SMART Modular Introduces Its First Dual-Channel DDR2 DIMMs And Mini-DIMMs
SMART Modular Technologies has launched new lines of dual-channel DDR2 DIMMs and Mini-DIMMs. Targeted at data networking and communications, storage, 3G wireless infrastructure, and high-density computing applications, these two new families of DDR2 modules may be configured as two 32-bit wide channels with seven bits of error correction code (ECC).
Both lines of SMART's new DIMMs and Mini-DIMMs are optimized to be used with Broadcom’s quad-core 64-bit MIPS processor. Each 1GB module has two 512MB channels configured as 128Mx39 and allows simultaneous operation with each of the four SB-1 high-performance processors contained in the BCM1480.
Combining the new SMART modules with the Broadcom processor helps achieve higher aggregate system performance for enterprise-class router and switches, high-end RAID system arrays, storage area networks, and high-density computing applications. The dual-channel modules enable the workload of the quad-core processor to be shared across multiple cores that rely on very high-speed interconnects and high bandwidth pipes to the memory and input/output. All four cores have access to the same shared pool of system resources, including memory and I/O. The memory controller on the BCM1480 interfaces with the ZBbus, supports DDR2-800 at up to 100 Gbits/s, and can be configured as four 32-bit channels.
For applications that can distribute shared memory or coherent shared memory, support is provided to enable up to eight Broadcom chips (or 32 SB-1 CPU cores), each with separate channels of SMART memory, to communicate with each other over HyperTransport, as if they were all cores on a single chip. This feature enables the design of dense computing or processing clusters for performance scaling on a board or within a system.
For maximum flexibility, SMART offers its dual-channel modules in two form factors. The VLP (Very Low Profile 0.72”) version is a 240-pin unbuffered ECC DIMM. The 244-pin Mini-DIMM has a height of 1.45” and allows for a maximum density of 2GB using 1Gb devices. Each module type can be matched with the vertical, angled, or horizontal connector type that is best suited for the application. The part numbers and specifications for the new dual-channel DIMMs are listed in the table below:
Source: SMART Modular Technologies
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