Sony Ericsson Debuts New Xperia Android Smartphones And Smart Extras

Elpida Readies To Mass-Produce 4-Layer 0.8-mm Mobile RAM Devices

OCZ Technology Introduces Deneva 2 Series of Enterprise SSDs

Sony Ericsson Debuts New Xperia Android Smartphones And Smart Extras

Sony Ericsson today broadened its portfolio with the introduction of two new Xperia smartphones, ray and active, both of which are based on Gingerbread 2.3. The company also announced the new Sony Ericsson txt feature phone and two Smart Extras that enhance the overall Sony Ericsson experience.

Xperia ray combines a slim 9.4-mm form factor with a high-quality aluminium frame and a 3.3-inch screen. This Android smartphone also contains a 1GHz processor and uses Sony technology such as Reality Display with Mobile BRAVIA engine and a 8.1-megapixel camera with Exmor R for mobile sensor. Xperia ray will be available globally in select markets, including Japan, from Q3.

Xperia active is a compact device that features a 3-inch screen, a 1GHz processor and a 5-megapixel camera. It is also dustproof and water-resistant. This smartphone features a corner user interface which comes pre-loaded with sports apps that enable users to easily track their fitness levels. By using the built-in GPS, barometer and compass in combination with the on-screen heart rate and pulse monitor (enabled by ANT+ wireless networking technology), and the iMapMyFitness app, users can monitor their day to day performance. Xperia active will be available globally in select markets from Q3, 2011.

Sony Ericsson txt is a feature phone aimed at providing consumers with specifications inspired by Xperia at an affordable price. It features a full QWERTY keyboard and a 2.6-inch screen and incorporates an SMS shortcut key for fast messaging. It also comes equipped with a "friends" application that enables users to see Facebook and Twitter updates at a glance from their top five friends. Sony Ericsson txt will be available globally in selected markets from Q3.

Aside from new smartphones, Sony Ericsson also announced two new Smart Extras: LiveDock multimedia station and LiveSound Hi-Fi headset.

LiveDock gives consumers the ability to integrate their Sony Ericsson smartphone into their home. By simply connecting their smartphone to the docking station, consumers will be able to launch applications from the Android Market and charge their phones at the same time. LiveDock will be available globally in selected markets from Q3.

As for the LiveSound headphones, they also allow consumers to remotely access applications from the phone through LiveKey control, which provides direct access to applications with a simple push of a button. LiveSound will be available globally in select markets from Q3, 2011.

Source: Sony Ericsson

Elpida Readies To Mass-Produce 4-Layer 0.8-mm Mobile RAM Devices

Elpida Memory today announced that they have developed the technology to mass-manufacture a 0.8-mm 4-layer DRAM package, the thinnest memory device in the DRAM industry. The package consists of four low-power consumption 2-gigabit DDR2 Mobile RAM chips and is assembled using Package on Package (PoP) technology.

The yields and costs of the new package are the same as for the existing (previous) 1.0-mm products. The next step is an ultra-thin 0.8-mm PoP consisting of 4 layers of 4-gigabit products.

Volume production of the four-layer 0.8-mm PoP products is expected to begin in the July-September 2011.

Speaking of the PoP technology itself, it's used to assemble and test different kinds of semiconductor chips in individual packages. These packages are then stacked atop each other to form a PoP configuration. Since PoP technology enables to reduce mounting space and wire length, the technology is gaining popularity in the mobile device market.

PoP advantages:

• By stacking multiple packages, mounting space on devices and appliances can be reduced.
• Individual packages can be tested, which helps lower yield loss.
• Reduction in wire length is achieved, minimizing the impact of reflection and noise generated when memory and ASIC chips are combined.
• By replacing stacked chips, memory density increases and other upgrades can be easily accomplished, enabling significant reduction in development costs and time.

Source: Elpida Memory

OCZ Technology Introduces Deneva 2 Series of Enterprise SSDs

OCZ Technology Group launched the Deneva 2 SSD line for enterprise clients. Taking advantage of the SATA 6Gb/s interface, Deneva 2 SSDs are designed for a wide range of enterprise applications including servers, cloud computing, and data centers.

The Deneva 2 series features several enterprise-critical options not available in OCZ's consumer product lines, including power loss data protection, improced endurance (e.g., minimal write amplification, intelligent block management and wear-leveling), advanced encryption and ECC.

Based on SandForce SF-2000 SSD processors, the Deneva 2 series delivers up to 80K 4KB random write IOPS and 550MB/s of potential bandwidth. The new SSDs are also designed to deliver improced reliability and are manufactured with the latest flash components specific to the customer's needs. In addition, the series includes enterprise-grade multi-level cell (eMLC) NAND flash technology, which offers improved endurance for write-intensive applications. Deneva 2 SSDs can also be customized, come in a wide variety of interface options including PCIe, and are available in 2.5, 3.5, and 1.8-inch form factors for use in very high density computing environments, including blade servers.

Source: OCZ Technology Group

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