Infineon Introduces New Digital Cordless Phone Solution

Infineon Technologies today announced the availability of a new chipset for Digital Cordless Phones. Infineon also announced that it will integrate the digital and RF functionalities of the chipset to produce a single-chip DECT solution that will provide customers with a competitive and flexible platform for next generation DECT phones now being defined by international standards organizations.

The new chipset incorporates the Infineon Step8 DECT baseband controller manufactured on a 0.13µm CMOS process and supporting all DECT frequencies. The feature set includes polyphonic ringing, color display support and I2C, JTAG and SPI Interfaces. The Step8 also includes all necessary software, including an API. Engineering samples of different variants adapted to various applications are already available and volume production will start in Q3/2006. The Step8 is used along with a Radio Frequency transceiver and power amplifier.

Concurrently, Infineon unveiled the development of its first single-chip DECT solution that will integrate the baseband, transceiver, and power amplifier - COSIC (COrdless SIngle Chip). COSIC reduces the number of components required for a DECT system (base station and handset) up to 50 percent, with a concurrent reduction in production cost estimated at 40 percent. Engineering samples of the COSIC will be available in Q4 2006, with volume production planned in Q3 2007.

Source: Infineon Technologies

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