ASUS Introduces A New Webcam Notebook

Fujitsu Siemens Computers Launches Pocket LOOX N Series With Integrated GPS

OCZ Technology Announces The First Products To Implement The New OCZ XTC Heatspreader

New Firmware For Canon EOS 350D/20D/20Da D-SLRs

IBM Delivers Power-Based Chip For Microsoft Xbox 360 Worldwide Launch

ASUS Introduces A New Webcam Notebook

ASUS today launched the M9 Series as the newest addition to its video conferencing notebook series with built-in webcam. The M9 offers a 14.1" display (Color Shine glare-type LCD), Bluetooth V2.0+EDR, 2-spindle design, 4-in-1 card reader and Audio DJ.

M9 Specifications:

• Intel Pentium M Processor 700 Sequence (1.60-2.13GHz, 533 MHz, 2MB L2 Cache)
• Mobile Intel 915PM (M9V); 915GM (M9A) Express Chipset
• Intel PRO/Wireless 2915ABG Network Connection
• Microsoft Windows XP Home/Professional
• DDRII 533MHz, up to 1536MB
• 14.1" XGA LCD; 14.1" XGA Color Shine LCD (optional for M9V)
• 40/60/80/100GB
• 0.35M pixel webcam
• ATI Mobility Radeon X600SE 128MB or 256MB Hypermemory (M9V); Embedded 915GM (M 9A )
• 4 x USB, TV-Out, Card Reader, Bluetooth V2.0+EDR (optional feature)
• 31x25.5x2.2cm (min.) 1.97 KG

Source: ASUS

Fujitsu Siemens Computers Launches Pocket LOOX N Series With Integrated GPS

Fujitsu Siemens Computers recently presented its first handheld with integrated antenna and GPS functionality. The Pocket LOOX N500 and Pocket LOOX N520 are delivered with Microsoft Windows Mobile 5.0 Premium Edition and with NAVIGON MobileNavigator 5 as an option. In addition, the Pocket LOOX N520 is equipped with Wi-Fi certified wireless LAN.

Technical highlights:

• Intel PXA270 312 MÃö (Intel XScale)
• 3.5", 240x320, 65K-color TFT touchscreen LED display
• 128MB in N520, 64MB in N500; 64MB ROM
• 1200mAh Li-Ion battery
• Integrated GPS
• Microsoft Windows Mobile 5.0 Premium Edition
• Optional: NAVIGON MobileNavigator 5
• SD-I/O / MMC slot
• MP3 player
• Integrated wireless LAN 802.11g Wi-Fi certified (Pocket LOOX N520)
• Fujitsu Siemens Computers Software Suite

Both handhelds have a new slim-line design and are available now from trade outlets at a price starting at €335 and €361 respectively (plus VAT).

Source: Fujitsu Siemens Computers

OCZ Technology Announces The First Products To Implement The New OCZ XTC Heatspreader

OCZ Technology Group announced the PC-3200 and PC-3500 Gold GX series modules which will be the first two products to utilize the latest OCZ heatspreader design. The new, patent-pending XTC (Xtreme Thermal Convection) Heatspreaders allow increased ventilation and heat dissipation due to an innovative honeycomb design providing more direct access to the actual memory ICs.

The PC-3200 and PC-3500 Gold Gamer eXtreme Series with 2-2-2-5 timings will be the first OCZ memory parts to include the new XTC heatspreader.

The PC-3200 & PC-3500 Gold GX XTC series will be available in 512MB modules and 1GB (2x512) dual channel optimized kits.

Source: OCZ Technology Group

New Firmware For Canon EOS 350D/20D/20Da D-SLRs

Canon BeBit page was updated with new firmware for Canon EOS 350D, 20D, and 20Da digital SLR cameras.

EOS 350D DIGITAL Firmware Update Version 1.0.3:

• Fixes the phenomenon of shots being unable to be taken when using the remote controller RC-1.
• Fixes the phenomenon wherein the camera continues to scroll through images being played back.
• Improves reliability in communication when using some CF cards.

EOS 20Da Firmware Update Version 2.0.3:

• Fixes a problem in color temperature information transmission that occurred when using Speedlite 430EX.
• Improves reliability in communicaion when using CF cards.

EOS 20D Firmware Update Version 2.0.3:

• Fixes a problem in color temperature information transmission that occurred when using Speedlite 430EX.
• Improves reliability in communicaion when using CF cards.

Source: Canon BeBit

IBM Delivers Power-Based Chip For Microsoft Xbox 360 Worldwide Launch

At Fall Processor Forum in San Jose, California, IBM announced the custom designed microprocessor built for Microsoft's Xbox 360 console is in production at the company's East Fishkill, N.Y. fab and at Chartered Semiconductor Manufacturing in Singapore.

The chip features a customized version of IBM's 64-bit PowerPC core. The chip includes three of these cores, each with two simultaneous threads and clock speeds greater than 3GHz. It features 165 million transistors and is fabricated using IBM's 90 nanometer Silicon on Insulator (SOI) technology to reduce heat and improve performance. The chip also provides 21.6 GB/s FSB architecture.

Other Xbox 360 chip features include:

• 3 identical multi-threaded PowerPC-based CPU cores operating at 3.2 GHz enhanced with specialized function VMX acceleration for gaming applications and high speed 128-bit vector unit
• 1MB shared L2 cache with custom logic for high-speed data streaming for graphics and system applications
• 5.4 Gb/s per-pin Front Side Bus (with an aggregated bandwidth of 21.6 GBs)
• Highly configurable and programmable utilizing e-fuse technology

Source: IBM

Write a comment below. No registration needed!