bit-tech News: Gigabyte X48T-DQ6 motherboard
Wolfking Warrior XXtreme @ Bjorn3D
VL System M-Play Blast LCD Case Display and Remote Control Review @ Tweaknews.net
OCZ ReaperX HPC DDR3-1333 2GB Memory Kit Review @ ThinkComputers.org
Fujitsu LifeBook U1010 (3.5G) Notebook Review @ OzHardware
Xigmatek Achilles S1284 HDT CPU Cooler @ Benchmark Reviews
NZXT Tempest ATX Mid Tower Enclosure @ TweakTown
Archos 705 WiFi Review @ Digital Trends
Sapphire Radeon HD 3870 Toxic Review @ Hardware-Mag.de
Hanns-G Hi221D 22in Widescreen Display Review @ OCIA.net
SanDisk Ducati Extreme Review @ InsideHW
Novus Professional Scratch Remover @ OCModShop
Asus P5Q3 Deluxe Preview @ Driver Heaven
In Win B2 Stealth Bomber Case Review @ Rbmods
Xigmatek S1283 Red Scorpion CPU Cooler Review on Technic3D
Thermolab Nano Silencer TLI-U Low-Profile Heatsink Review @ Frostytech
Logitech diNovo Mini Review @ TechwareLabs
A-Data FP2 USB-Stick Fingerprint @ TweakPC
[Tech ARP] Western Digital 320 GB Scorpio Notebook Hard Drive Review
780a launch: Asus M3N-HT Deluxe reviewed @ Neoseeker
ASUS P5Q3 Deluxe - Intel P45 chipset review @ NordicHardware
Asus M3N-HT Deluxe/Mempipe 780a Motherboard @ APH Networks
NVIDIA nForce 780a SLI Motherboard Round-Up, Asus, MSI @ HotHardware
NVIDIA nForce 780a chipset - ASUS Crosshair II Formula motherboard review @ Elite Bastards
OCZ PC2-6400 ReaperX HPC 4GB Kit @ techPowerUp
Age of Conan Beta After 24 Hours @ BiTT Daily
AMD Phenom X3 processor family performance @ TechSpot
Futurelooks - Corinex GameNet Powerline Networking Kit Review
I4U: Asus R300 GPS Navigation Device Review
Computrace LoJack for Laptops Review @ HardwareLogic
Overclock3D Content: Noctua NH-C12P CPU Cooler
US Exclusive: Noctua NH-C12P CPU Cooler Review @ DragonSteelMods
Legion Hardware - (Gigabyte GeForce 9600 GT Turbo Force)
XFX GeForce 9800GTX Black Edition Review @ Gamepyre
ASUS EN9600GT Silent 512MB @ Techgage
MSI K9A2 Platinum Motherboard Review @ motherboards.org
HEXUS.net - previews :: NVIDIA nForce 780a SLI chipset preview
OCZ 4GB Rally2 USB Flash Drive at Overclockers Online
nVidia GeForce 9800GTX Triple SLI @ t-break
Audioengine W1 Wireless Audio Adapter Reviewed @ TheTechLounge
Kaspersky Internet Security 7 Review @ PC Review
Newer Technology USB 2.0 Universal Drive Adapter Review @ EOC
Overclocking the Intel Q9300 CPU With Subzero Cooling @ Madshrimps
Kingston HyperX 2GB PC2-9200 DDR2 Memory Kit Review @ Bigbruin
Sparkle GeForce 9600 GT PX96GT512D3-HP review @ TWEAK.DK
EVGA Precision 1.0 Overclocking Utility @ NGOHQ
OCZ Rally2 Turbo 4GB USB 2.0 Flash Drive Review @ Virtual-Hideout
Motorola MotoPure H12 Bluetooth Headset @ BlueTomorrow
Super Talent Technology launched a new line of MasterDrive solid state drives (SSDs) that are 100% interchangeable with hard disk drives (HDDs), but are faster, lighter, use less power and are far more rugged and reliable.
MasterDrive SSDs use NAND Flash rather than magnetic platters as the storage medium, giving them many advantages over HDDs. These drives have no moving parts, and therefore are completely silent, lighter weight and more reliable than HDDs. Moreover, they consume a fraction of the power of HDDs, meaning they produce less heat and offer longer battery life in mobile computing. MasterDrive SSDs use a SATA-II (3Gbps) interface to support high bandwidth and broad compatibility with motherboards, and have a standard 2.5-inch form factor. Proprietary wear-leveling algorithms extend the life of these SSDs.
MasterDrive DX drives employ SLC NAND Flash to support astounding sequential read and write speeds up to 120 and 70 MB/sec respectively, and are backed with a three year warranty. MasterDrive MX drives use MLC Flash to achieve maximum sequential read/write speeds of 120 and 40 MB/sec, and include a 1-year warranty. MasterDrive SSDs are available now from NewEgg and eWiz.
Source: Super Talent Technology
NVIDIA introduced its new Hybrid SLI technology for motherboards. These new platforms are the foundation for a new breed of PCs that deliver a richer visual experience while reducing energy consumption and costs, fan noise, and even heat. The new technology is available immediately with new NVIDIA nForce 780a SLI and GeForce 8 Series based motherboards.
The visual capabilities of typical PCs are driven by either integrated graphics on the motherboard or by higher performance, discrete graphics cards. Unfortunately, the most common integrated graphics chips lack the performance and features needed by many popular modern 3D applications, games, and movies. Discrete graphics cards deliver a far superior visual experience, but consume more energy.
According to the press release, Hybrid SLI-enabled motherboards eliminate this problem by putting a GeForce GPU directly on the motherboard. This GeForce GPU has better DirectX compatibility and HD movie playback capability than the most common integrated graphics chips found in today's PCs, but consumes less energy than a discrete graphics card.
Designed for PC enthusiasts and hard-core gamers, the HybridPower feature completely powers down the discrete graphics cards and switches graphics processing to the motherboard GPU in applications where major 3D horsepower is not required, such as e-mail and Web surfing. Users will appreciate the lower energy consumption, quieter PC operation, and less heat. When additional 3D horsepower is needed, it can be manually transitioned back to discrete graphics cards using HybridPower technology, which are then powered up and ready to rock the 3D world. Hybrid SLI technology allows to save on energy costs over the life of the PC for high-end, enthusiast-class PCs, and deliver additional graphics performance for more mainstream desktops via these two features.
For mainstream users, a Hybrid SLI technology feature called GeForce Boost allows the user to add an additional graphics card for even more graphics horsepower. By combining the performance of the motherboard GPU and graphics card discrete GPUs, GeForce Boost increases overall graphics performance up to 50% for today’s visually intensive applications and home entertainment.
The Hybrid SLI-enabled desktop PC motherboards are designed to create a balanced PC with GeForce GPUs and AMD Phenom processors. Eight models, including a newly available nForce 780a SLI motherboard, are available:
Currently available Hybrid SLI-enabled discrete graphics cards include:
Hybrid SLI-enabled PC motherboards for Intel processors and Hybrid SLI-enabled notebooks will be available in Q3 of 2008.
Victor Company of Japan (JVC) announces a new addition to its lineup of proprietary D-ILA (Direct-Drive Image Light Amplifier) high-definition reflective liquid crystal devices for projectors. The newly developed 1.75-inch 8K4K D-ILA device has the world's largest number of pixels*1 and is able to display images of approximately 35 megapixels (8192 x 4320 pixels), the equivalent of more than 17 times the level of Full High-Definition. This means that a single display device can now produce Super Hi-Vision images and can display images with the highest number of pixels currently defined under international standards.
Super Hi-Vision is a TV broadcasting service currently under development at NHK; a single image has approximately 33 megapixels (7680 x 4320 pixels), with 60 frame/second sequential scanning and 22.2 multichannel sound. Image format is international standard ITU-R BT.1769, SMPTE 2036. Diagonal size is 1.67 inches at Super Hi-Vision standard pixel dimensions of 7680 x 4320.
Through the development of a new production process and new pixel structure for even finer pixels, JVC has now succeeded in developing the 1.75-inch 8K4K D-ILA device, the world's first device to achieve real Super Hi-Vision definition level. The new device has approximately 50% higher density in its ratio of area per pixel as compared to the 1.27-inch 4K2K D-ILA device, which was originally the world's smallest 4K device. Furthermore, the new device has achieved a video display of approximately 35 megapixels, the world's highest pixel counts, while continuing to provide the D-ILA series' characteristics such as "high-quality images without a distracting pixel structure", "high light availability", and "high contrast ratio".
Features of New 1.75-inch 8K4K D-ILA Device:
Source: Victor Company of Japan
OCZ Technology Group premiered the world's first PC3-16000 4GB (2x2048MB) DDR3 kits. Designed to offer the earliest adopting enthusiasts the advantages of high-density memory coupled with the highest speeds available, the OCZ PC3-16000 4GB kits make use of the unbeatable overclocking capabilities of the latest platforms.
As part of the OCZ Platinum series, these new high-density 2GHz DDR3 dual channel kits are meant for computer enthusiasts and professionals utilizing high-bandwidth video, music, and graphics applications, along with gamers experiencing the latest PC titles that make use of DirectX 10 at the highest settings. Among the latest high-density DDR3 offerings, OCZ will also add a 4GB kit option to the popular PC3-14400 Platinum Series as well, for users taking advantage of 1800MHz speeds on the latest motherboards.
The OCZ PC3-16000 and PC3-14400 Platinum Series will now be available in 2GB modules or 4GB (2x2048MB) dual channel kits and are backed by a lifetime warranty.
Source: OCZ Technology Group
The Standard Performance Evaluation Corp. (SPEC) has released SPECjvm2008, a new Java virtual machine benchmark with multithreaded workloads that represent a broad range of application areas. SPECjvm2008 is available for free downloading on the SPEC website: www.spec.org/jvm2008/.
The new benchmark, which replaces SPECjvm98, enables performance comparisons for systems running the Java Runtime Environment (JRE). Metrics are influenced by the performance of the just-in-time (JIT) compiler, memory management, and other aspects of the system, including the processor, cache and memory bus.
New evaluation tools in SPECjvm2008 include a plug-in analysis framework that gathers information on factors such as heap usage during testing, and a reporter that displays a summary graph of all test runs. CPU2000, since new benchmarks have been added and existing ones changed.
SPECjvm2008 allows testing under both base and peak rules. Base testing simulates environments in which users do not tune systems for increased performance. Peak results show how tuning can be used to drive maximum Java throughput. Anyone submitting a peak result for publication on the SPEC web site must also submit a base result.
SPEC members participating in the development of SPECjvm2008 include AMD, BEA, HP, IBM, Intel and Sun.
SPEC expects that the free software will be valuable to four key groups within the IT community:
Panasonic Corporation of North America announced the introduction of the DMP-BD50, Panasonic's third generation Blu-ray disc player. The BD50 adds the new BD-Live function, which uses the internet to further enhance the consumer's entertainment experience and employs VIERA Link, a technology that allows the consumer to operate VIERA Link equipped home theater components with a single remote. The DMP-BD50 will be available this spring and will have an SRP of $699.95.
In the future BD-Live will allow users to connect the DMP-BD50 to the internet to download such data as images and subtitles, and to join in multi-player interactive games that are linked to bonus movie content contained on Blu-ray discs.
For optimum image quality the DMP-BD50 features the PHL Reference Chroma processor and P4HD i/p conversion processor, which combine to create Uniphier, a precise digital video processor that produces sharp, crisp, natural colors that are extremely faithful to the original movie. Uniphier reflects the advance encoding and authoring technologies developed by Panasonic Hollywood Laboratory.
The DMP-BD50 can be combined with a 7.1 channel amplifier and speakers for full 7.1 channel surround sound.
The included SD Memory Card slot allows for easy transferring of images from an HD camcorder or digital still camera via an SD Memory card. The consumer simply inserts the SD card into the BD50 and then can view the images on a large screen HD flat panel television with AVCHD format video images or JPEG stills in full 1920 x 1080 resolution. In addition the DMP-BD50 has been awarded the Energy Star certification.
Intel Corporation, Samsung Electronics and TSMC announced they have reached agreement on the need for industry-wide collaboration to target a transition to larger, 450mm-sized wafers starting in 2012. The transition to larger wafers will enable continued growth of the semiconductor industry and helps maintain a reasonable cost structure for future integrated circuit manufacturing and applications.
The companies will cooperate with the semiconductor industry to help ensure that all of the required components, infrastructure and capability are developed and tested for a pilot line by this target date.
Historically, manufacturing with larger wafers helps increase the ability to produce semiconductors at a lower cost. The total silicon surface area of a 450mm wafer and the number of printed die (individual computer chips, for example) is more than twice that of a 300mm wafer. The bigger wafers help lower the production cost per chip. Additionally, through more efficient use of energy, water and other resources, bigger wafers can help diminish overall use of resources per chip. For example, the conversion from 200mm wafers to 300mm wafers helped reduce aggregate emissions per chip of air pollution, global warming gasses and water, and further reduction is expected with a transition to 450mm wafers.
Intel, Samsung and TSMC indicate that the semiconductor industry can improve its return on investment and substantially reduce 450mm research and development costs by applying aligned standards, rationalizing changes from 300mm infrastructure and automation, and working toward a common timeline. The companies also agree that a cooperative approach will help minimize risk and transition costs.
In the past, migration to the next larger wafer size traditionally began every 10 years after the last transition. For example, the industry began the transition to 300mm wafers in 2001, a decade after the initial 200mm manufacturing facilities (also known as "fabs") were introduced in 1991.
The three companies will continue to work with International Sematech (ISMI), as it plays a critical role in coordinating industry efforts on 450mm wafer supply, standards setting and developing equipment test bed capabilities.
Source: Intel Corporation
HTC unveiled its new flagship phone, the HTC Touch Diamond, defined by its compact size, game-changing Internet and its new captivating 3D touch interface called TouchFLO 3D.
With the introduction of the Touch Diamond, HTC delivers broadband-like speeds with HSDPA 7.2 Mbps and HSUPA wireless connectivity. HTC provides a new customized mobile Web browser that enables easy viewing and effortless navigation of websites. As part of this browsing experience users can zoom and pan websites with one hand and automatically view optimized content that has been specially created to fit the display. Turning the device sideways automatically rotates the web page view from a portrait to landscape view.
In addition to Web browsing, the Touch Diamond includes a proprietory new YouTube application for watching a variety of user generated video content as well as utilizing Google Maps for mobile for mapping and traffic data.
The HTC Touch Diamond will be available to customers across all major European carriers in June. It will be available later this quarter in Asia and the Middle East. The North American and Latin American versions of the Touch Diamond will be available in the second half of 2008.
HTC Touch Diamond Key Specifications:
Hitachi Global Storage Technologies (Hitachi GST) today began shipment of its fourth-generation 7,200 RPM mobile hard drive, the Travelstar 7K320. The new drive delivers 60 percent higher capacity than its predecessor, while improving application performance by 12 percent and power consumption by 22 percent. The drive's quiet acoustics improve the experience of watching movies or listening to music on a notebook PC. The 2.5-inch drive is offered with optional Bulk Data Encryption for users wanting increased data security. Hitachi also plans to ship enhanced-availability (EA) models, designed to provide high-capacity storage for low-duty-cycle, 24x7 applications.
The performance attributes of the Travelstar 7K320 allow consumers to opt for a full-featured notebook or compact desktop model, while still achieving all the capacity and performance typically associated with a more traditional desktop PC. The new drives bring forth a number of essential features that are in strong demand from manufacturers of notebooks, compact desktops, gaming systems, blade servers and video surveillance systems. Some of these attributes include best-in-class operating shock protection of 400Gs, 5,400 RPM-equivalent power consumption and quiet acoustics.
Travelstar 7K320 features include:
The Travelstar 7K320 features optional Bulk Data Encryption (BDE), a capability that Hitachi has offered in its mobile hard drives since the start of 2007. Previously, data on a hard drive could be protected either through software-based encryption or a system-level password. Hard drive level encryption provides improved performance and a higher level of security than any of the previously available methods.
When employing bulk data encryption, data is scrambled using a key as it is being written to the disk and then descrambled with the key as it is retrieved. Thus, data encryption at the hard-drive level represents a more sophisticated approach of securing users' data and is generally considered to be virtually impenetrable. Another benefit is that it speeds and simplifies the drive re-deployment process. By deleting the encryption key, the data on the drive is rendered unreadable, thereby eliminating the need for time-consuming data-overwrite.
BDE models ship exclusively with a SATA 1.5Gb/s interface.
The Travelstar 7K320 is now shipping to customers worldwide. The enhanced-availability version of the drive is expected to ship in the third quarter of 2008.
ASUS launched the world's first stand-alone color processor with a modularized graphics card – the ASUS Splendid MA3850M; which combines a video enhance card with the ASUS Splendid HD processor and a modularized VGA card. The ASUS Splendid HD processor increases image quality to deliver sharper, more vividly colored visual outputs without increasing CPU loadings; while automatically selecting the best possible display modes. Claimed to be on par with generic ATI Radeon HD 3850 VGA cards in terms of 3DMark performance, the Splendid MA3850M is able to reduce power consumption for more energy savings. Additionally, the overall length of the Splendid MA3850M is 27% shorter than generic ATI Radeon HD 3850 graphics cards – allowing a perfect fit even for smaller-chassis users.
The ASUS Splendid HD processor utilizes the newest generation of Splendid video intelligence technology. This provides vibrant and fine-tuned images in conditions most favorable to the human eye, without any increase in CPU loading. The press release states that watching movies on PC monitors can now be as good as watching them on top-of-the-line consumer televisions, all thanks to the 7-region color enhancement, 12-bit gamma correction, real-time 2D peaking and dynamic contrast engine of this powerful chip. In addition, it automatically selects the best possible display modes – with inclusions of a Photo Mode, Video Mode, and Game Mode. Furthermore, it allows users to adjust image sharpness and optimization according to the display panel.
The ASUS Splendid MA3850M also comes with the ATI Mobility Radeon HD 3850 GPU that supports the ATI PowerPlay technology.
With a length (17cm) that is shorter than generic ATI Radeon HD 3850 graphics cards (23.3cm), the Splendid MA3850M will still fit perfectly for smaller-chassis users. It is also designed on a stylish black circuit board, and the fansink and bracket exude a feeling of 'gamer-chic' – making the Splendid MA3850M an attractive and physically appealing product for users to enjoy 3D Gaming and home theater at the same time. Last but not the least, the modularized design concept makes the graphics card able to be easily upgraded in the future.
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