Microsoft Launches SideWinder X4 Keyboard With Advanced Anti-Ghosting Technology
Intel, Micron Introduce 25nm NAND
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Microsoft Launches SideWinder X4 Keyboard With Advanced Anti-Ghosting Technology
Microsoft Hardware launched the SideWinder X4 Keyboard featuring company's most advanced anti-ghosting technology. Developed by the Applied Sciences Group, this new technology ensures gamers' most complex key combinations will be recognized by the computer to keep the game in action. The new keyboard also supports macro recording, mode and profile switching, and adjustable backlighting.
The advanced technology allows gamers to press up to 26 keys at once. Because each key is scanned independently by the keyboard hardware, each key press is correctly detected regardless of how many other keys are being pressed at the same time.
The SideWinder X4 Keyboard also offers more of the features gamers need to stay at the top of their game. Macro recording lets them string together multiple moves into one press of a button, and the new automatic macro repetition feature lets them repeat the macro over and over as needed with one key. Mode and profile switching also provides easy ways to customize the keyboard for different games and users while adjustable backlighting lets gamers select the lighting level that meets their needs.
The SideWinder X4 Keyboard will be available in March 2010 for the estimated retail price of $59.95 and will be available for pre-sale on Amazon.com later this week. The SideWinder X4 Keyboard is backed by a worldwide three-year limited hardware warranty.
Source: Microsoft
Intel, Micron Introduce 25nm NAND
Intel Corporation and Micron Technology today announced the world's first 25nm NAND technology, which provides a more cost-effective path for increasing storage capacity in such popular consumer gadgets as smartphones, personal music and media players (PMPs), as well as the new high-performance class of solid-state drives (SSDs).
Manufactured by IM Flash Technologies (IMFT), Intel and Micron's NAND flash joint venture, the 25nm process produces 8GB of storage in a single NAND device, creating a high-capacity storage solution for today's tiny consumer gadgets. It measures just 167mm2 -- small enough to fit through the hole in the middle of a CD, yet packs more than 10 times the data capacity of that CD.
The 25nm, 8GB device is sampling now and is expected to enter mass production in the second quarter of 2010. For consumer electronics manufacturers, the device provides the highest-density in a single 2 bits-per-cell MLC die that will fit a thin small-outline package (TSOP). Multiple 8GB devices can be stacked in a package to increase storage capacity. The new 25nm 8GB device reduces chip count by 50 percent compared to previous process generations, allowing for smaller, yet higher density designs and greater cost efficiencies. For example, a 256GB solid-state drive (SSD) can now be enabled with just 32 of these devices (versus 64 previously), a 32GB smartphone needs just four, and a 16GB flash card requires only two.
Source: Intel Corporation
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