SMART Modular Introduces Lineup of Ultra Low Profile DDR3 Registered DIMMs
SMART Modular Technologies announced a new line of ultra low profile (ULP) DDR3 Registered DIMMs (RDIMMs) for advanced telecommunications computing architecture (ATCA) blade platforms used in telecom, networking, and embedded computing applications. SMART's comprehensive line of new RDIMMs has been designed to satisfy stringent thermal performance specifications.
Aimed at a wide variety of ATCA applications, the new modules offer configurations ranging from single-rank 1GB and 2GB ULP RDIMMs to dual-rank 2GB and 4GB ULP RDIMMs. All of the modules use power-saving 8-bit DDR3 DRAMs and are available in PC3-8500 (DDR3-1066) and PC3-10600 (DDR3-1333) speed grades.
Designed for space-constrained implementations, SMART's ULP RDIMMs have a height of 17.9mm rather than the industry-standard 18.75mm. SMART's unique design helps save valuable board space by allowing for vertical DIMM placement in platforms that use a top cover and have a maximum clearance of 21.57mm.
The new ULP RDIMMs offer improved thermal performance by maximizing airflow over and through the DIMMs. For applications with more stringent thermal requirements, SMART offers optional flat, clip-on heat spreaders that do not add any additional height to the modules. SMART's ATCA modules support parity and have a standard on-board thermal sensor.
The new modules are available now.
Source: SMART Modular Technologies
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