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Foxconn Presents X79-Based Quantumian 1

AOpen Announces New Digital Engine DE35-HD Media Player

SiliconBlue Samples New 'Los Angeles' 40-nm Ultra-Low-Power 640, 1K and 4K LP and HX Devices

Thermaltake Adds Contac 39 and Contac 30 to the Series



Foxconn Presents X79-Based Quantumian 1

Foxconn added another motherboard to its Quantum Force series that is aimed at highest-performance rigs. So, Quantumian 1 is based on the Intel X79 single chipset and supports Intel Sandy Bridge-E series processors and quad-channel DDR3 up to 2400 MHz. Circuitry features solid capacitors, ferrite chokes.



Specifications:

  • Supports Intel Core SandyBridge-E Processors (LGA 2011)
  • Supports Intel Turbo Boost and Hyper-Threading
  • Intel X79 chipset
  • 4 x DIMM sockets, Max 32GB, Quad-Channel DDR3-2400(oc)/2133(oc)/1800(oc)/1600
  • 4 x PCIe 2.0 x16 (x16+x8+x16/x8+x8), PCIe 2.0 x1, PCI, supports ATI CrossFireX & NVIDIA SLI
  • 4 x SATA 2.0, 4 x SATA 3.0, 2 x eSATA 2.0
  • 7.1 channel HD audio, coaxial and optical S/PDIF-Out
  • Dual Gigabit Ethernet
  • 10 x USB 2.0, 4 x USB 3.0
  • ATX form factor

Source: Foxconn


AOpen Announces New Digital Engine DE35-HD Media Player

AOpen Europe announced a new Digital Engine DE35-HD, a cost-effective media player with good graphics capabilities, designed for digital signage. It is the first AMD-based media player in the AOpen's assortment.



DE35-HD main features:

  • AMD G Series dual-core CPU T56N, 1.6GHz, 18W TDP
  • AMD Radeon HD 6310 graphics
  • Full HD 1080 content playback
  • Multi-display support via Displayport (1 to 4)
  • Up to 8GB of DDR3-800/1066 MHz memory
  • uSFF form-factor, 166 x 157 x 48 mm
  • Support for one 2.5-inch SATA 3.0 HDD
  • USB 3.0, DVI, VGA, Displayport, COM port, LAN


It's actually qualified as a 'semi-industrial' media player, and I see no reasons why you cannot use it at home.

Source: AOpen Europe


SiliconBlue Samples New 'Los Angeles' 40-nm Ultra-Low-Power 640, 1K and 4K LP and HX Devices

SiliconBlue Technologies announced sampling availability of three new iCE40 'Los Angeles' 640, 1K and 4K mobileFPGA devices including the LP Series (Low-Power) version and the HX Series (High-Speed) version targeting smartphones and tablets, respectively. Both the LP and HX Los Angeles mobileFPGA devices provide support for sensor management, high-speed custom connectivity and the convergence of HD video and imaging. Fabricated on TSMC 40-nm, low-power standard CMOS process, the LP and HX families provide twice the logic capacity of previous 65-nm devices.



The ultra-low-power Los Angeles LP640, LP1K and the LP4K CMDs are the ideal application processor companion chips optimized for smartphone applications delivering the lowest power in the smallest package. Addressing the vast array of design requirements for mobile products, the LP series is available in six packages starting with the world's smallest 0.4mm 2.5x2.5 plastic BGA, also including 3x3mm, 4x4mm up to 7x7mm. The Los Angeles HX640, HX1K and HX4K high-speed versions are designed to address the low-power, low-cost requirements for tablet applications. These are available in a variety of package types beginning with the CM225, CB132, CT256, VQ100 and TQ144 which enable minimum PCB interconnect layers, saving manufacturing costs.



The Los Angeles iCE40LP mobileFPGA series is available in sampling quantities today in six BGA package styles. Sampling quantities of the iCE40HX mobileFPGA series is also available today in five package styles including BGA, TQFP and VQFP. Smallest package devices start at under $1 USD in high volume. Full production of the 640, 1K, 4K and 8K devices will be announced in December 2011. For a chart of package styles and device specs, click here. iCEcube2 version 2011.09 software support is available now for the 640, 1K, 4K and 8K devices.

Source: SiliconBlue Technologies


Thermaltake Adds Contac 39 and Contac 30 to the Series

Contac 39 and Contac 30 CPU coolers feature dual and single fans with blue LEDs as well as improved curved aluminum heatsink fins. They come with a new designed multifunctional mount for all Intel and AMD processors (that is, LGA 2011/1366/1155/1156/775 and FM1/AM3+/AM3/AM2+/AM2), including the newest socket LGA 2011 for Intel Sandy Bridge-E CPUs.

Each novelty has 3 x 8mm heatpipes and low-noise 120mm PWM fans ranging in speed from 800 to 2000 rpm. Also there are anti-vibration soft mounts (pictured below) to simplify installation and removal and decrease working noise.



Contac 39 specifications:

  • P/N: CLP0597
  • Heatsink Dimension: 120 x 103.8 x 159.5 mm
  • Heatsink Material: Aluminum Fins
  • Aluminum Base
  • Heatpipe: 8mm x 3
  • Fan Dimension: 120 x 120 x 25 mm
  • Rated Voltage: 12 V
  • Start Voltage: 9 V
  • Rated Current: Low: 0.10A, High: 0.25A
  • Power Input: 1.2W (Max 3.0W)
  • Fan Speed: 800 ~ 2000 RPM (PWM)
  • Air Flow: 29.434 ~ 72.084 CFM
  • Air Pressure: 0.356 ~ 1.985(mmH2O)
  • Noise: 15.0 ~ 33.2 dBA
  • Life Expectancy: 30,000 Hours
  • Connector: 4 Pin
  • Weight: 645g

Contac 30 specifications:

  • P/N: CLP0579
  • Heatsink Dimension: 120 x 76.9 x 159 mm (L x W x H)
  • Heatsink Material: Aluminum Fins
  • Aluminum Base
  • Heatpipe: 8mm x 3
  • Fan Dimension: 120 x 120 x 25 mm (L x W x H)
  • Rated Voltage: 12 V
  • Start Voltage: 9 V
  • Rated Current: Low:0.10A High:0.25A
  • Power Input: 1.2W (Max 3.0W)
  • Fan Speed: 800 ~ 2000 RPM (PWM)
  • Air Flow: 29.434 ~ 72.084 CFM
  • Air Pressure: 0.356 ~ 1.985(mmH2O)
  • Noise: 15.0 ~ 33.2 dBA
  • Life Expectancy: 30,000 Hours
  • Connector: 4-pin
  • Weight: 558g

With these two recent additions, the Thermaltake Contac series now includes: Contac 39, Contac 30, Contac 29BP, Contac 21 and Contac 16.

Source: Thermaltake


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