IBM Delivers Power-Based Chip For Microsoft Xbox 360 Worldwide Launch
At Fall Processor Forum in San Jose, California, IBM announced the custom designed microprocessor built for Microsoft's Xbox 360 console is in production at the company's East Fishkill, N.Y. fab and at Chartered Semiconductor Manufacturing in Singapore.
The chip features a customized version of IBM's 64-bit PowerPC core. The chip includes three of these cores, each with two simultaneous threads and clock speeds greater than 3GHz. It features 165 million transistors and is fabricated using IBM's 90 nanometer Silicon on Insulator (SOI) technology to reduce heat and improve performance. The chip also provides 21.6 GB/s FSB architecture.
Other Xbox 360 chip features include:
- 3 identical multi-threaded PowerPC-based CPU cores operating at 3.2 GHz enhanced with specialized function VMX acceleration for gaming applications and high speed 128-bit vector unit
- 1MB shared L2 cache with custom logic for high-speed data streaming for graphics and system applications
- 5.4 Gb/s per-pin Front Side Bus (with an aggregated bandwidth of 21.6 GBs)
- Highly configurable and programmable utilizing e-fuse technology
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