OCZ Technology launched shipments of new OCZ EL DDR PC-3500 Dual Channel Gold Unbuffered memory kits.
OCZ EL DDR PC-3500 Dual Channel Gold modules have 256Mb (PN-OCZ433256ELDCGE-K) and 512Mb (PN-OCZ433512ELDCGE-K) capacities and are shipped in 512Mb and 1Gb couples tested to work together. Modules are based on 434MHz chips with CL 2.5-3-3-7 and shielded PCBs. They support OCZ HyperSpeed technology and have gilded heatsinks. Featuring nominal voltage of 2.6V, modules are optimized for Intel i865/i875-based motherboards and are offered with lifetime warranty.
Leadtek Research unveiled WinFast DV2000 – a new multimedia centre for video processing.
WinFast DV2000 features IEEE1394 port and supports DirectBurn enabling to connect PC directly to DC/DV sources to record video directly to files. Besides, an add-in connector is bundled providing 2 x IEEE1394 ports more.
WinFast DV2000 features 10-bit video decoder; supports MTS/EIA-J/NICAM/A2, stereo sound, TV-Text, EPG (Electronic Program Guide), NetMeeting, PIP (Picture in picture), Time-Shifting, MPEG-1/2/4; and is bundled with a remote control.
At IDF Fall 2003 Intel introduced the technical details of Bulverde processor based on Xscale architecture to be used in mobile handsets, PDAs, etc.
The new chip will offer a number of new features providing wireless higher-quality image shooting and high-speed multimedia processing, and improving battery operation time. Bulverde is a key part of Intel PCA architecture – wireless design project with voice communications and Internet access features.
By this moment Intel has developed the Quick Capture interface enabling to connect image processing devices to mobile phones and PDAs to improve the visual quality and reduce digital imaging features implementation costs. Quick Capture enables to receive live video and higher-quality images from a wide array of handset and PDA camera sensors. Intel Quick Capture supports three operation modes: Quick View (real-time image preview with low energy consumption), Quick Shot (high-resolution (up to 4Mp) shooting) and Quick Video (hi-res full motion video recording.)
Bulverde will for the first time feature the Intel SpeedStep wireless technology for dynamic adjusting performance and energy consumption depending on the load. It will allow to reduce the energy consumption by 50%. Intel SpeedStep extends the capabilities of Intel Dynamic Voltage Management already implemented into Intel Xscale with three new modes: deep idle, standby and deep sleep. It is capable to immediately adjust voltage and clock speed intelligently switching between different low-power modes and saving energy and maintaining performance for apps that need it.
Bulverde will also feature the Wireless MMX instruction set based on Intel MMX set. This will enable software developers to port 2D and 3D games, MPEG4 streaming video, encryption and voice recognition systems as well as other apps to Intel´s mobile handset and PDA platform.
ARCHOS announced today the availability of the ARCDisk, the world´s smallest and lightest 20-gigabyte external hard drive. Also available in a 40GB drive, the ARCDisk costs one cent per megabyte - the lowest price for portable storage today. The ARCDisk is the latest advancement in ARCHOS´ extensive line of storage peripherals and is available for $249.95.
Seagate showcased a hard drive featuring 100Gb / 3.5" plate density. Thus the latest 200Gb 7200rpm Seagate Barracudas feature just 2 plates and support Parallel ATA (PATA) or Serial ATA (SATA) with NCQ (Native Command Queuing).
We received another portion of information from our Dmitry Korostelev from San Jose. Below is the first information about a new desktop processor:
Below are some more IDF hot news for today:
On the 1st IDF day ATI Technologies showcased its first PCI Express GPU.
For now all we have is ATI´s press release, but our Dmitry Korostelev should provide us more details from California.
Belkin introduced a product for first-person shooters enthusiasts Belkin Nostromo SpeedPad n52 – that functionally combines a keyboard and gamepad. In Northern America shipments should start on September 29 and the estimated price is $40.
Nostromo SpeedPad n52 features:
On the 1st IDF day PCMCIA group announced the final ExpressCard Version 1.0 specs for mobile and desktop PCs. Before our readers might have heard of it codenamed NEWCARD.
ExpressCard has been developed by the group of OEM hardware makers, including Dell, HP, IBM, Intel, Lexar Media, Microsoft, SCM Microsystems and Texas Instruments. The development has been conducted under the close partnership between PCMCIA, USB Implementers Forum (USB IF) and Peripheral Component Interconnect-Special Interest Group (PCI-SIG). Therefore ExpressCard also supports USB 2.0 and PCI-Express specs.
First products tested to comply ExpressCard Version 1.0 specs will be announced early in 2004 to arrive for sale in H2 2004.
Modules meeting ExpressCard specs will be made in two form-factors – 34mm and 54mm wide. At that both will have 75mm length and 5mm thickness. Host systems will be supporting both. Wider solutions will be provided because there are similar devices for CardBus sockets like Compact Flash and 1.8" media.
We obtained new and still more unique exhibits for our Museum Apple Power Macintosh 7100/80AV from far 1994. But not 700Mb Quantum SCSI hard drive, not the ancient MacOS 8.0, not the trackball plugged via the keyboard is what surprises me. The most wonderful thing is this system works perfectly! We succeeded to run the machine using the special adapter bundled with a ViewSonic monitor.
P.S. Looking at perfectly working rarities and listening to cries about modern hardware problems I wonder if long ago computers were better or makers more professional? Or maybe both? ;-)
Äìèòðèé Êîðîñòåëåâ, who is now at IDF Fall 2003, reported us the real sensation:
Elpida Memory, Inc (Elpida) announced the availability of its 1 Gigabyte and 512 Megabyte DDR2 registered dual in-line memory modules (DIMMs) intended to provide high-speed, low-power benefits and improved thermal performance to the server market. Intel has successfully booted Elpida´s new DIMMs in a server platform based on the next-generation chipset code named ´Lindenhurst.´ DDR2 registered DIMMs currently have the highest bandwidth and lowest power consumption available for Intel Architecture (IA)-based servers.
Elpida´s 1 Gigabyte and 512 Megabyte DDR2 registered DIMMs (Part numbers: EBE10RD4ABFA and EBE51RD8ABFA respectively) deliver 3.2 Gigabytes per second (PC2-3200) or 6.4 Gigabytes per second with a dual channel configuration. This is the highest memory bandwidth available for the server platform today. Also, with 1.8 V operation, these DIMMs reduce power consumption by more than 50 percent over the previous DDR architecture.
The modules are comprised of eighteen (nine for the 512 Megabyte DIMM) high-speed 512 Megabit DDR2 SDRAM components in FBGA packages. Elpida´s DIMMs are JEDEC-standard 240-pin (133.25milimeters (mm) wide x 30.00mm high) the same area used on current DDR modules on motherboards and they feature On-Die Termination (ODT) and Off-Chip Driver (OCD) Calibration to improve signal quality as well as system performance and reliability.
Hynix Semiconductor, Inc. announced it has submitted 512Mb DDR2 SDRAM devices to Intel Corporation for evaluation and its samples are successfully booting with Intel´s next generation dual processor server chipset code named ‘Lindenhurst.’ The Hynix 512Mb DDR2 SDRAM is currently available in sample quantities with mass production scheduled for early 2004. The Hynix 512Mb DDR2 SDRAM evaluation for validation by Intel follows its 512Mb DDR400 validation in June of 2003 and further demonstrates the Hynix leadership position in the high-speed DDR memory market.
The Hynix 512Mb DDR2 SDRAM devices are designed and manufactured on the company’s advanced .11-micron Golden Chip process technology. The devices being developed can operate at a data transfer rate of up to 667 (Mbps) per pin at 1.8 V and are offered in 128M x 4 bits, 64M x 8 bits, and 32M x 16 bits configurations in a FBGA package and fully comply with JEDEC DDR2 specifications and standards.
Kingston Technology Company, Inc. introduced Hi-Speed USB memory to its digital media product line, DataTraveler 2.0. The DataTraveler 2.0 is Kingston´s first Hi-Speed USB memory solution and is immediately available in 128MB, 256MB, 512MB and 1GB capacities. The devices are rather small 3.9 inches x .944 inches x .945 inches. According to the company, data is password protected with Kingston´s custom software, TravelerSafe.The Hi-Speed USB memory device operates with the latest operating systems supporting USB interface 2.0 (drivers included for Windows 98).
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