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New 0.13-micron UltraSPARC III Cu 1200 officially announced

Today at SunNetwork 2002 Conference Sun Microsystems officially announced new 64-bit UltraSPARC III Cu 1200 made using 0.13-micron process technology and copper conductors.

Chips are produced by Sun´s traditional partner Texas Instruments. Due to the new process technology, the energy consumption of new 1.2 GHz UltraSPARC III Cu is reduced from 75 W to 53 W at 14% clock rate growth comparing to 0.15-micron 1.05 GHz predecessor.

Texas Instruments launched Sun UltraSPARC III Cu 1200 production in July. Volume shipments of ready systems are expected within 120 days. Currently TI is developing a prototype of new UltraSPARC IV, combining two UltraSparc cores on a single crystal. Besides, the company prepares for 90-nm process technology testing early in 2003, that will be supposedly used for making UltraSparc V.

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