iXBT Labs - Computer Hardware in Detail

Platform

Video

Multimedia

Mobile

Other

Latest News


 « Previous Day News Archive  

300mm AMD Fab 36 officially: financing, partners, plans...

The place for the new AMD fab has been finally selected. Yesterday evening the company officially laid the first foundation stone of AMD Fab 36 that will be designed for making <65nm chips from 300mm wafers.

AMD Fab 36 will be constructed in Dresden, Saxony countryside as a part of AMD Dresden Fab 36 LLC & Co. KG. Its production lines will be located nearby operating AMD Fab 30.


A model of the future 300mm AMD Fab36, west side




A model of the future 300mm AMD Fab36, east side

AMD Fab 36 is expected to produce cips in volumes in 2006. It will host about 1000 workers, mostly expert engineers.

AMD Fab 36 will be equipped with all the latest technologies. In particular, its produciton lines will feature AMD´s patented Automated Precision Manufacturing, APM 3.0þ Achieving full capacity in 2006 the fab is expected to produce 13 thousands 300mm wafers monthly. Later the yield is to grow up to 20 thousands wafers per month.

The capital expenditures are estimated $2.4 billion with $1.5 biliion external financing. According to the press release, the external financing is expected to include up to approximately $700 million in loans from a consortium of banks, including an 80 percent residual guarantee from Germany and Saxony, approximately $500 million in anticipated grants and allowances from the Germany and Saxonian governments (pending European Union Commission approval), and up to approximately $320 million in equity funding from Saxony and a group of European investors led by M+W Zander. The balance of the financing will be provided by AMD and other potential partners.

Of course, funds will be allocated gradually. As you know, over 70% of modern fab construction is about purchasing hi-tech equipment, so Fab36 gradual financing will help to carry such expenditures burden.

It´s also interesting that at the construction launch ceremony Hector Ruiz, president and CEO at AMD, said about the significant similarity between processes used at IBM´s 65nm 300mm fab in East Fishkill, NY and AMD´s Fab36. Thus, despite the lack of additional comments from AMD, we can assume that IBM will remain the AMD´s largest technology partner all these years.

 « Previous Day News Archive  

Write a comment below. No registration needed!




blog comments powered by Disqus

  Most Popular Reviews More    RSS  

AMD Phenom II X4 955, Phenom II X4 960T, Phenom II X6 1075T, and Intel Pentium G2120, Core i3-3220, Core i5-3330 Processors

Comparing old, cheap solutions from AMD with new, budget offerings from Intel.
February 1, 2013 · Processor Roundups

Inno3D GeForce GTX 670 iChill, Inno3D GeForce GTX 660 Ti Graphics Cards

A couple of mid-range adapters with original cooling systems.
January 30, 2013 · Video cards: NVIDIA GPUs

Creative Sound Blaster X-Fi Surround 5.1

An external X-Fi solution in tests.
September 9, 2008 · Sound Cards

AMD FX-8350 Processor

The first worthwhile Piledriver CPU.
September 11, 2012 · Processors: AMD

Consumed Power, Energy Consumption: Ivy Bridge vs. Sandy Bridge

Trying out the new method.
September 18, 2012 · Processors: Intel
  Latest Reviews More    RSS  

i3DSpeed, September 2013

Retested all graphics cards with the new drivers.
Oct 18, 2013 · 3Digests

i3DSpeed, August 2013

Added new benchmarks: BioShock Infinite and Metro: Last Light.
Sep 06, 2013 · 3Digests

i3DSpeed, July 2013

Added the test results of NVIDIA GeForce GTX 760 and AMD Radeon HD 7730.
Aug 05, 2013 · 3Digests

Gainward GeForce GTX 650 Ti BOOST 2GB Golden Sample Graphics Card

An excellent hybrid of GeForce GTX 650 Ti and GeForce GTX 660.
Jun 24, 2013 · Video cards: NVIDIA GPUs

i3DSpeed, May 2013

Added the test results of NVIDIA GeForce GTX 770/780.
Jun 03, 2013 · 3Digests
  Latest News More    RSS  

Platform  ·  Video  ·  Multimedia  ·  Mobile  ·  Other  ||  About us & Privacy policy  ·  Twitter  ·  Facebook


Copyright © Byrds Research & Publishing, Ltd., 1997–2011. All rights reserved.