Samsung Launches Ultra Edition 13.8 (Z720) Thinnest HSDPA Slider Samsung Reveals First Gigabit-Density Mobile DRAM Samsung Launches Ultra Edition 13.8 (Z720) Thinnest HSDPA Slider Samsung Electronics launched the Ultra Edition 13.8 (Model: SGH-Z720), which is the thinnest HSDPA slide-up mobile with a slim 13.8mm profile. It is powered by High-Speed Downlink Packet Access (HSDPA) for data transmission speeds at 1.8 Mbps - up to six times faster than 3G UMTS technology. The Ultra Edition 13.8 (Z720) weighs 80 grams. It comes packed with a 3-megapixel AF camera. The wide dimension of 104.5x51.3mm allows for a generous 2.1" QVGA display and also WAP 2.0 and HTML browsing capabilities are supported. The Ultra Edition 13.8 (Z720) also includes a second camera for video telephony. The document viewer, voice memo and PIM features are also present. The Ultra Edition 13.8 (Z720) supports microSD external memory and is equipped with Bluetooth and USB connectivity. The phone also supports Samsung's newest uGo and uTrack interfaces. The uGo interface automatically responds to the user's environment and displays a city landmark of where you are located, adjusts the picture to represent day or night, and adjusts the time to reflect user's location automatically. The uTrack interface sends an SMS message to a predetermined number to alert the user of changes in the mobile' s SIM card, as well as the location to increases the chances of recovering a lost or stolen phone. In addition, the Ultra Edition 13.8 (Z720) is the first mobile handset from Samsung installed with Google mobile search and Gmail which enables consumers to search for information, and manage their emails on the move. It includes a Google icon in the application menu, offering one-click access to Google search. Samsung's Ultra Edition 13.8 (Z720) has been launched in major European countries this month and will soon be available throughout Europe. Specifications:
Source: Samsung Electronics
Samsung Reveals First Gigabit-Density Mobile DRAM Samsung Electronics announced that it has developed the industry's first one gigabit Mobile DRAM for mobile products, using 80nm process technology. The new 1Gb Mobile DRAM chip uses the same packaging technique as the 512Mb double-die stack 1Gb package, however it introduces a new temperature-sensing feature. This new temperature-compensated, self-refresh feature maximizes the self-refresh cycle to reduce power drain in standby mode by 30 percent over conventional memory chip designs. Also offering a more compact form factor, the new 1Gb Mobile DRAM chip is at least 20 percent thinner than a multi-stack package of 512Mb dies, allowing a single high-density package solution of 1.5Gb or even 2Gb Mobile DRAM memory, for which market demand is expected to grow in 2007. One 1Gb mobile DRAM also can be combined with Flash memory in multi-chip packaging including package-on-package designs. Samsung plans to mass produce the new device beginning in the second quarter of 2007 at a time when demand for high-density 1Gb mobile DRAM is expected to be very high. Source: Samsung Electronics
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