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VIA Launches First Single-Chip Embedded Chipset, the VIA CX700, at ESC 2006

TI Announces WLAN, Bluetooth And FM Audio In A Single Chip

Hitachi Introduces New Deskstar Hard Drives



VIA Launches First Single-Chip Embedded Chipset, the VIA CX700, at ESC 2006

VIA Technologies today announced the VIA CX700 digital media IGP chipset for the VIA C7 and Eden processor platforms, its most advanced x86 embedded chipset that integrates all the features of a modern chipset's North and South bridges, including graphics, HD audio, and DDR2 and SATAII support, into a single, compact and power-efficient package.

Technologies packed into the VIA CX700:

  • Video – VIA UniChrome Pro IGP core with its 128-bit 2D/3D graphics, hardware MPEG-2 video decoding acceleration and intelligent video rendering technology of the Chromotion CE video display engine; this is complemented by the VIA Vinyl HD Audio controller supporting up to eight high-definition channels delivering a richer all-round digital media experience.
  • Memory – Support for both DDR400 and the high-bandwidth DDR2533 memory up to 4GB with ECC capability, and 32-bit as well as 64-bit system memory.
  • Connectivity – Support for SATA, SATA II and PATA drives, two COM and six USB2.0 ports, and four PCI slots. Moreover, developers can also integrate support for ISA through an ITE PCI bridge chip, combining legacy ISA connectivity with high bandwidth DDR2 memory support for far more powerful embedded systems.
  • Display – Multi-configuration LVDS/DVI transmitter, a popular feature for embedded systems, as well as standard TV-out, and incorporating DuoView to enable dual screen display.

In the CX700, VIA has integrated all the key functionality of both the North and South bridges of a regular VIA chipset into a single chip package exactly the same size as a North bridge, i.e. 37.5mm x 37.5mm, representing a saving of over 34% in board real estate.

Complementing the VIA C7 and fanless VIA Eden processors it supports, the VIA CX700 is based on a power-efficient architecture that enables integration into a compact package with a maximum power envelope of 3.5 watts.

CX700 Features:

  • Processor Support: VIA C7 and VIA Eden processors
  • Front Side Bus: 533/400MHz
  • Memory Support: DDR2 533/400/333 or DDR400/333
  • Max Memory: 4 GB
  • AGP Support: AGP 8X
  • North/South Bridge Link: V-Link (533MB/sec)
  • Graphics Core: VIA UniChrome Pro
  • Hardware Video Acceleration: MPEG-2
  • Dual Monitor Support: Yes
  • Video De-blocking: Yes
  • Hardware Display Rotation: Yes
  • High Definition Audio: Yes
  • USB 2.0: 6 ports
  • PCI Devices/Slots: 4 Slots
  • Serial ATA: 2 x SATA 150 devices or 2 x SATA II devices
  • IDE: 1 EIDE channel up to 2 devices

The VIA CX700 is expected to be available in volume quantities later in Q2 2006. Pricing is available upon request.

TI Announces WLAN, Bluetooth And FM Audio In A Single Chip

Texas Instruments announced the industry's first solution that integrates mobile WLAN (mWLAN), Bluetooth and FM stereo audio, all in a space-saving platform for mobile phones.

TI brings seamless cellular and Wi-Fi connectivity to consumers with VoWLAN functionality, optimized on TI's OMAP-Vox and WiLink solutions, enabling UMA on the handset across multiple operating systems such as Symbian, Microsoft Windows Mobile, Linux and low level operating systems. UMA provides consumers on-the-go voice access over WLAN or the cellular network using their mobile phones, and will transition to IMS as the fixed mobile convergence market matures.

The WiLink 5.0 platform integrates TI's recently announced BlueLink 6.0 solution, which combines the Bluetooth with high-fidelity FM stereo and mono audio on a single chip. The combination of mWLAN, Bluetooth and FM functionality allows users to perform a variety of simultaneous tasks, such as listening to the radio music on a Bluetooth headset while checking email via Wi-Fi.

Manufactured in TI's innovative DRP technology at the 90 nanometer node, the WiLink 5.0 device cuts both solution size and power consumption by up to 20 percent over competitive solutions, in critical modes of operation.

With three co-located radios, efficient management of RF is required for simultaneous operation of WLAN, Bluetooth and FM applications. The WiLink 5.0 platform takes advantage of TI's expertise from the company's four previous generations of mobile WLAN solutions, which are being shipped in more than 25 mobile handset devices and cellular convergence products today. The platform uses the second generation of TI's Bluetooth/WLAN hardware and software coexistence package, enabling re-use of existing systems, quick time to market and antenna sharing, reducing the bill of materials (BOM) for manufacturers.

TI is currently sampling WiLink 5.0 solutions to select customers. TI will provide multiple package options, including on-board and module solutions. Wide sample availability of WiLink 5.0 solutions are expected to be available in late 2006. Handsets using the WiLink 5.0 platform are expected to be on the market in early 2007.

Source: Texas Instruments

Hitachi Introduces New Deskstar Hard Drives

Hitachi Global Storage Technologies today announced two new 3.5-inch hard drives : Deskstar T7K500 and Deskstar 7K160. Novelties feature 7,200 RPM spin speeds and 3Gb/s SATA interfaces. The new drives use 160GB+ per platter technology to deliver up to one-half terabyte (500GB) of storage capacity in a one-, two- and three-disk design.

Besides optional 3Gb/s SATA interfaces, both Deskstar drives feature Native Command Queuing (NCQ). NCQ is a method of controlling commands sent from the host processor to the drive to enable faster application activities for the end user.

The new Deskstar drives feature a fast interface transfer rate and available 16 MB data buffers on the Deskstar T7K500 SATA version for quicker system boot-up, screen refreshes and more efficient data processing. Hitachi's "Smooth Stream" technology also improves performance for audio/video storage applications.

Also, the Deskstar T7K500 and Deskstar 7K160 support "Thermal Fly Height Control" (TFC) to improve data integrity. TFC technology uses an internal thermal sensor that monitors temperature and makes adjustments to improve error rates in extreme temperature conditions. The drives also include an optional low power mode to minimize power requirements and enable cooler system operation.

The Deskstar drives protect customer data with up to 350 G (2ms) of non-operating shock for increased drive reliability and data protection. Both Deskstar models include Hitachi's load/unload technology, which provides a safety ramp for the read-write heads that help protect user data in non-power mode. Fluid dynamic bearing motors are also used to ensure "whisper-quiet" operation.

Hitachi's two new Deskstar drives meet the Restriction of Hazardous Substances (RoHS) compliance directive issued last year by the European Union (EU). The Deskstar drives are backed by Hitachi's renowned compatibility testing labs and worldwide distribution support. The drives, which carry three-year warranties, are expected to ship worldwide in early 3Q 2006.

Deskstar T7K500 Specifications:

  • 500/400/320/250 GB (GB = 1 billion bytes, accessible capacity may be less)
  • 998 Mb/s max. media data rate
  • 8.5 ms average seek time
  • 7,200 RPM, 4.17 ms average latency
  • ATA-133/Serial ATA 3.0 Gb/s
  • 8 MB data buffer – PATA
  • 16/8 MB data buffer - SATA
  • 26.1 mm in height (max)
  • 118 billion bits per square inch maximum areal density
  • 3/2 platters
  • 6/4 recording heads
  • 350 G (2ms) non-operating shock (2 disk)
  • 300 G (2ms) non-operating shock (3 disk)
  • 6.0 (3 disk)/5.0 (2 disk) watt idle power (Parallel ATA)
  • 7.0 (3 disk)/6.0 (2 disk) watt idle power (Serial ATA)
  • 3.0 (3 disk)/2.8 (2 disk) Bels typical idle acoustics
  • 0-60 degrees C operating temperature
  • Fluid Dynamic Bearing (FDB) spindle motor

Deskstar 7K160 Specifications:

  • 160/80 GB (GB = 1 billion bytes, accessible capacity may be less)
  • 966 Mb/s max. media data rate
  • 8.5 ms average seek time
  • 7,200 RPM, 4.17 ms average latency
  • ATA-133/Serial ATA 3.0 Gb/s
  • 8 MB data buffer
  • 26.1 mm in height (max)
  • 120 billion bits per square inch maximum areal density
  • 1 platter
  • 2/1 recording heads
  • 350 G (2ms) non-operating shock
  • 4.9 watt idle power (Parallel ATA)
  • 5.9 watt idle power (Serial ATA)
  • 2.5 Bels typical idle acoustics
  • 0-60 degrees C operating temperature
  • Fluid Dynamic Bearing (FDB) spindle motor

Source: Hitachi Global Storage Technologies

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