Seagate Expands Desktop Hard Drive Series With 750GB Monster

MSI Announces Intel Core Duo Based Server Solutions

Infineon Introduces New Digital Cordless Phone Solution

Seagate Expands Desktop Hard Drive Series With 750GB Monster

Seagate Technology finally unveiled its first 750GB hard drive of which we wrote some time ago. The monster drive is part of the new Barracuda 7200.10 family built on perpendicular recording technology and is designed for desktop computers and low-end servers.

The perpendicular recording technology stands data bits vertically onto the disc media, rather than horizontal to the surface as with traditional longitudinal recording. The new data orientation also increases drive throughput without increasing spin speed by allowing more data bits to pass under the drive head in the same amount of time.

Barracuda 7200.10 also features cache sizes from 8MB to 16MB and 1.5Gb/s and 3.0Gb/s Serial ATA data transfer rates with Native Command Queuing. NCQ enhances reliability in heavy workloads by reducing head movement and streamlining the delivery of queued commands to the drive.

The novelty also offers:

• Adaptive Fly Height - Maximizes the consistency of read/write performance across the entire disc by adjusting the fly height (distance between the disc head and platter) according to changes in environmental operating conditions.
• Clean Sweep - Helps maintain media integrity and drive reliability by passing the drive head over the entire platter during power-on to smooth out any irregularities in the disc surface.

The new Barracuda 7200.10 family is now shipping to the worldwide distribution channel.

Source: Seagate Technology

MSI Announces Intel Core Duo Based Server Solutions

Micro-Star International introduces new 1U entry server solutions catered to enterprise customers. MSI PM-102A rackmount server supports Intel Core Duo/Core Solo mobile processors and has 2 DIMM slots available for up to 4GB of DDR2-667 memory. It also integrates PCI-E x8 and x4 slot, and dual Gigabit LAN. PM-102A is also equipped with two external hotswap Serial ATA hard disk drives.

The 945GT Speedster-A4R board, in its turn, has the following features:

• Supports Intel Core Duo, Core Solo, Celeron M Processors
• Supports FSB 533/667 MHz
• Features Intel 945GT + ICH7R chipset
• Supports DDR2-533/667 SDRAM (4GB Max.)
• 1 x PCI Express x16, 1 x PCI Express x4, 2 x PCI
• 1 x IDE by ICH7R, supports UDMA 66/100, PIO, Bus Master
• 4 x SATA II by ICH7R, RAID 0/1/0+1/5
• PS/2 mouse and keyboard
• 2 x RJ45 Gigabit LAN
• 1 x IEEE 1394 port
• 4 x USB 2.0 Ports
• 1 x DVI + VGA connector
• 1 x S-Video + RCA connector
• 1 x 7.1 channel Audio connector
• 1 IrDA pinheader
• 2 USB 2.0 pinheaders
• 1 IEEE 1394 pinheaders
• 2 x PCI Express LAN GB Ethernet by 2 x Intel 82573L
• Realtek ALC880 7.1 channel audio with jack sensing
• Micro ATX Form Factor (24.4cm X 24.4 cm)

Source: Micro-Star International

Infineon Introduces New Digital Cordless Phone Solution

Infineon Technologies today announced the availability of a new chipset for Digital Cordless Phones. Infineon also announced that it will integrate the digital and RF functionalities of the chipset to produce a single-chip DECT solution that will provide customers with a competitive and flexible platform for next generation DECT phones now being defined by international standards organizations.

The new chipset incorporates the Infineon Step8 DECT baseband controller manufactured on a 0.13µm CMOS process and supporting all DECT frequencies. The feature set includes polyphonic ringing, color display support and I2C, JTAG and SPI Interfaces. The Step8 also includes all necessary software, including an API. Engineering samples of different variants adapted to various applications are already available and volume production will start in Q3/2006. The Step8 is used along with a Radio Frequency transceiver and power amplifier.

Concurrently, Infineon unveiled the development of its first single-chip DECT solution that will integrate the baseband, transceiver, and power amplifier - COSIC (COrdless SIngle Chip). COSIC reduces the number of components required for a DECT system (base station and handset) up to 50 percent, with a concurrent reduction in production cost estimated at 40 percent. Engineering samples of the COSIC will be available in Q4 2006, with volume production planned in Q3 2007.

Source: Infineon Technologies

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