM and CNSE, to pattern the first layer of metal interconnects between the transistors built in Germany. After patterning, etch and metal deposition processes, among others, the EUV device structures underwent electrical testing at AMD, with transistors showing characteristics very consistent with those of test chips built using only 193 nm immersion lithography. These wafers will receive additional metal interconnect layers using standard Fab processing so that large memory arrays can also be tested.
The next step in proving viability of the EUV lithography for production will be to apply it not only to metal interconnects but to all critical layers to show an entire working microprocessor can be made utilizing EUV lithography. EUV lithography will need to be fully qualified for production prior to 2016, when the 22 nm half-pitch node on the International Technology Roadmap for Semiconductors is expected to be reached.
Today, abit launches its latest "Multimedia Platform" motherboard, the I-G31. With the Intel G31 chipset, the abit I-G31 supports Intel Core 2 Extreme/Quad/Duo and Pentium Dual-Core processors. With Intel's integrated Graphics Media Accelerator (Intel GMA 3100), the abit I-G31 not only offers the Clear Video Technology but also supports DirectX 9.0, Shader Model 2.0 and OpenGL 1.4. The abit I-G31 is compatible with next generation 45nm processors allowing for up to 1333MHz FSB. The I-G31 also offers a D-Sub port and 5.1-channel HD audio codec.
The board supports abit EQ, a self-diagnostic system that monitors voltages, CPU and system fans speed, and CPU/system temperature.
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