Super Talent Announces Enterprise Class TeraDrive SSDs

Inphi Samples First JEDEC-Compatible Memory Buffer That Enables Load-Reduced DIMMs

AMD Introduces E4690 MXM 3.0 Graphics

Super Talent Announces Enterprise Class TeraDrive SSDs

Super Talent Technology announced a new line of TeraDrive SSDs designed specifically for high-end enterprise and database server applications.

The new TeraDrive FT2 is a SATA 3Gbps SSD based on the new advanced SandForce SF-1500 SSD processor. It delivers sequential read and write speeds of up to 250 MB/s which will not degrade over time. It also supports transaction speeds up to 30,000 IOPS, making it a formidable storage solution for database servers where random read and write speeds are critical.

The TeraDrive FT2 offers advanced reliability and endurance with state-of-the-art wear leveling, bad bit management, and ECC with up to 24 bytes correctable per 512-byte sector. TeraDrive FT2 is available with either MLC or SLC NAND flash, and is offered in capacities from 50GB to 400GB.

• FTM05F225H -- 50GB 2.5" MLC SATA TeraDrive FT2 SSD
• FTM10F225H -- 100GB 2.5" MLC SATA TeraDrive FT2 SSD
• FTM20F225H -- 200GB 2.5" MLC SATA TeraDrive FT2 SSD
• FTM40F225H -- 400GB 2.5" MLC SATA TeraDrive FT2 SSD
• FTD05F225H -- 50GB 2.5" SLC SATA TeraDrive FT2 SSD
• FTD10F225H -- 100GB 2.5" SLC SATA TeraDrive FT2 SSD
• FTD20F225H -- 200GB 2.5" SLC SATA TeraDrive FT2 SSD

MLC and SLC TeraDrive SSDs are available to OEMs directly from Super Talent in sample quantities this month and in volume later in Q1/2010.

Source: Super Talent Technology

Inphi Samples First JEDEC-Compatible Memory Buffer That Enables Load-Reduced DIMMs

Inphi Corporation announced that it is sampling the industry's first JEDEC-compatible memory buffer designed to create a new class of standards-based memory modules –- LRDIMMs, or load-reduced, dual-inline memory modules -- capable of delivering upward of four times the memory capacity and nearly double the bandwidth, while reducing the overall power consumption. Inphi's JEDEC-compatible memory buffer enables data center servers to take better advantage of multicore and virtualization technologies by isolating the CPU from the memory components and then buffering the memory, I/O, control and data signals.

Unlike traditional registered DIMMs (RDIMMs) that limit the amount of memory that can be accommodated to their loading profile, LRDIMMs replace the register with an isolated memory buffer and significantly reduce the load. The new scheme enables more ranks of dynamic RAM (DRAM) to be populated on the memory module and seamlessly accessed by the CPU memory controller. The result is that each server's memory capacity can be multiplied as much as fourfold, while server bandwidths can increase by up to 36 percent compared to RDIMM approaches.

In addition, the LRDIMMs based on Inphi's JEDEC-compatible iMB component alleviates another major concern -– power consumption -– that plagues DDR3 systems when maximum memory capacity is needed. On most usage models, a quad-ranked LRDIMM consumes lower power, in both active and idle condition, compared to an equivalent quad-ranked RDIMM with the same capacity. This overall reduction in power consumption is brought about by improved optimization of termination power on the LRDIMM.

Because the new technology enables LRDIMMs to scale to much higher capacities and frequencies using cost-effective mainstream DRAM technology, servers can support more higher-speed CPUs without adding more memory modules, and with lower power consumption. Alternatively, data center servers using the new memory architecture can support the same amount of memory with many fewer servers, directly improving the total cost of ownership.

Engineering samples of Inphi's iMB 02-GS01 Isolation Memory Buffer are offered in a RoHS-compliant flip-chip BGA and are available now for qualified customers. Prices for initial engineering samples are $25.00. Fully qualified parts are expected to begin shipping in Q2 of 2010.

Source: Inphi Corporation

AMD Introduces E4690 MXM 3.0 Graphics

At DIGITIMES Tech Forum AMD introduced the ATI Radeon E4690 Mobile PCI Express module (MXM) which meets the requirements of the MXM 3.0 specification.

According to company's estimates, ATI Radeon E4690 MXM performs about three times faster than previous solutions. Also, novelty's power consumption has been optimized by means of ATI PowerPlay.

ATI Radeon E4690 MXM features 320 shader processors, 512MB of GDDR3 memory, and 128-bit bus. The peak core/memory clock rates are 600/700 MHz. The module offers two independent display controllers with a large number of interfaces, including DisplayPort (1.1a, 4x), Single-Link (1x) or Dual-Link (1õ) LVDS, Single-Link (4x) and Dual-Link (2x) DVI, TMDS, HDMI, as well as analog outputs. The module dimensions are 70x82mm.

According to AMD, the novelty is currently the only embedded 3D accelerator to support Microsoft DirectX 10.1 and Unified Video Decoder 2 (hardware decoding of H.264, VC-1 and MPEG-2 content). Besides, ATI Radeon E4690 MXM supports ATI Stream, meaning it can be used as a GPGPU for general-purpose computation.

Source: AMD

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