AOpen To Showcase MoDT Solutions For ICC 2006 3M Touch Systems Announces MicroTouch CT150 Touch Monitor Staktek Announces First ArctiCore Memory Module Utilizing 72 Standard Memory Components AOpen To Showcase MoDT Solutions For ICC 2006 AOpen is going to showcase a number of novelties at 2006 Intel Channel Conference (ICC). Primarily, attention is focused on MoDT (Mobile on Desktop) solutions - desktop machines on mobile processors. These will include XC Cube, MiniPC and ePC barebones as well as motherboards supporting single- and dual-core CPUs. So:
Source: AOpen
3M Touch Systems Announces MicroTouch CT150 Touch Monitor 3M Touch Systems announces availability of the new MicroTouch CT150 15" LCD touch screen monitor specifically designed for self-service and industrial applications. Key MicroTouch CT150 touch monitor features include:
The MicroTouch CT150 touch monitor joins a family of high performance MicroTouch monitor products, which include the MicroTouch 17" chassis touch monitor and the MicroTouch 15" M150 and 17" M170 desktop touch screen monitors. This product is available for shipment May 1, 2006. Source: 3M Touch Systems
Staktek Announces First ArctiCore Memory Module Utilizing 72 Standard Memory Components Staktek Holdings announced the first ArctiCore memory module that utilizes 72 standard memory devices in an industry-standard module form-factor. The new module, based on ArctiCore technology, is a Registered Dual In-Line Memory Module (RDIMM) designed for server and workstation applications. ArctiCore's proprietary high-density architecture enables placement of 72 cost-effective 512Mb memory devices on a module that meets the applicable JEDEC specifications for RDIMM dimensions. This mounting efficiency results in a total module capacity of 4GB of memory. With the memory structured in a 4-rank organization, many applications experience increased system performance when compared to a 2-rank memory module of the same capacity. Key specifications:
ArctiCore is a new module technology designed for improved thermal, mechanical and electrical performance in a variety of high-speed, high-performance electronics applications, including memory module packaging and FLASH-based memory cards. Utilizing a double-sided, multi-layer flexible circuit with embedded interconnect technology folded around a rigid thermal core, ArctiCore is claimed to increase the available area for mounting devices while enhancing thermal management, reliability and thinness compared to conventional module technologies. Licensing and manufacturing services for the 4GB, 4-rank ArctiCore module are now available to electronics OEMs, memory semiconductor companies and third-party memory module manufacturers. Source: Staktek Holdings
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