Siemens S55 officially announced

Sharp announces "a chip in the glass"

AMD Am29BDD160: flash memory for automotive environments

PNY announces memory module line

ASRock to announce the complete mobo line

ATI to leave Asian markets to partners

Siemens S55 officially announced

S55 has color display, extended organizer. Accessories include digital camera, Bluetooth headset. The package will also include the case and Car Kit Cradle.

Handset dimensions are 101x42x18 mm, weight — 85 g.

Sharp announces "a chip in the glass"

CG Silicon (Continuous Grain Silicon) technology enables to situate all the required circuitry on LCD monitor´s glass substrate. This combination is fundamentally impossible in the current amorphous or polycrystalline silicon displays.

At today´s presentation of CG Silicon the company showed the display prototype with embedded legendary 25-year old 8-bit Z80 processor, featuring 13,000 transistors, developed by Zilog in 1976 and produced by Sharp in 1977.

According to the developers, CG Silicon provides thrice faster response time than usual polycrystalline silicon structures. CGS panel appliances include a wide gamma of devices. Initially, they are expected to be used in PDAs and mobiles. As larger panels appear — in new high-definition displays and TVs. By 2005 the company is to establish production of display cards, that will be able to store data and will be used in PDAs, game devices, mobiles, navigation systems, etc.

Early in October Sharp launched volume production of "System LCD" panels at Tenri Plant in Japan. In October 2003 the new Mie Plant will join the production as well. Tenri Plant will produce up to 2.5 million of 2-inch conventional LCD panels on 620x750 mm substrates. The new Mie No. 3 Plant — up to 4 million of 2-inch conventional LCD panels on 730x920 mm substrates.

AMD Am29BDD160: flash memory for automotive environments

Am29BDD160 specifications:

• 66 MHz data rate, 264 MB/s data throughput
• 54 ns initial or random access, 8 ns burst access
• Simultaneous Read/Write
• User-definable 16-bit or 32-bit databus
• Interface for industry-standard microprocessors including Motorola MPC, Infineon Tri-Core, and Hitachi SH-4 series microcontrollers
• Advanced sector protection architecture
• Ultra-low power consumption (max 5 uA in standby, 30 mA @ 66MHz)
• Acceleration pin to increase in-factory programming performance
• 1 million write/erase cycles plus 20 years´ data retention at 125°C
• Extended temperature range (-40°C to +145°C)
• QS-9000 certification
• 80-Ball Fortified Ball Grid Array (Fortified BGA), 80-Ball Plastic Quad Flat Package (PQFP)

Am29BDD160 samples will cost $6.90 in over 10,000-unit quantities. Volume production is expected late in Q4 2002.

PNY announces memory module line

New 256MB and 512MB DDR SDRAM PC2700 are based on DDR333 chips. The company reports 100% modules to have passed the pre-sale testing and have 10-year warranty.

Naturally, their price is higher the market average: 256MB PC2700 cost about 169 euro, 512MB modules — 319 euro (w/taxes).

Source: 3D Chips-FR

ASRock to announce the complete mobo line

New products are promised to have very aggressive pricing (1.5-2x lower than ASUS´).

Intel P4:

• G Pro — Micro ATX, Socket 478, Intel Pentium 4, FSB 400 / 533 MHz, SiS650 (int. Real 256 3D, up to 64MB), up to 2GB DDR (2xDDR266/200) or 2GB SDRAM (2xPC133/100), AGP 4X/2X, 3xPCI 2.2, AMR, LAN 802.3u, 10/100 Ethernet LAN, 6-channel AC97, 4xUSB2.0
• PE Pro — ATX, Socket 478, Intel Pentium 4, FSB 400 / 533 MHz, SiS645, up to 2GB DDR (2 x DDR333/266/200) or 2GB SDRAM (2 x PC133/100), AGP 4X/2X, 6 È PCI 2.2, LAN 802.3u, 10/100 Ethernet LAN, 6-channel AC97, 4 È USB2.0
• GE Pro — ATX, Socket 478, Intel Pentium 4, FSB 400 / 533 MHz, SiS651 (int. Real 256 3D, up to 64MB), up to 2GB DDR (2 x DDR333/266/200) or 2GB SDRAM (2 x PC133/100), AGP 4X/2X, 6 È PCI 2.2, LAN 802.3u, 10/100 Ethernet LAN, 6-channel AC97, 4 È USB2.0
• P4I45D — ATX, Socket 478, Intel Pentium 4, FSB 400 / 533 MHz, Intel 845D, up to 2GB DDR (2 x DDR266/200) or 2GB SDRAM (2 x PC133/100), AGP 4X/2X, 5 È PCI 2.2, LAN 802.3u, 10/100 Ethernet LAN, 6-channel AC97, 4 È USB2.0
• P4I45L — Micro ATX, Socket 478, Intel Pentium 4, FSB 400 MHz, Intel 845GL (int. graphics, up to 32MB), up to 2GB DDR (2 x DDR266/200) or 2GB SDRAM (2 x PC133/100), 3 È PCI 2.2, AMR, LAN 802.3u, 10/100 Ethernet LAN, 6-channel AC97, 4 È USB2.0

AMD K7:

• K7VT2 — ATX, Socket 462 , AMD Athlon, Athlon XP, Duron, FSB 266/200 MHz, VIA KT266A, up to 2GB DDR (2 x DDR266/200) or 2GB SDRAM (2 x PC133/100), AGP 4X/2X, 5 È PCI 2.2, LAN 802.3u, 10/100 Ethernet LAN, AC97, 4 È USB2.0
• K7VM2 — MicroATX, Socket 462, AMD Athlon, Athlon XP, Duron, FSB 266/200 MHz, VIA KM266 (int. ProSavage8 3D, 32MB), up to 2GB DDR (2 x DDR266/200) or 2GB SDRAM (2 x PC133/100), AGP 4X/2X, 3 È PCI 2.2, AMR, LAN 802.3u, 10/100 Ethernet LAN, AC97, 4 È USB2.0
• K7S46 — ATX, Socket 462 , AMD Athlon, Athlon XP, Duron, FSB 333/266/200 MHz, SiS746FX, up to 3GB DDR (3 È DDR333/400), AGP 8X/4X, 6 È PCI 2.2, LAN 802.3u, 10/100 Ethernet LAN, 6-channel AC97, 4 È USB2.0

ATI to leave Asian markets to partners

ATI will continue to ship to European and North American markets, however it plans to coordinate the volumes with partners as well. By the year-end the total share of ATI products in the market will drop from 50% to 20-30%.

The partial withdrawal from the retail market won´t affect OEM contracts. Though in the future the company plans to "share" orders from large PC makers with its partners.

Source: The DigiTimes

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