Have a look at photos of the ASUS M5A99X EVO motherboard. Based on the AMD 990X + SB950 chipset combo, it is designed for octa, hexa, and quad-core AMD FX processors codenamed Zambezi.
ASUS M5A99X EVO features 8-phase Digi+ VRM and can host one (x16) or two (x8+x8) graphics cards working in AMD CrossFireX or NVIDIA SLI. The third PCI Express x16 slot powered by the Southbridge most probably works as x4. There are also two PCI Express x1 slots and PCI slot.
ASUS M5A99X EVO has four memory sockets for DDR3-1866. Storage drives can be connected to chipset's six SATA 6Gbps ports (RAID 0, 1, 0+1, 5, 10). Another two SATA 6Gbps ports are provided by the additional controller.
Speaking of USB 3.0, there are four ports, two of which are internal.
Finally, there's an 8-channel Realtek codec, a Gigabit Ethernet port and a FireWire controller from VIA.
The list of proprietory technologies includes EPU (Energy Processing Unit) and TPU (TurboV Processing Unit), as well as UEFI with a graphical user interface.
The official release is slated for mid-June.
The AMD FX lineup will feature quad, hexa and octacore processors based on the AMD Bulldozer architecture. The source obtained tests results of the octacore model working together with Radeon HD 6670.
Judging by the image, such a combination leaves Intel Core i7-2600K with integrated graphics far behind. The compared systems may be priced similarly, so you can guess how much an octacore AMD FX processor will cost, knowing the prices of Intel Core i7-2600K and AMD Radeon HD 6670.
In Futuremark PCMark Vantage AMD FX goes on a par with Intel Core i7-2600K. In 3DMark Vantage P AMD wins thanks to the higher performance of Radeon HD 6670.
It's interesting that AMD FX + Radeon HD 6670 only slightly outperforms Phenom II X6 1100T + the same graphics card.
Other results are related to AMD A-series APUs. Judging by the graph, AMD focuses on combined performance of CPU and GPU. The price/performance ratio (as opposed to absolute performance) will probably be another strong point of new processors.
ASRock launched promotion of AMD's new platform, announcing that its new motherboards will obtain 'real' AM3+ sockets. As you probably know, Socket AM3+ is designed for AMD FX processors based on the Bulldozer core now codenamed Zambezi.
It is known that AMD FX processors will be compatible with Socket AM3 as well — after a BIOS update. So ASRock clarified the advantages of Socket AM3+ over AM3.
The new CPU socket will be marked "AM3b" and will have pin holes larger by 11%: 0.51 mm versus AM3's 0.45 mm. The company claims it will simplify processor installation and reduce the risk of damaging pins.
The support for the faster Serial VID 3.4 MHz compared to the older 400 kHz will improve power managements and power saving.
AM3+ motherboards will also reduce CPU noise by 22% thus improving stability.
The new socket is designed for up to 32% higher current: 145A versus 110A of AM3.
ASRock also mentions the new Combo Cooler Retention Module that will supposedly improve airflow and reduce CPU power choke temperatures by 5.4°C. The CCR will also be backward-compatible with sockets AM3 and AM2+.
MIPI Alliance and USB 3.0 Promoters Group hope to introduce the specification of a USB 3.0-based inter-chip interface before the year ends. Initially, the Superspeed Inter-Chip spec (SSIC) will support speeds from 1.2 to 2.9 Gbps per lane with up-scalability to 5.8Gbps per lane. A low-power mode will also be provided for, with speeds from 10 Kbps to 600 Mbps.
The specification will merge MIPI Alliance's M-PHY serial interface with the MAC (media access controller) and higher-level software of USB 3.0.
Members of the USB 3.0 Promoters Group are Intel, ST Ericsson and Texas Instruments, which started working on the specification about a month ago.
The SSIC will succeed SMSC's Inter-Chip Connectivity (ICC) based on USB 2.0 and supporting speeds up to 480 Mbps. The latter has already been licensed to Qualcomm and AMD. Host developers will be able to use ICC for free, while developers of peripheral devices will be charged a one-time fee of $100000.
Unlike ICC, SSIC will be free for all members of MIPI Alliance and USB 3.0 Promoter Group willing to use it in Wi-Fi and VoIP devices. Other applications will be charged for, but reasonably at that.
Source: MIPI Alliance
ATEN today announced the launch of a dual-output KVMP (Keyboard, Video, Mouse, Peripheral) switch designed specifically for multimedia applications, PC/console gaming, video editing and digital art design. ATEN CubiQ CM0264 KVMP enables users to switch seamlessly between two HDMI-enabled and two DVI-enabled computers as well as share USB peripherals and high-definition audio from a dual-output console.
CM0264's dual-output functionality supports one DVI input and one HDMI input. Users can switch between four high-definition video sources on both displays, while the Picture-in-Picture (PIP) mode enables users to simultaneously control one computer on one display and view three other video sources on a second display.
In dual display mode, the unit's patented Cursor Shift feature allows users to automatically shift KVM focus by simply moving the mouse cursor across the displays. In addition, the dual output mode provides an intuitive GUI to allow file transfer, copy and paste functionality, and other basic file control features. CM0264 passes HDMI resolutions up to 1080p and single-link DVI-D resolutions up to 1920 x 1200. The ability to disable keyboard emulation allows the use of high-end, backlit gaming keyboards, card readers, keyboard USB ports as well as special gaming key combinations and programmable keys.
The following are sample applications depicting the use of ATEN's CM0264:
CM0264 supports widescreen resolutions, while ATEN's exclusive Video DynaSync technology eliminates boot-up display problems and optimizes video resolution when switching between ports. CM0264 also supports high-definition audio. With the built-in two-port USB 2.0 hub, users can expand and share their USB peripherals among the computers connected to the KVM switch.
Available now, the CM0264 is priced at $449.95 and backed by a three-year warranty program.
NEC Display Solutions of America today the addition of the 30-inch MultiSync MD301C4 medical diagnostic display for medical imaging and Picture Archiving and Communication System (PACS) in hospitals, doctor offices, urgent care centers and other healthcare facilities.
This 4-megapixel color display is a medical-grade monitor designed for multiple types of radiology and includes patented technologies designed to make healthcare employees' work more productive and accurate. It offers factory-adjusted DICOM calibration with self-monitoring brightness to maintain a specific luminance that can be set in the on-screen display or the included GammaCompMD QA software. This software ensures consistent image quality and offers quality control and conformance reporting. Combined with the optional MDSVSENSOR2 color calibration sensor, the MD301C4 also supports standalone calibration and exact monitor matching, while enhancing calibration and white-point matching for outstanding DICOM GSDF conformance. Optionally, GammaCompMD QA Network provides centralized control and management of multiple display systems.
The MD301C4 also includes several features to simplify the integration into a variety of healthcare IT environments, including the ability to emulate two legacy 2-megapixel displays through the included Picture by Picture functionality. To save desktop space, the MD301C4 can control two computers simultaneously through DisplaySync Pro and the integrated USB hub which functions as a keyboard, video and mouse (KVM) switch.
A partial list of features in the MultiSync MD301C4 follows:
The MD301C4 will be available in June 2011 at an estimated street price of $3499. The display ships with a 5 years parts and labor warranty.Source: NEC
VIA Technologies today announced that it will release its latest edition to its new family of low power dual core VIA Nano X2 Series processors. Available in two models running at speeds of 1.2+ GHz and 1.6+ GHz, VIA Nano X2 E-Series Processors also come with a component longevity guarantee of 7 years.
Leveraging the 40-nm manufacturing process, VIA Nano X2 E-Series processors combine two 64-bit, superscalar VIA Nano cores on one die. Each processor comes in VIA NanoBGA2 package of 21mm x 21mm with a die size of 11mm x 6mm. They are also fully pin-to-pin compatible with VIA Eden, VIA C7 and VIA Nano E-Series, and VIA Eden X2 processors.
The new processors bring additional features that include VIA VT virtualization, a technology that allows legacy software and applications to be used in virtual scenarios without impacting on performance. Another feature — VIA AES Security Engine — offers hardware-based data encryption on the fly.
VIA Nano X2 E-Series processors are natively 64-bit compatible, supporting Windows Embedded Standard 7. They also fully support Windows CE and Linux operating systems.
VIA Nano X2 E-Series Processors are sampling now to project customers. Systems and boards featuring VIA Nano X2 E-Series processors will be available in Q2 2011.
Source: VIA Technologies
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