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Intel To Launch Mass Production of 22-nm 3D Tri-Gate Transistors

Veer arrives at AT&T On May 15

Daily Mailbox

Corsair Updates Builder Series Power Supplies

PQI Releases Smallest USB 3.0 Disk Drive



Intel To Launch Mass Production of 22-nm 3D Tri-Gate Transistors

Intel Corporation today announced a significant breakthrough in the evolution of the transistor. Intel will introduce a 3D transistor design called Tri-Gate, first disclosed by Intel in 2002, into high-volume manufacturing at the 22-nanometer node in an Intel chip codenamed Ivy Bridge.

The three-dimensional Tri-Gate transistors represent a fundamental departure from the two-dimensional planar transistor structure that has powered not only all computers, mobile phones and consumer electronics to-date, but also the electronic controls within cars, spacecraft, household appliances, medical devices and virtually thousands of other everyday devices for decades.



The 22nm 3D tri-gate transistor

Intel's 3D Tri-Gate transistors enable chips to operate at lower voltage with lower leakage, providing an unprecedented combination of improved performance and energy efficiency compared to previous state-of-the-art transistors. The capabilities give chip designers the flexibility to choose transistors targeted for low power or high performance, depending on the application.

The 22-nm 3D Tri-Gate transistors provide up to 37 percent performance increase at low voltage versus Intel's 32-nm planar transistors. This gain means that they are ideal for use in small handheld devices, which operate using less energy to "switch" back and forth. Alternatively, the new transistors consume less than half the power when at the same performance as 2-D planar transistors on 32-nm chips.



According to Intel, the 3D Tri-Gate transistors are a reinvention of the transistor. The traditional "flat" two-dimensional planar gate is replaced with an incredibly thin three-dimensional silicon fin that rises up vertically from the silicon substrate. Control of current is accomplished by implementing a gate on each of the three sides of the fin two on each side and one across the top rather than just one on top, as is the case with the 2-D planar transistor. The additional control enables as much transistor current flowing as possible when the transistor is in the "on" state (for performance), and as close to zero as possible when it is in the "off" state (to minimize power), and enables the transistor to switch very quickly between the two states (again, for performance).



A 32-nm transistor on the left compared to a 22-nm 3D Tri-Gate transistor on the right

Today, Intel demonstrated the world's first 22-nm microprocessor, codenamed Ivy Bridge, working in a laptop, server and desktop computer. Ivy Bridge-based Intel Core family processors will be the first high-volume chips to use 3D Tri-Gate transistors. Ivy Bridge is slated for high-volume production readiness by the end of this year.

This silicon technology breakthrough will also aid in the delivery of more highly integrated Intel Atom processor-based products.

Source: Intel


Veer arrives at AT&T On May 15

AT&T today announced that the HP Veer 4G will be available from AT&T at its stores and online on May 15. Veer, which AT&T will offer in both black and white versions for $99.99 with a two-year contract, is one of the smallest smartphones on the market. Based on webOS, it will offer features like Just Type, HP Synergy, easy and fast messaging and email, and the ability to keep multiple apps open at once and switch back and forth between them.

Specifications:

  • Processor: Qualcomm MSM7230, 800 MHz
  • Display: 2.6-inch multitouch screen with a vibrant 18-bit color, 320x400 resolution
  • Keyboard: Slide-out physical QWERTY keyboard
  • Memory: 8GB (~6.1GB available)
  • USB mass storage support
  • Battery: 910 mAh (non-removable); up to 5.0 hours of talk time or 300 hours of standby time.
  • Color: Black, White
  • Operating system: HP webOS
  • Network specs: HSDPA Cat 10/HSUPA Cat 6, Quad-band GSM/EDGE: 850/900/1800/1900, GSM/GPRS/EDGE
  • Email: Microsoft Exchange email with Microsoft, Direct Push Technology, POP3/IMAP (Yahoo! Mail, Gmail, AOL, Hotmail, etc.)
  • Messaging: Integrated IM, SMS, and MMS
  • GPS: Built-in GPS (A-GPS)
  • Digital camera: 5-megapixel camera with extended depth of field, geotagging, and video capture
  • Audio: Speakerphone; dual-mic for noise cancellation for quieter calls.
  • Sensors: Accelerometer, ambient light, and proximity
  • Media formats supported: Audio formats: MP3, AAC, AAC+, eAAC+, AMR, QCELP, WAV, Video formats: MPEG-4, H.263, H.264
  • Wireless connectivity: Wi-Fi 802.11b/g/n with WPA, WPA2, WEP, 802.1X authentication; Bluetooth wireless technology 2.1 + EDR with A2DP stereo Bluetooth support; Wi-Fi router functionality for up to five devices using HP mobile hotspot.
  • Connector: Charger/magnetic connector with USB 2.0 Hi-Speed
  • Headphone jack: Magnetic connector with 3.5mm stereo headset adapter included
  • HP Touchstone: Compatible
  • Dimensions: Width: 54.5 mm (2.15 inches)
  • Height: 84 mm (3.31 inches)
  • Thickness: 15.1 mm (0.59 inches)
  • Weight: 103 grams (3.63 ounces)

Source: Palm Blog


Daily Mailbox

Today's collection of reviews published by our colleagues.


Corsair Updates Builder Series Power Supplies

Corsair today announced it has updated the Builder Series with new CX V2 models. The Builder Series CX V2 is the successor to the current CX family of PSUs, offering 80 PLUS certification and European Commission Energy-Related Product (ErP) directive compliance for guaranteed efficiency and low standby power consumption.



The warranty on the CX V2 PSUs has also been increased to three years, one year longer than the original Builder Series models.

Builder Series CX V2 power supplies are designed for entry-level to midrange home system builds and desktop PC upgrades.

New power supplies will be available in May worldwide. The CX600 V2 will be available for a US suggested retail price of $74. The CX500 V2 will be available for $64, and the CX430 V2 will be available for $49.

CX600 V2 specifications:

  • Ultra-quiet 120-mm fan adjusts fan speed in response to temperature
  • 80 PLUS certified to deliver at least 80% efficiency at normal load conditions (20% to 100% load)
  • 0.99 Active Power Factor Correction
  • Universal AC input from 90~264V
  • Extra long fully-sleeved cables for full tower chassis
  • Dedicated single +12V rail
  • Over-voltage, over-power, under-voltage, short circuit protection
  • Supports the latest ATX12V v2.3 standard and is backward compatible with ATX12V 2.2 and ATX12V 2.01 systems
  • Safety Approvals: UL, CUL, CE, CB, FCC Class B, TUV, CCC, C-tick
  • Dimensions: 5.9x3.4x5.5 inches / 150x86x140 mm
  • MTBF: 100,000 Hours

CX600 V2 connectors:

  • ATX connector: 1
  • EPS connector: 1
  • PCIe connector: 2
  • 4-pin peripheral connector: 4
  • SATA connector: 6
  • Floppy connector: 1

Source: Corsair


PQI Releases Smallest USB 3.0 Disk Drive

The 3-cm-long Intelligent Drive U819V solves overheating issue and data reading problem caused by high-frequency noise and comes in 'ivory white' and 'midnight black'.



The drive offers capacities from 4GB to 32GB, is sized 31.5 x 14.8 x 7.3 mm and weighs just 3.61 g. It's covered by lifetime warranty.

There is a special LED display at the tip that flickers when data is being read. Furthermore, PQI has come up with a cap retention design. The complimentary, square-shaped, transparent soft rubber serves as a cell phone ornament and also attaches to the end of the disk. When the cap is removed from Intelligent Drive U819V, it can be inserted into the transparent rubber.

Source: PQI


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