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IDF Spring 2004: FB-DIMM and Memory Implementers Forum. The nearest future of DDR2

Today IDF Spring 2004 brought the official announcement of a new memory manufacturers alliance Memory Implementers Forum. The new industrial organization already has over a dozen members, including Intel, Dell, HP, ATP Electronics, Buffalo Technology, Corsair Memory, Denali Software, Elpida Memory, Hynix Semiconductor, IDT Corporation, Infineon Corporation, Kingston Technology, Micron Technology, Nanya Technology, Samsung, and WinTec Industries.

MIF will focus on developing memory technologies like DDR2, that is expected to become one of the key desktop and server component this year, and Fully Buffered-DIMM (FB-DIMM), a new memory bus standard, naturally serial, called to replace the existing DIMM designs in the future. FB-DIMM support in DDR2 is already implemented in Intel´s future architectures.






If you are willing to know more details about FB-DIMM, you should visit MemForum official website that has a number of important documents puslibhed. And we´ll continue our report and describe Intel´s plans to support the new memory types.


As you can see, the freshest roadmap already mentions FB-DIMM scheduling it to next year for the server market. The industry will continue is smooth transition from Low Power SDRAM to low-power DDR. As for RDRAM, it´s intended for the comm market.

DDR2 400/533 support is scheduled to this year. According to provisional information, it will be implemented into all major market segments in the nearest future. And here´s the validation and mass production chart of Intel´s partners:



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