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Infineon Announces New TV Tuner ICs For Portables

VIA Begins Sampling of VIA K8T900 Chipset

Micron And Intel Create New Company To Manufacture NAND Flash Memory

Infineon Announces New TV Tuner ICs For Portables

Infineon today introduced its new tuner ICs TUA6041 and TUA6045 specifically designed for portable applications such as laptops, USB dongles and PDAs. Both ICs are claimed to be the industry’s first single conversion tuners operating at a supply voltage of 3V, halving their power consumption and heat dissipation. The TUA6041 and TUA6045 integrate the RF (Radio Frequency) and IF (Intermediate Frequency) functions in one chip improving system reliability and decreasing the footprint area of the tuner IC by around 50 percent to 49 mm?.

Live demonstrations of the new Infineon TUA6041 and TUA6045 will be exhibited at the China Digital Consumer Electronics Component Exhibition in Shanghai (November 22-25, 2005, booth 1CG7).

The supply voltage ranging from 5.5V to 3V allows manufacturers of tuners and end-user equipment to adjust the tuner IC according to the system's power requirements. Power consumption is further reduced thanks to the stand-by mode function while a selectable narrow or wide band Automatic Gain Control improves the TV reception quality. In addition to manual alignment, the TUA6041 features automatic digital alignment by the means of software during basic set-up in the production process - a feature addressing mainly end-user equipment manufacturers as it avoids the manual alignment in their manufacturing process.

Samples of the TUA6041 and TUA6045 are available now. Volume production is planned for the end of Calendar Year 2005.

Source: Infineon

VIA Begins Sampling of VIA K8T900 Chipset

VIA Technologies today announced that its latest chipset for the AMD platform, the VIA K8T900, is sampling to motherboard partners.

The chipset supports the proprietary RapidFire technology that is said to incorporate a number of PCI Express enhancements. The Flex Express architecture adds support for dual x8 PCI Express connections or alternatively a standard single x16 PCI Express graphics connection. In combination with the VIA VT8251 South Bridge the K8T900 platform offers additional six x1 PCI Express connections and up to four SATA 3.0Gb/s ports, and VIA Vinyl High Definition audio.

VIA K8T900 is also designed to be pin-compatible with existing VIA K8T890 chipset platforms.


  • Supports AMD Athlon 64 / Athlon 64 FX / Opteron / Sempron processors (939, 940 & 754-pin)
  • VIA Flex Express Architecture
  • PCI Express Dual x 8 Graphics / PCI Express x16 Graphics
  • 4 x PCI Express x1 (3 when using dual PCI-E x8 ports)
  • VIA Hyper8 Technology with 1GHz/16-bit (per direction) HyperTransport processor-to-chipset link
  • Asynchronous bus architecture
  • Ultra V-Link 1066 MB/sec North/South Bridge interconnect
  • Integrated VIA Vinyl HD Audio and support for Vinyl Gold Multichannel HD Audio Suite
  • Serial ATA support for up to 4 devices
  • Integrated V-RAID with RAID 0, RAID 1, RAID 0+1, RAID 5 and JBOD (SATA) support
  • Support for up to 4 SATA 3.0Gb/s devices
  • Parallel ATA133/100/66 support for up to 4 devices
  • Support for up to 8 USB 2.0/USB 1.1 ports, UHCI compliant
  • Support for VIA Gigabit Ethernet companion controller & Integrated 10/100 Fast Ethernet MAC
  • Integrated MC'97 Modem
  • Advanced power management capabilities including ACPI/OnNow
  • 933-pin BGA North Bridge
  • 645-pin BGA VT8251 South Bridge

VIA K8T900 is expected to be available in volume quantities in Q1 2006.

Micron And Intel Create New Company To Manufacture NAND Flash Memory

Micron and Intel announced they have agreed to form a new company, IM Flash Technologies, LLC, to manufacture NAND flash memory for use in consumer electronics, removable storage and handheld communications devices. The new company will exclusively manufacture product for Micron and Intel. Formation of the company is subject to customary closing conditions and is expected to be finalized around the end of the year.

In addition and subject to the closing of the venture, Intel and Micron have each entered into separate long-term agreements to supply Apple with a significant portion of each of their share of IM Flash Technologies’ NAND flash memory output. As part of these agreements, Apple would prepay $250 million each to Intel and Micron.

Intel and Micron have agreed to initially contribute approximately $1.2 billion each in cash, notes and assets to IM Flash Technologies. Subject to certain conditions, the parties will each contribute an additional approximately $1.4 billion over the next three years and intend to make additional investments as appropriate to support the growth of the operation. The company will be 51 percent owned by Micron and 49 percent owned by Intel. Production will initially take place in manufacturing facilities located in Boise, Idaho, Manassas, Va. and Lehi, Utah. Initial production from the company is expected in early 2006.

Source: Intel

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