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Renesas announces superSRAM memory

Japanese Renesas Technology announced the development of superSRAM memory that features new type of cells. According to the press release, new SRAM is theoretically free from soft errors due to a new type of memory cell combining an SRAM cell with a DRAM capacitor technology. Renesas is going to unveil more details about this innovation designed for mobile devices at 2004 Symposium on VLSI Technology. According to the press release, the main product features are:

  • High soft error tolerance — An approximately 4-digit improvement in the soft error rate compared with Renesas Technology´s previous 0.13 m process 16M-bit low-power SRAM (without ECC circuitry*3 ) has been achieved by providing a cylindrical capacitor*4, like the type used for DRAM cells, at each memory cell storage node*5. Alpha ray radiation experiments have confirmed for the first time that the SRAM performance is free of bit defects due to soft errors. The problem of soft error tolerance, which is a fundamental issue for conventional SRAM, has been solved, enabling highly reliable, high-density SRAM to be realized.
  • Industry´s smallest memory cell size for a 0.15 m process SRAM — The development of a new type of cell that combines an SRAM cell using TFTs*6 and a DRAM capacitor has resulted in the industry´s smallest memory cell size for a 0.15 m process SRAM: 0.98 m2. The cell size is less than half that of Renesas Technology´s current CMOS-based 0.15 m process SRAM. It will enable chip size to be greatly reduced and mobile devices to be made smaller. In addition, a data retention current of less than 1 A has been achieved. Unlike a pseudo-SRAM that employs DRAM memory cells, the new SRAM cell does not need refresh operations. That allows an approximately double-digit improvement in data retention current compared with a pseudo-SRAM, for lower power consumption in mobile applications.
  • Fabrication possible using existing 0.15 m process — Higher performance and a smaller cell area have been achieved without using special processes. Fabrication is possible using existing process technologies, enabling early introduction to the market.
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