MIPI Alliance and USB 3.0 Promoter Group To Bring SuperSpeed USB 'Inside the Box'
MIPI Alliance and USB 3.0 Promoters Group hope to introduce the specification of a USB 3.0-based inter-chip interface before the year ends. Initially, the Superspeed Inter-Chip spec (SSIC) will support speeds from 1.2 to 2.9 Gbps per lane with up-scalability to 5.8Gbps per lane. A low-power mode will also be provided for, with speeds from 10 Kbps to 600 Mbps.
The specification will merge MIPI Alliance's M-PHY serial interface with the MAC (media access controller) and higher-level software of USB 3.0.
Members of the USB 3.0 Promoters Group are Intel, ST Ericsson and Texas Instruments, which started working on the specification about a month ago.
The SSIC will succeed SMSC's Inter-Chip Connectivity (ICC) based on USB 2.0 and supporting speeds up to 480 Mbps. The latter has already been licensed to Qualcomm and AMD. Host developers will be able to use ICC for free, while developers of peripheral devices will be charged a one-time fee of $100000.
Unlike ICC, SSIC will be free for all members of MIPI Alliance and USB 3.0 Promoter Group willing to use it in Wi-Fi and VoIP devices. Other applications will be charged for, but reasonably at that.
Source: MIPI Alliance
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