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Toshiba showcases 512Mbit XDR DRAM chips

Japanese Toshiba launched shipments of its 512Mbit XDR DRAM chips operating at 3.2GHz. This memory is designed for broadband equipment, graphics systems, and consumer electronics. Based on Rambus XDR technology, Toshiba´s memory provides throughput 8 times higher than the existing high-end memory for PC.

Company´s TC59YM916AMG32A, TC59YM916AMG32B, TC59YM916AMG32C solutions have the following features:

Model TC59YM916AMG32A; TC59YM916AMG32B; TC59YM916AMG32C
Architecture 4 megabits word x 8 banks x 16 bits
Peak throughput 3.2Gbps
Clock, ns 40; 50; 60
Voltage 1.8V VDD
Interface DRSL (Differential Rambus Signaling Level)
Latency 27ns; 35ns; 35ns
Package 1.27x0.8mm BGA

Using 128-bit bus, you can get the throughput of 100GB/s, that´s 16 times more than the existing solutions can offer. XDIMM modules provide 12.8-25.6GB/s that´s 4 times higher than that of similar DDR2 SDRAM modules.

XDR topology

At the moment the license for Rambus memory interface is purchased by Samsung, Elpida, Toshiba. Being the market leaders, these can advance such memory in the market. Besides, Rambus provided makers with all information required for making XDR mainstream: specs of XDR DRAM chips with programmable packet length, organization, components (including buffers, clock generators), etc.

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