Evercool introduced at Computex 2006 its enclosure, graphics and CPU coolers.
The most original processor cooler is Silver Knight. It actually resembles a knight's helmet:
Two more heatpipe coolers:
The company also introduced enclosure blowers Fox-1, Fox-2, Fox-3 differing of different efficiency:
Turbo2, a universal graphics cooling system:
This time our reporter at Computex 2006 visited the booth of CoolerMaster that introduced several novelties among the already familiar products. These include Hyper Sphere and Space Navi heatpipe coolers, CM Media BTX 260 enclosure for Intel Viiv systems.
At Computex NVIDIA's products are presented on numerous stands of its partners. Let's take a look at the most interesting exhibits.
GIGABYTE showcases a gaming motherboard GA-M59SLI-55 based on NVIDIA's most powerful nForce 590 SLI chipset.
Then there's MSI M675 notebook with NVIDIA's GeForce Go 7600 graphics.
What does NVIDIA have in relation with LG's mobile phones? But the LG KC8100 smartphone utilizes NVIDIA GoForce 4000 accelerator that provides enough performance for a 2.4" QVGA display.
Having moved to the 90nm process technology in its GPU manufacture NVIDIA managed to reduce their heat emission, which enabled to use passive cooling like in ASUS's EN7600GT Silent cooled by SilentCool II.
NVIDIA's most powerful mobile graphics -- GeForce Go 7900 GTX with 512MB VRAM is used in Dell's XPS M1710 gaming notebook.
For those NVIDIA fans which think a single top-end graphics card is not enough, Alienware showcased the Aurora mALX based on dual GeForce Go 7900 GTX connected via SLI. Chipset used is nForce4 SLI MCP.
And another interesting notebook is presented by Acer -- Aspire 9110 -- supporting NVIDIA PureVideo HD.
Finally, here's Motorola showcasing new RAZR V3x with GoForce 4800.
Of course, the company has its own booth where you can play the latest games on powerful machines, watch some high-definition movies and even choose yourself a mobile handset.
Wenchi Chen, president and CEO of VIA Technologies, on June 7 laid out the company's strategy of continuing to push the limits on miniaturization of the PC platform based on its self-developed chip solutions. Meanwhile, Chen gave a preview of "John", the next advance in the VIA CoreFusion processor platform series that combines a VIA C7-M mobile processor core with VIA's upcoming VX700 mobile chipset.
As a processor plus core logic in a single, complete package, "John" will play an important role in maintaining the pace of miniaturization, especially in the mobile space, when it is launched later this year, according to Chen. Motherboards based on the VIA "John" platform are expected to be available in the fourth quarter of 2006, said Chen.
Chen also stated that the company's VIA C7-M mobile processor family can be benefited by growing demand for the convergence of notebooks and handhelds into new device categories such as Ultra-Mobile PCs (UMPCs), like those of partners TabletKiosk and PBJ, and PC phones, such as DualCor's PC, which combines full PC functionality with a PDA and a phone in a ultra compact handheld form factor.
Chen cited recent statistics compiled by IDC as stating that VIA has succeeded in taking 51% of the worldwide embedded platform market used in Thin Client PC applications, with orders from international Thin Client vendors Wyse, Neoware, Hewlett Packard (HP) and recently-added customers BCOM Computer Center, Termtek Computer, Tul and DT Research. VIA is aiming for the leading position in the UMPC-use embedded solution market worldwide, according to Chen.
IN-WIN showcased a large number of PC enclosures: Ñ603, S606, S605, C6004, Z687, V606, Z589, Z583, Z602, Z605, Z606, which is natural.
The company also showcased reade BTX media centers.
We'll start the tour around the booth of Zalman with a new media PC enclosure HD 160 XT that features a 1024x768 LCD display. It shows the same information that a connected plasma or LCD panel, but unoptimized font are obviously more readable on it. Naturally it also shows temperature, etc.
Next, you can see a couplt of fanless enclosures, which are actually massive heatsinks. Thanks to heatpipes, these solutions are silent.
Then there's an updated version of Reserator 1 cooling system -- Reserator 1 v.2. The key difference is a sensor that can signal about system failures and even shut down a PC.
Of more traditional fan cooliing we should mention a lot of modifications of CNPS9500 CPU cooler. This very model supports AMD Socket AM2, Fatal1ty series modification.
Finally, note the efficient graphics card cooler VF900. It features a couple of heatpipes and dual ball bearing fan.
It makes 18.5 dBA noise in the silent mode at 1350 rpm. Peak noise rotation speed is 2400 rpm at 25 dBA noise. The speed can be controlled with a supplied Fan Mate 2. Heatsink fins are 0.2mm thick, their number is increased. The heatsink is made of copper and the vendor doesn't plan an AlCu model. Zalman VF900-Cu is sized 96x96x30mm at 187g weight.
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