Super Talent Technology today announced new DDR2-800 Fully Buffered DIMMs that are 100% compliant with JEDEC specifications. These two 800MHz FB-DIMMs are shipping now:
T800FB1G has passed qualifications on Supermicro server motherboards in Super Talent's Compatibility Labs, and T800FB1GAP has passed testing at Apple Validation Labs. These modules are built in Super Talent's ISO 9001 certified Silicon Valley factory, and every single module is twice tested before shipping. All Super Talent DRAM modules are backed with a lifetime warranty. OEM pricing on both products is approximately $50.
Source: Super Talent Technology
Texas Instruments Incorporated announced at the TI Developer Conference (TIDC) the availability of four new OMAP processors, based on the market's first broad offering of the ARM CortexTM-A8 core, providing a combination of laptop-like performance at handheld power levels in a single chip. With more than four times the processing power of today's 300 MHz ARM9 devices, the superscalar Cortex-A8 core runs up to 600 MHz and is integrated into four new OMAP35x applications processors for a wide range of possible applications, including portable navigation devices, Internet appliances and portable patient monitoring devices.
The new OMAP35x devices extend TI's wireless handset technology to mainstream customers reaching new markets, such as automotive, consumer, embedded and medical. The integrated, single-chip devices combine photo-realistic graphics and TI's advanced video DSP technology.
TI's OMAP35x generation of devices consists of four distinct single-chip processors: OMAP3503, OMAP3515, OMAP3525 and OMAP3530. These processors offer a variety of combinations of the Cortex-A8 core, multimedia-rich peripherals, OpenGL ES 2.0 compatible graphics engine, video accelerators and TMS320C64x+ DSP core. TI's DaVinci software technology for video-centric customers will be available in the OMAP3525 and the OMAP3530. Development with the new OMAP35x devices will be supported by the TI Developer Network, which encompasses an ecosystem of more than 400 companies with expertise reaching from operating system implementation to application user interfaces. The applications processors also support 12MP still image capture and are pin-for-pin compatible to make it easy for OEMs to efficiently create a complete product portfolio based on the single platform. Software developed on previous generations of ARM devices and the C64x+ DSP are also compatible with the cores on the OMAP35x devices.
To make this level of performance even more appealing for embedded applications, OMAP35x processors provide the ability to run these applications in extremely power constrained environments. To achieve this power level, the OMAP35x devices integrated three aspects of technology. The device architecture leverages a multi-core design, so that each core is fully optimized for the tasks it is responsible for to maximize efficiencies. It is manufactured at 65 nanometer low-power process technology. And finally, it leverage TI's SmartReflex technology which dynamically controls voltage, frequency and power based on device activity, modes of operation, process technology and temperature variation.
The modular and extensible OMAP35x Evaluation Module (EVM) provides all the components needed to develop on the OMAP3503. It includes a complementary, integrated power management and analog solution specifically for OMAP35x devices as well as the flexibility to incorporate application-specific daughter cards and support Linux and Windows Embedded CE developers. OMAP35x EVM offers OMAP3503 Linux board support package based on the 2.6.22 kernel, in addition to peripheral drivers, U-boot for boot loading and a Busybox based root file system. A Windows CE 6.0R2 BSP will also be available for developers. Designers can order the OMAP35x EVM today for $1495.
The OMAP3503 ($25.95 each in 100u) is available in two packages. The OMAP3503 in 0.4mm pitch can be ordered today and will ship within four weeks. The 0.65mm pitch version of the OMAP3503 will be available in 2Q08. The other three devices (OMAP3515, OMAP3525 and OMAP3530) will be available with complete development tools in the second half of 2008.
Source: Texas Instruments Incorporated
Toshiba Corporation today announced new 1.8-inch SATA hard disk drives: the MK1216GSG offers a storage capacity of 120GB, while the MK8016GSG has a capacity of 80GB. Mass production of both drives will start in April.
These are the first Toshiba 1.8-inch HDD to employ a serial ATA interface, which boosts data transfer rates beyond those achieved by the parallel ATA interface, and also offer a rotation speed of 5,400 rpm, 29% faster than the current generation of Toshiba HDD. Higher rotation speeds support faster data access in reading and writing and enhance overall drive performance.
The new drives contribute to achievement of environmentally conscious products, thanks to near silent operation and low energy consumption, and full compliance with the EU RoHS directive.
Source: Toshiba Corporation
SMART Modular Technologies yesterday announced its first cost-effective 8GB dual-rank PC2-4200 registered DIMM (RDIMM), featuring SMART's advanced packaging technologies and the MetaSDRAM chipset from MetaRAM. Designed for use in high-end servers, SMART's new RDIMM doubles available storage capacity, while significantly lowering cost compared to traditional dual-rank modules, and improving system performance by lowering power consumption with use of a four-rank module solution.
The new module combines SMART's advanced DDR2 packaging technologies with the MetaRAM chipset architecture, enabling servers to replace the functionality found in modules built with more expensive components. For example, SMART's 8GB RDIMM doubles the maximum memory capacity from 128GB to 256GB on AMD Barcelona-based 32-slot motherboards for high performance computing (HPC) and server applications. Also well suited for embedded computing, the SMART RDIMM provides up to 32GB of total capacity on the San Clemente-based, Cranberry Lake 4-slot small form factor platform offered by Intel. Using conventional modules today to achieve these system densities would be impractical because of increased cost and power consumption and degradation of system performance due to excessive module bus loading.
Source: SMART Modular Technologies
Lexar Media today announced the immediate availability of Special Edition Crucial Ballistix Tracer Red 2GB DDR2-800 memory modules. The new modules feature two rows of red activity-indicating LEDs, red ground-effects LEDs, and a red printed circuit board stylishly covered with a red heat spreader with a raised, diamond-cut logo and clip-less design.
Crucial Ballistix Tracer Red memory modules offer latency timings of 4-4-4-12 and are available immediately in 2GB modules and 4GB kits in Europe. Product availability in the U.S. is expected in Q2 2008.
Source: Micron Technology
Lenovo today unveiled its ThinkPad X300 notebook PC designed for today's most demanding road warriors and claimed to be the thinnest and lightest full-function notebook in its class. The ultra-thin, ultraportable ThinkPad X300 notebook measures less than three-fourths of an inch at its thinnest point, or approximately the height of a U.S. quarter coin, and has a starting weight as low as 2.9 pounds.
The ThinkPad X300 combines a number of innovations such as solid-state drive storage, a LED backlit display, ultralong battery life and enhanced wireless connectivity. Rated Gold by the Electronic Product Environmental Assessment Tool (EPEAT) for its environmental attributes, it also features a number of environmentally-conscious technologies, such as low-voltage processors.
The ThinkPad X300 notebook PC offers models that can be configured for extreme portability starting at just 2.9 pounds, or maximum battery life of up to 10 hours or a balance between the two with a built-in DVD burner.
The ThinkPad X300 notebook starts at approximately $2,799. It is available immediately through Lenovo business partners and www.lenovo.com.
Hynix Semiconductor announced today the launch of 2-Rank 8GB PC2-4200 RDIMM, featuring MetaRAM's MetaSDRAM technology. The HYMP31GP72CUP4-C6 effectively doubles the memory capacity of AMD Opteron-based and Intel Xeon-based systems, while lowering power consumption by up to 30% when compared to industry standard 8GB 4-Rank or 4GB 2-Rank modules.
The MetaRam technology allows the use of mainstream lower cost DRAM components in the manufacture of the next generation high density DIMMs, without increasing the number of memory ranks or the load on the CPU. The 8GB 2-Rank RDIMM is built with mainstream 1Gb DDR2 SDRAMs instead of the significantly more expensive 2Gb, thus lowering the cost of the module.
The MetaSDRAM chipset consists of flow controllers and an access manager which sit between the memory controller and the DRAM. It enables up to four times more mainstream DRAMs to be integrated into the DIMM without the need for any system level hardware or software changes. The chipset makes multiple DRAMs look like a larger capacity DRAM to the memory controller resulting in high capacity memory modules that circumvent the normal limitations of the memory controller.
The HYMP31GP72CUP4-C6 8GB DDR2 RDIMM is available now in production quantities. The 8GB DDR3 2-Rank RDIMM using the MetaRam technology is under development and will be available in production quantities in 2H'08.
Source: Hynix Semiconductor
Hitachi today announced volume shipment of new Travelstar 5K320 5,400 RPM notebook hard drives with a maximum available capacity of 320GB. The new drives feature optional Bulk Data Encryption (BDE) for users requiring increased data security and enhanced availability models designed for use in 24x7 environments.
The Travelstar 5K320 elevates the standard for hard drive reliability with design enhancements that include altitude-sensing Thermal Fly-height Control (TFC), an improved actuator latch and fourth generation perpendicular magnetic recording (PMR) head technology. The drives also include TrueTrack technology, which improves tracking accuracy in high shock or vibration environments. These features combine to deliver an industry-leading 400Gs of operating shock protection.
The Travelstar 5K320 drives consume 1.8W of power when reading and writing and their .55W low power idle means longer battery life for more "unplugged" notebook time and a longer drive life expectancy.
Hitachi will also offer an enhanced-availability (EA) version of the drive that is designed for applications requiring 24x7 operation in lower transaction environments, such as blade servers, network routers, point-of-sale terminals and video surveillance systems.
The Travelstar 5K320 is now shipping to customers worldwide. The enhanced-availability version of the drive is expected to ship in the second quarter of 2008.
ASUS today released the Z7S WS workstation motherboard. It is equipped with dual Socket 771 and utilizes the latest Intel 5400 chipset. It also supports fully buffered DDR2 800MHz dual-channel memory, dual PCI Express 2.0 x16 lanes; and comes in the compact CEB form factor.
The multiple slot interfaces increase expansion choices and allows users to obtain high data transmission speeds. The motherboard supports dual PCIe 2.0 x16 as well as PCI-X slots for more convenience on slot expansion.
The Z7S WS fits into the compact CEB form factor (12" x 10.5") allowing users to build up a small and compact but powerful dual CPU workstation systems.
More features include ASUS' heat-pipe solution, 7.1-channel MIO audio card, optional ASUS Patented MemCool Kit. The "extra" features include Q-Connector and ASUS' Q-Shield.
Apple today updated its popular MacBook and MacBook Pro notebook lines with the latest Intel Core 2 Duo processors, larger hard drives and 2GB of memory standard in most models. In addition, MacBook Pro includes the latest NVIDIA graphics processors, now with up to 512MB of video memory, and Apple's Multi-Touch trackpad, first introduced in MacBook Air. All Mac notebooks include a built-in iSight video camera for video conferencing on-the-go, Apple's MagSafe Power Adapter that safely disconnects when under strain and built-in 802.11n wireless networking.
The new MacBook Pro features the latest Intel Core 2 Duo technology with up to a 2.6 GHz processor with 6MB of shared L2 cache; up to 4GB of 667 MHz DDR2 SDRAM memory and up to a 300GB hard drive, plus NVIDIA GeForce 8600M GT graphics with up to 512MB of video memory. Every MacBook Pro now includes a trackpad with Multi-Touch gesture support for pinch, rotate and swipe, making it more intuitive than ever to zoom and rotate photos in iPhoto or Aperture 2 or browse web pages in Safari; an illuminated keyboard that makes it ideal for dimly lit environments such as airplanes, studios or conference halls and a built-in ambient light sensor, which automatically adjusts the brightness of the keys as well as the brightness of the display for optimal visibility.
Featuring a 13-inch glossy widescreen display, and with prices still starting at just $1,099, the new MacBook lineup comes in three models and includes faster processors and larger hard drives across the line; sleek white 2.1 GHz and 2.4 GHz models with 120GB or 160GB 5400 rpm hard drives and a black 2.4 GHz model with a massive 250GB 5400 rpm hard drive, previously only available as an option. The 2.4 GHz MacBook models ship with 2GB of memory standard, expandable up to 4GB across the line.
Every MacBook and MacBook Pro includes a built-in iSight video camera for video conferencing on-the-go; Apple's MagSafe Power Adapter that magnetically connects the power cord and safely disconnects when under strain; the latest generation of 802.11n wireless networking for up to five times the performance and twice the range of 802.11g; built-in 10/100/1000 BASE-T Gigabit Ethernet for high-speed networking; Bluetooth; analog and digital audio inputs and outputs; USB 2.0; FireWire and a built-in SuperDrive.
Every Mac in the Apple lineup comes with iLife '08, the most significant update ever to Apple's suite of digital lifestyle applications, featuring a major new version of iPhoto and a completely reinvented iMovie, both seamlessly integrated with the new .Mac Web Gallery for online photo and video sharing. Every Mac also includes Leopard, the sixth major release of the world's most advanced operating system which introduces Time Machine, an effortless way to automatically back up everything on a Mac; a redesigned Finder that lets users quickly browse and share files between multiple Macs; Quick Look, a new way to instantly see files without opening an application; Spaces, an intuitive new feature used to create groups of applications and instantly switch between them; a brand new desktop with Stacks, a new way to easily access files from the Dock and major enhancements to Mail and iChat. .Mac members can use the new Back to My Mac feature to browse and access files on their home computer from a Mac over the Internet while out on the road.
The new MacBook and MacBook Pro models are now shipping and will be available through the Apple Store (www.apple.com), Apple's retail stores and Apple Authorized Resellers.
The 2.1 GHz, 13-inch white MacBook, for a suggested retail price of $1,099 (US), includes:
The 2.4 GHz, 13-inch white MacBook, for a suggested retail price of $1,299 (US), includes:
The 2.4 GHz, 13-inch black MacBook, for a suggested retail price of $1,499 (US), includes:
Build-to-order options for the MacBook include the ability to upgrade to up to 4GB 667 MHz DDR2 SDRAM, a 160GB or 250GB hard drive, Apple USB Modem, Apple Mini-DVI to DVI adapter, Apple Mini-DVI to VGA adapter, Apple Remote, Apple MagSafe Airline Adapter and the AppleCare Protection Plan.
The 2.4 GHz, 15-inch MacBook Pro, for a suggested retail price of $1,999 (US), includes:
The 2.5 GHz, 15-inch MacBook Pro, for a suggested retail price of $2,499 (US), includes:
The 2.5 GHz, 17-inch MacBook Pro, for a suggested retail price of $2,799 (US), includes:
Build-to-order options for the MacBook Pro include the ability to upgrade to up to 4GB 667 MHz DDR2 SDRAM, a 2.6 GHz Intel Core 2 Duo processor, 200GB (7200 rpm), 250GB (5400 rpm) or a 300GB (4200 rpm) hard drive, Apple Remote, Apple MagSafe Airline Adapter, Apple USB Modem, glossy widescreen display, 17-inch LED-backlit 1920 x 1200 high-resolution display and the AppleCare Protection Plan.
Additional build-to-order options for both MacBook and MacBook Pro include pre-installed copies of iWork '08, Logic Express 8, Final Cut Express 4 and Aperture 2.
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