Computex: VIA Previews "John" For Ultra-Mobile PCs
Wenchi Chen, president and CEO of VIA Technologies, on June 7 laid out the company's strategy of continuing to push the limits on miniaturization of the PC platform based on its self-developed chip solutions. Meanwhile, Chen gave a preview of "John", the next advance in the VIA CoreFusion processor platform series that combines a VIA C7-M mobile processor core with VIA's upcoming VX700 mobile chipset.
As a processor plus core logic in a single, complete package, "John" will play an important role in maintaining the pace of miniaturization, especially in the mobile space, when it is launched later this year, according to Chen. Motherboards based on the VIA "John" platform are expected to be available in the fourth quarter of 2006, said Chen.
Chen also stated that the company's VIA C7-M mobile processor family can be benefited by growing demand for the convergence of notebooks and handhelds into new device categories such as Ultra-Mobile PCs (UMPCs), like those of partners TabletKiosk and PBJ, and PC phones, such as DualCor's PC, which combines full PC functionality with a PDA and a phone in a ultra compact handheld form factor.
Chen cited recent statistics compiled by IDC as stating that VIA has succeeded in taking 51% of the worldwide embedded platform market used in Thin Client PC applications, with orders from international Thin Client vendors Wyse, Neoware, Hewlett Packard (HP) and recently-added customers BCOM Computer Center, Termtek Computer, Tul and DT Research. VIA is aiming for the leading position in the UMPC-use embedded solution market worldwide, according to Chen.
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