Philips plans to release two new Fisio mobiles: Fisio 825 and Fisio 625.
Dual-band GSM 900/1800 Bluetooth-enabled Fisio 825 is an updated version of Fisio 820. It will feature:
Pricing information is unavailable yet.
Dual-band GSM 900/1800 Fisio 625 is an updated version of Fisio 620. It will also feature E-Mail client, GPRS, speakerphone, caller photo (b/w), EMS, polyphony. Fisio 625 is to be announced in October. Pricing information is unavailable as well.
IT7-MAX2 V2.0 features ATX design and has 3 DIMM sockets (up to 2GB DIMM DDR 200/266/333), 4 PCI slots, AGP 4È, 2-channel Serial ATA, 2-channel IDE ATA 133 RAID (HPT374, RAID 0, 1, 0+1), 6-channel AC´97, S/PDIF, 10/100M Ethernet LAN (RTL8100B), USB 2.0 and IEEE 1394. Optionally, the board features Media XP external interface.
Next year ESP processors, used in Eden, are expected to reach 1GHz and higher (currently there are ESP4000, ESP5000, and ESP6000 chips, featuring 400MHz, 533MHz, 667MHz clocks, respectively). Now the company prepares to release ESP8000 and ESP10K with 800MHz and 1GHz, respectively. ESP8000 is expected to feature Nehemiah core, next generation after VIA C3.ESP10K will feature the next generation core (Esther?) after Nehemiah, supporting SSE/SSE2 (FYI: ESP8000 will support only SSE). ESP8000 is expected to appear in November, volume shipments are scheduled to Q1 2003. ESP10K will be announced in Q3 2003, volume shipments wil begin in Q4 2003. According to provisional data, ESP8000 / ESP10K will require up to 6W/8W.
For the sake of justice I´d mention that 1Ghz C3 with Ezra-T core, officially announced in August, but not volume-produced since then, was removed from the roadmap. Now C3 line by 933 MHz chip.
1GHz chip was replaced by Nehemiah-based CPU. In Q4 this year VIA plans to ship 1GHz Nehemiah-based processor, supporting MMX and SSE1. 1.1/1.2/1.3/1.4 GHz products are scheduled to the next year. Unlike, Eden ESP roadmap, SSE/SSE2 support is not present in the processor roadmap. Does it mean that due to Intel´s Socket 370 support cancellation, VIA will only advance its Eden platform and won´t release "discrete" processors? It´s early to guess, but this seems rather real...
Currently, Eden platform features PLE133, Mobile Twister-T, Twister-T DDR, CLE266, VT694X, or Pro266T Northbridges, combined with VT686B, VT8231, or VT8235 Southbridges. Closest VIA plans include the release of new CLE++ Northbridge with CastleRock II integrated graphics (CLE266 utilizes CastleRock), in combination with new VT8237 Southbridge.
You can visit Matrox RMA yourself and find 256MB (PH-A256 / PH-A256B) and 64MB (PH-A64B) products in the end of the list after 128MB cards (PH-A128B / PH-A128R).
Further information is only a rumour. Supposedly, Taiwanese UMC, contract chip maker, currently prepares for produce 0.13-micron Parhelia GPUs (the current Matrox Parhelia-512 is made using 0.15-micron process technology). Perhaps, such chips will appear within a month or two. And maybe after that new AGP 8x cards, based on these chips, will be released including mentioned versions. (Again, these are rumours from a single source only).
Matsushita Electric announced DMC-FZ1 to sell it in the Japanese market from November for $490.
The camera features 12x optical DC VARIO-ELMART lens from German Leica Camera AG (13 lens in 8 groups, 35-420 mm in 35-mm equiv.), Optical Image Stabilizer (OIS) for better zoomed shooting, 2.11-meghapixel CCD (2.0 million effective).
Minimal shooting range is 30 cm in the normal mode, 5 cm in the Macro mode. The camera utilizes SD/MMC media, supports JPEG, QuickTime Motion JPEG w/sound; max. image size 1600x1200, movie 320x240. The camera is equipped with 1.5-inch LCD (114,000 pixels).Kingston Technology announced new 256MB and 512MB PC3200 (DDR400) memory modules under its ValueRAM brand.
New Kingston´s modules were tested on the Agilent 83000 platform and in current DDR400-enabled chipsets.
Kingston will release the following modules:
256MB and 512MB DDR400 modules are expected in Q4 2002.
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