Inphi Samples First JEDEC-Compatible Memory Buffer That Enables Load-Reduced DIMMs
Inphi Corporation announced that it is sampling the industry's first JEDEC-compatible memory buffer designed to create a new class of standards-based memory modules –- LRDIMMs, or load-reduced, dual-inline memory modules -- capable of delivering upward of four times the memory capacity and nearly double the bandwidth, while reducing the overall power consumption. Inphi's JEDEC-compatible memory buffer enables data center servers to take better advantage of multicore and virtualization technologies by isolating the CPU from the memory components and then buffering the memory, I/O, control and data signals.
Unlike traditional registered DIMMs (RDIMMs) that limit the amount of memory that can be accommodated to their loading profile, LRDIMMs replace the register with an isolated memory buffer and significantly reduce the load. The new scheme enables more ranks of dynamic RAM (DRAM) to be populated on the memory module and seamlessly accessed by the CPU memory controller. The result is that each server's memory capacity can be multiplied as much as fourfold, while server bandwidths can increase by up to 36 percent compared to RDIMM approaches.
In addition, the LRDIMMs based on Inphi's JEDEC-compatible iMB component alleviates another major concern -– power consumption -– that plagues DDR3 systems when maximum memory capacity is needed. On most usage models, a quad-ranked LRDIMM consumes lower power, in both active and idle condition, compared to an equivalent quad-ranked RDIMM with the same capacity. This overall reduction in power consumption is brought about by improved optimization of termination power on the LRDIMM.
Because the new technology enables LRDIMMs to scale to much higher capacities and frequencies using cost-effective mainstream DRAM technology, servers can support more higher-speed CPUs without adding more memory modules, and with lower power consumption. Alternatively, data center servers using the new memory architecture can support the same amount of memory with many fewer servers, directly improving the total cost of ownership.
Engineering samples of Inphi's iMB 02-GS01 Isolation Memory Buffer are offered in a RoHS-compliant flip-chip BGA and are available now for qualified customers. Prices for initial engineering samples are $25.00. Fully qualified parts are expected to begin shipping in Q2 of 2010.
Source: Inphi Corporation
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