Elpida Readies To Mass-Produce 4-Layer 0.8-mm Mobile RAM Devices

Elpida Memory today announced that they have developed the technology to mass-manufacture a 0.8-mm 4-layer DRAM package, the thinnest memory device in the DRAM industry. The package consists of four low-power consumption 2-gigabit DDR2 Mobile RAM chips and is assembled using Package on Package (PoP) technology.

The yields and costs of the new package are the same as for the existing (previous) 1.0-mm products. The next step is an ultra-thin 0.8-mm PoP consisting of 4 layers of 4-gigabit products.

Volume production of the four-layer 0.8-mm PoP products is expected to begin in the July-September 2011.

Speaking of the PoP technology itself, it's used to assemble and test different kinds of semiconductor chips in individual packages. These packages are then stacked atop each other to form a PoP configuration. Since PoP technology enables to reduce mounting space and wire length, the technology is gaining popularity in the mobile device market.

PoP advantages:

• By stacking multiple packages, mounting space on devices and appliances can be reduced.
• Individual packages can be tested, which helps lower yield loss.
• Reduction in wire length is achieved, minimizing the impact of reflection and noise generated when memory and ASIC chips are combined.
• By replacing stacked chips, memory density increases and other upgrades can be easily accomplished, enabling significant reduction in development costs and time.

Source: Elpida Memory

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