AMD Hammer chipsets change names and specs
Though AMD Hammer processors are expected for sale only in the fourth quarter, chipset makers continue to hone their products. VIA Technologies, to improve competitive ability of its chipsets, decided to change their packages to inexpensive BGA (ball-grid array). Only K8HTA chipset was to feature BGA package before, and K8HTB and K8UMA were to be packaged into FC-PGA.
Besides, chips were renamed as follows: K8HTA, K8HTB and K8UMA are now K8T400, K8T400M and K8M400, respectively.
SiS, having already presented its discrete SiS755 chipset, plans to prepare new integrated SiS760 chipset for production in the fourth quarter. Getting ready for tight competition with VIA, SiS plans to release more advanced versions of its products featuring AGP 8x support, IEEE 1394, USB 2.0 controllers built into the Southbridge, etc.
|
Chipset designers: AMD K8-platform products | |
|
Chipset |
Launch |
South bridge |
Specifications |
Note | |
VIA |
KBT400 (K8HTA) |
June 2002 |
VT8235 |
AGP 8x
USB 2.0
8-bit V-Link bus |
BGA packaging | |
K8T400M (K8HTB) |
July 2002 |
VT8235 |
AGP 8x
USB 2.0
8-bit V-Link bus |
Changed to BGA packaging | |
KBM400 (K8UMA) |
4Q 2002 |
VT8235 |
AGP 8x
USB 2.0
8-bit V-Link bus |
Changed to BGA packaging
Integrated chipset (Zoetrope-core) | |
SiS |
SiS755 |
June 2002 |
SiS962 |
AGP 8x
USB 2.0
IEEE 1394 |
Discrete chipset | |
SiS760 |
4Q 2002 |
SiS962 |
AGP 8x
USB 2.0
IEEE 1394 |
Integrated chipset | |
ALi |
M1687 |
June 2002 |
M1563 |
AGP 8x
USB 2.0 |
Discrete chipset | |
M1688 |
- |
- |
- |
- |
Write a comment below. No registration needed!
|
|
