ASUS Releases ROG Rampage Formula Gaming Motherboard

ASUS released the new Rampage Formula motherboard that features the innovative Pin-Fin Thermal Module for more efficient cooling. Additionally, the CPU Level Up overclocking technology lets users obtain flexible CPU overclocking easily even without prior overclocking knowledge.

The new Pin-Fin thermal design breaks the "Boundary-layer" phenomenon for effective airflows and results in better overall thermal performance when compared with traditional stacked-fin heatpipe solutions. It also features an enlarged "heat-exchange" surface area enabling more efficient heat dissipation. This new thermal design is also claimed to be able to lower system temperatures at a lower fan speed for reduced noise, providing a quieter environment.

The aforementioned CPU Level Up feature allows users to upgrade CPU performances without prior overclocking knowledge. Simply pick the processor you need, and the motherboard will do the rest. In just 3 easy steps (entering BIOS -> choosing the CPU Level Up -> reboot), this handy feature will allow you to achieve higher levels of performance.

Specifications (product page, complete specifications)

• Intel Quad-core CPU Ready,
• Supports Intel next generation 45nm Multi-core CPU,
• Intel Core 2 Extreme / Core 2 Duo Ready,
• Intel X48/ICH9R,
• Dual-channel DDR2 1200/1066 MHz Support,
• Pin-Fin Thermal Module Design,
• CPU Level Up,
• SupremeFX II 8-CH Audio,
• 2-Phase DDR2,
• LCD Poster,
• ASUS EPU (Energy Processing Unit),
• Voltiminder LED,
• COP EX.

Source: ASUS

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