Isonics gears up for delivering SOI wafers to AMD

2.8 GHz Pentium 4, 1.9 GHz Celeron and other changes of Intel´s roadmap

Photo of the day: Matrox Parhelia 512, introducing the chip

TSMC announces 35 nm transistor prototype

2È Blu-ray Disc from Pioneer and TDK

IBM sells out...

Isonics gears up for delivering SOI wafers to AMD

According to Isonics, the company agreed to deliver isotopically purified Si-28 to certain GlobiTech customers, besides AMD. Still Isonics goes further, also planning to become a SOI wafer supplier for AMD, which will reportedly use the products for its next-generation microprocessor lines.

The Texas GlobiTech has Class-1 cleanrooms (less than 0.5 Þm of dust per cubic foot) and produce 150- and 200-mm epitaxial products. Now the company gears up for 300-mm samples expected to be available in the 4Q, 2002.

2.8 GHz Pentium 4, 1.9 GHz Celeron and other changes of Intel´s roadmap

So, the release of 2.8 GHz Pentium 4, previously planned to the 4Q, is now moved to the 3Q. Besides, the quarter is to also bring us 2.5, 2.6, and 2.66 GHz models.

1.9 GHz Socket 478 Celeron is to be presented in September.

In general, there are reports that the company is satisfied mastering the 0.13 Þm process technology and plans to release about 33 million CPUs in 3Q, 2002. At that, the share of 533 MHz FSB Pentium 4 will supposedly make 46% along with 24% of 400 MHz FSB Pentium 4, 16% of Socket 478 Celeron, and 14% of Socket 370 Pentium III.

Photo of the day: Matrox Parhelia 512, introducing the chip

It´s really impressive. According to the head of our videolab, Andrew Worobyew, that´s not a chip, but a monster under a huge metal cover! :)

Pay special attention to PCB screening, it´s clearly seen near the chip.

TSMC announces 35 nm transistor prototype

The length of FinFET p-n junctions doesn´t exceed 35 nm, however TSMC staff says they could improve the FinFET technology and reduce the size even further down to 25 nm, keeping its electrical parameters suitable for industry. According to developers, they already have estimations enabling to further reduce the size in the future down to 9 (!) nm. But it´s still unknown if such transistors are to feature the same electrical parameters.

In order to reduce current leakage and semiconductor heating FinFET features the second gate. TSMC is sure that double-gating provides better control and reduces leakage, allowing the transistor size to be reduced further and current to be increased.

Well, we´ve seen it somewhere else: first, diode, then triode, tetrode, pentode, etc...

2È Blu-ray Disc from Pioneer and TDK

New discs are supposed to be fully compatible with 1È samples. They feature new magnetic coating metallic material. Other features:

• Storage capacity: 23.3/25 Gb
• Laser wavelength: 405 nm ("blue" laser)
• NA: 0.85
• Data transmission rate: 36 (1È) and 72 (2È) Mbps
• Disc diameter: 120 mm
• Disc thickness: 1.2 mm (with Optical Penetration Protection of 0.1 mm)
• Track pitch: 0.32 Þm
• Pit length: 0.16/0.149 Þm
• Record side density: 16.8/18.0 Gbit/sq.inch
• Record power: 4.5~6.0 mW

The companies plan to show the new technology at the international ISOM/ODS2002 conference to be held on July, 7-11 on the U.S. Hawaii island (the State of Hawaii).

IBM sells out...

IBM promised its staff to keep all 4000 work places after the sale of the second office in New York. At that the half of the staff remains in IBM and the second moves to the same positions to Endicott Interconnect Technologies Corporation after IBM becomes its client.

As the result of the first sale IBM shares dropped by $4.40 or 6.1 to $67.60 by the time of bids closure at the New York Stock Market.

Speaking of LSI Logic´s Mylex subsidiary sale, according to the contract with IBM, the company receives RAID controller, subsystem, component and software group. By the way, according to the agreement with IBM, LSI Logic gets access to Mylex channels, whose clients are IBM, NEC, Fujitsu-Siemens, Xyratex, and Eurologic.

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