SiliconBlue Samples New 'Los Angeles' 40-nm Ultra-Low-Power 640, 1K and 4K LP and HX Devices
SiliconBlue Technologies announced sampling availability of three new iCE40 'Los Angeles' 640, 1K and 4K mobileFPGA devices including the LP Series (Low-Power) version and the HX Series (High-Speed) version targeting smartphones and tablets, respectively. Both the LP and HX Los Angeles mobileFPGA devices provide support for sensor management, high-speed custom connectivity and the convergence of HD video and imaging. Fabricated on TSMC 40-nm, low-power standard CMOS process, the LP and HX families provide twice the logic capacity of previous 65-nm devices.
The ultra-low-power Los Angeles LP640, LP1K and the LP4K CMDs are the ideal application processor companion chips optimized for smartphone applications delivering the lowest power in the smallest package. Addressing the vast array of design requirements for mobile products, the LP series is available in six packages starting with the world's smallest 0.4mm 2.5x2.5 plastic BGA, also including 3x3mm, 4x4mm up to 7x7mm. The Los Angeles HX640, HX1K and HX4K high-speed versions are designed to address the low-power, low-cost requirements for tablet applications. These are available in a variety of package types beginning with the CM225, CB132, CT256, VQ100 and TQ144 which enable minimum PCB interconnect layers, saving manufacturing costs.
The Los Angeles iCE40LP mobileFPGA series is available in sampling quantities today in six BGA package styles. Sampling quantities of the iCE40HX mobileFPGA series is also available today in five package styles including BGA, TQFP and VQFP. Smallest package devices start at under $1 USD in high volume. Full production of the 640, 1K, 4K and 8K devices will be announced in December 2011. For a chart of package styles and device specs, click here. iCEcube2 version 2011.09 software support is available now for the 640, 1K, 4K and 8K devices.
Source: SiliconBlue Technologies
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