Yesterday, several sources at once published images of a booklet claimed to be photographed by a print shop worker. The booklet is either a manual, or an ad of a full-frame Nikon D700 DSLR.
Images look convincing, so we might see Nikon's second full-frame camera debut in the near future.
According to these images, D700 is rather attractive. To sum up the text, D700 will feature a full-frame 12.1-megapixel CMOS sensor, 51-point Multi-CAM3500FX focusing sensor used in the top-end D3, 14-bit ADC, dustproof body made of magnesium alloy.
According to some other information, the novelty will cost less than $3000 and will be officially presented in July or August.
While Intel Centrino 2 has not been released yet, but notebooks on it, or at least information on those are filling the Web. DreamBook Style 9008 was one of the first such solutions in April followed by products from ASUS and Packard Bell.
Less known companies are joining as well. So, according to the source, Santech prepared its Santech X46 notebook claimed to be a gaming machine. It features a 15.4" display, Core 2 Duo T9600 CPU and NVIDIA GeForce 9600M GT graphics.
The novelty is expected go on sale in Europe on June 30 for about 1000 USD.
Source: Notebook Italy
Toshiba Corporation today announced that it has developed a new compact model for circuit design that achieves higher gate density and improved cost-performance in next-generation 45nm CMOS technology. By applying this technique, gate density for 45nm CMOS technology is boosted to 2.6 times higher than that of 65nm CMOS technology, and surpassing the gain of 2.0 times that is the typically expected technology trend in generational migration.
Circuit design layout, particularly proximity (proximity effect), is the dominant factor in the variability of transistor performance, and gate density also plays an important role in chip cost. By applying this technique to the design in 45nm CMOS technology, Toshiba achieves both high performance and cost competitiveness in system LSI.
The newly developed technique was reported on June 18th at Session 9.3 of Symposia on VLSI Technology 2008, in Honolulu, Hawaii, USA.
Toshiba has developed the new technique, which predicts the performance of each transistor individually, by focusing on factors dependent on circuit layout. In 65nm CMOS technology, gate length, gate width and the distance between the gate and isolation area (see Fig. 1) are considered in design, as major factors affecting transistor performance. In advanced 45nm CMOS technology and beyond, additional factors such as the space of gates and locations of contacts (see Fig. 2) are modeled and fed into the design. Toshiba's new technique estimates each transistor characteristics and feeds them into the circuit design. As a result, Toshiba has achieved higher gate density without increasing the margin for variability in design.
Fig. 1 Transistor factors dependent on circuit layout
Advances in process technology have required shorter gate lengths in CMOS process technology, and application of stress enhancement techniques (see below) has proved effective as a means to improve transistor performance. However, from the 45nm CMOS generation, gate length scaling will advance significantly, and the application of stress enhancement techniques will produce complicated variability as a result of dependence on layout in the design. This issue could be evaded in earlier generations by setting an additional design margin for safer design or by restricting the pattern and design. However, this approach sacrifices improvement in gate density and is insufficient for the 45nm CMOS generation and beyond.
Stress enhancement technique: Increasing carrier mobility in CMOS transistor is an effective means to obtain better transistor performance. Carrier mobility can be modulated by applying strain at transistors. Toshiba new technique utilizes this phenomenon. Various techniques for effectively imposing stress at the transistor channel area have been proposed, for example, forming stress films over transistors, or embedding stress films on both sides of the transistor gates. However, these stress enhancement techniques create a complicated proximity effect dependant on actual transistor layout and causes concerns for increased variability in transistor performance.
Fig. 3 Advanced process technology and transistor gate density
Source: Toshiba Corporation
Sony introduced the first high-definition camcorder with both Smile Shutter and face detection technologies.
The HDR-CX12 Memory Stick Handycam camcorder can record full 1920 x 1080 HD video and 10-megapixel photos on Sony Memory Stick PRO Duo media and any Memory Stick PRO Duo (Mark2) media cards. Roughly the size of a soda can (2.8-inches wide by 5.3-inches tall by 2.8-inches deep), this ultra-compact model will allow for easy transfer of video and stills from media cards to a compatible PC to share via email, uploading to the Internet or burning to disc.
With Sony's Smile Shutter technology you can capture smiling photos and record video at the same time. When activated the technology will detect and automatically take a photo when your subject smiles - without having to switch to photo mode or press the photo button.
It also features child and adult prioritization so you can capture photos when your intended subject group smiles. This camcorder can also detect and capture a smile while in standby mode – just aim the camcorder and you'll capture smiling moments.
In addition to face detection technology, the camcorder is packed with features such as ClearVid CMOS sensor with Exmor-derived technology for improved video detail and clarity, a BIONZ imaging processor, an advanced Carl Zeiss Vario-Sonnar T* 12x optical zoom lens and Super SteadyShot optical image stabilization.
The model has a 2.7-inch Clear Photo LCD Plus screen, Dolby Digital 5.1-channel surround sound recording and a built-in zoom microphone. It has an assignable dial that can be customized to manually control focus, brightness and white balance.
The camcorder will ship with a supplied 4GB Memory Stick PRO Duo (Mark2) media card. A supplied Handycam Station cradle makes for easy DVD creation with its One Touch Disc Burn button. Also bundled is Picture Motion Browser software to view, organize and store video and photos on a compatible PC.
The HDR-CX12 camcorder will be in stores early August for about $900. Online pre-orders will begin on June 20th here.
IBM's hybrid supercomputer, built for the National Nuclear Security Administration's (NNSA) Los Alamos National Lab, burned its way into the TOP500 Supercomputer record book as the most powerful system in the world. Its sustained performance of 1.02 petaflops (1.02 quadrillion calculations per second) puts the system in a class of its own – more than three times faster than the nearest non-IBM system.
The official results were reported during the International Supercomputing Conference in Dresden, Germany, where the bi-annual listing of the World's TOP500 Supercomputer Sites was released.
The system gets its power from 12,240 IBM PowerXCell 8i Cell Broadband Engine processors – derived from chips that power today's most popular videogame consoles. 6,562 AMD Opteron Dual-Core processors perform basic compute functions, freeing the IBM PowerXCell 8i chips for the math-intensive calculations that are their specialty.
This "hybrid" architecture, which optimizes the strength of multiple types of processors, is an IBM hallmark. The design is analogous to that of a hybrid car with similar benefits. For example, if the NNSA supercomputer were built with standard x86 chips alone, the system would have been significantly larger and would have required much more power.
The No.2 fastest computer in the world is an IBM Blue Gene/L system at NNSA's Lawrence Livermore National Lab in California, which clocked in at 478 teraflops (478 trillion calculations per second.) Team Blue Gene also held the No.3 spot with a 450 teraflop performance from the Blue Gene/P system housed at the Department of Energy's Argonne National Lab in Chicago.
Tech ARP published information on Intel's desktop chipset roadmap, as of June 2008.
"With those chipsets fresh out of the oven, there will be nothing new from Intel until the end of the year when Intel is scheduled to launch the X58 Express (Tylersburg) chipset together with the Intel Bloomfield (Nehalem desktop) processor. It will use the same ICH10/ICH10R south bridge as the Intel 4 Series chipsets."
The complete newspiece is here.
Our colleagues over at Chile Hardware obtained information on a new version of AMD AOD overclocking utility. The screenshot is pretty self-explanatory.
And the 2.11 beta itself is available at RapidShare. RAR password: www.chw.net.
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