As you know, BenQ Mobile first introduced P50 at CES 2005. And now the novelty, which is one of the most anticipated business-class PDA/smartphones, reaches the retail in Europe.
BenQ PDA P50 Features:
The packagee includes Li-Ion battery, travel charger, leather case, stylus, cleaning tools, screen protector, user's guide, USB cable, BenQ Companion CD.
P50 is already retailing in Great Britain at around $650. It's also offered by Vodafone-Expansys.
Kenwood introduced such an interesting device, Kenwood HDV-770, that combines a portable TV, a GPS unit, and a PMP supporting MP3, WMA, MPEG, and featuring a hard drive and an optical drive. Moreover, the device can connect iPods and has a nice 3D software interface. However, the price is rather considerable - about $1875.
GIGABYTE today launched the GV-NX73G128D, nVIDIA's first 90nm manufactured entry-level graphics card based on the nVIDIA GeForce 7300GS GPU, integrated with high performance 128MB GDDR2 memory. Due to the new process of the GPU, the core clock has increased to 550MHZ. Moreover, the GV-NX73G128D utilizes GIGABYTE's new patented "Screen-Cooling" thermal technology.
GIGABYTE's GV-NX73G128D features 4 pixel and 3 vertex pipelines, supports Turbo Cache technology that speeds up graphical renderings. Also supported is the CineFX 4.0 engine, HDR (High Dynamic Rendering), Intellisample 4, Microsoft DirectX Shader Model 3.0, PureVideo.
Speaking of the "Screen-Cooling" technology, this fanless solution has extended heatsink makes the low profile PCB to a standard ATX sized bracket. The heat sink with special screen design uses the natural airflow into the case for cooling down. Furthermore, the extended metal cover is able to protect the VGA cable and provide a useful handling.
Intel announced it has become the first company to reach an important milestone in the development of 45 nanometer (nm) logic technology. Intel has produced what are believed to be the first fully functional SRAM (Static Random Access Memory) chips using 45nm process technology, its next–generation, high–volume semiconductor manufacturing process.
Achieving this milestone means Intel is on track to manufacture chips with this technology in 2007 using 300mm wafers, and continues the company's focus on pushing the limits of Moore's Law, by introducing a new process generation every two years.
Intel's 45nm process technology will allow chips with more than five times less leakage power than those made today. This will improve battery life for mobile devices and increase opportunities for building smaller, more powerful platforms.
The 45nm SRAM chip has more than 1 billion transistors. Though not intended as an Intel product, the SRAM demonstrates technology performance, process yield and chip reliability prior to ramping processors and other logic chips using the 45nm manufacturing process. It is a key first step in the march toward high–volume manufacturing of the world's most complex devices.
In addition to the manufacturing capabilities of its D1D facility in Oregon, where the initial 45nm development efforts are underway, Intel has announced two high–volume fabs under construction to manufacture chips using the 45nm process technology: Fab 32 in Arizona and Fab 28 in Israel.
Transcend Information released its latest, tiny Hi-Speed USB Flash Drive, the JetFlash 150. The JetFlash 150 is, according to the press release, "a brighter more colorful way of carrying around your data and information". Its design makes it small enough to fit on a key chain, so it can be taken anywhere.
The JetFlash 150 is available in a range of color-coded memory capacities, including 256MB (Metallic Green), 512MB (Blue), 1GB (Red), and 2GB (Metallic Silver). It comes bundled with Password (password protect the data on your JetFlash 150), PC-Lock (lock your PC when you are away from it) and Boot-Up (configure the JetFlash 150 as a bootable drive) software.
Source: Transcend Information
Oxford Semiconductor announced it has added a new controller to its line of connectivity solutions. Combining eight Universal Asynchronous Receiver-Transmitters (UARTs) and a PCI-compliant host interface in a single chip, the OX16PCI958 communications controller is claimd to provide designers with the means to dramatically simplify multi-port serial to PCI bus design.
An alternative to many dual-chip solutions, the OX16PCI958 is compliant with the PCI local bus specification 3.0 and PCI power management specification 1.1 and benefits a wide range of PCI-based hardware applications, including POS equipment, industrial automation systems and remote servers.
The highly integrated OX16PCI958 offers PCB space savings, and by supporting both 3.3V and 5.0V bus systems, this cost-effective part enables the development of add-in cards with universal application appeal. Highly programmable, the controller offers deep FIFOs with tunable trigger levels, hardware out-of-band flow control and a clock prescaler enabling designers to optimize data flows and configure application specific data rates up to a maximum of 4.125Mega baud using a 16.5MHz clock. The OX16PCI958 is software compatible with industry standard 16C550 types and the UART ports are easily configured to suit the needs of RS232 and RS422 applications.
Oxford Semiconductor is supporting its latest high performance UART/PCI bridge solution with drivers for Windows 98, 2000, XP and CE as well as Linux operating systems, an evaluation board and comprehensive application note.
The OX16PCI958 is priced at $15.50 USD in 10,000 piece quantities and is sampling now.
Source: Oxford Semiconductor
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