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AMD Hammer chipsets change names and specs

Though AMD Hammer processors are expected for sale only in the fourth quarter, chipset makers continue to hone their products. VIA Technologies, to improve competitive ability of its chipsets, decided to change their packages to inexpensive BGA (ball-grid array). Only K8HTA chipset was to feature BGA package before, and K8HTB and K8UMA were to be packaged into FC-PGA.

Besides, chips were renamed as follows: K8HTA, K8HTB and K8UMA are now K8T400, K8T400M and K8M400, respectively.

SiS, having already presented its discrete SiS755 chipset, plans to prepare new integrated SiS760 chipset for production in the fourth quarter. Getting ready for tight competition with VIA, SiS plans to release more advanced versions of its products featuring AGP 8x support, IEEE 1394, USB 2.0 controllers built into the Southbridge, etc.

Chipset designers: AMD K8-platform products
  Chipset Launch South bridge Specifications Note
VIA KBT400 (K8HTA) June 2002 VT8235 AGP 8x
USB 2.0
8-bit V-Link bus
BGA packaging
K8T400M (K8HTB) July 2002 VT8235 AGP 8x
USB 2.0
8-bit V-Link bus
Changed to BGA packaging
KBM400 (K8UMA) 4Q 2002 VT8235 AGP 8x
USB 2.0
8-bit V-Link bus
Changed to BGA packaging
Integrated chipset (Zoetrope-core)
SiS SiS755 June 2002 SiS962 AGP 8x
USB 2.0
IEEE 1394
Discrete chipset
SiS760 4Q 2002 SiS962 AGP 8x
USB 2.0
IEEE 1394
Integrated chipset
ALi M1687 June 2002 M1563 AGP 8x
USB 2.0
Discrete chipset
M1688 - - - -

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