DALSA Unveils New 4-Megapixel High Quanta CCD Image Sensors
Toshiba and NEC Jointly Develop 32-nm System LSI Process Technology
DALSA Unveils New 4-Megapixel High Quanta CCD Image Sensors
DALSA Corporation today announced the availability of the High Quanta family of sensors tailored for scientific, life sciences, and astronomy applications. DALSA’s High Quanta sensors are large format area sensors that provide a new benchmark in imaging performance. Using advanced fabrication techniques to realize smaller CCD transistor structures, these sensors achieve improvements in noise performance and quantum efficiency (QE), peaking at more than 75%. The new sensors also employ the latest designs in output amplifiers providing exceptionally low noise at high data rates.
The High Quanta family currently includes three sensors with resolutions of 2084 x 2084, 1044 x 1044 and 524 x 524 and feature a 24 µm size pixel. Subsequent sensors in this family will feature similar resolutions with a 12 µm pixel size and the same high QE. For those applications demanding ultra violet (UV) sensitivity and >90% QE, back side thinned (BST) devices will be available on a custom basis.
Source: DALSA Corporation
Toshiba and NEC Jointly Develop 32-nm System LSI Process Technology
Toshiba Corporation and NEC Electronics Corporation today announced that the companies have agreed to collaborate on the development of system LSI process technology for the 32-nanometer generation.
Toshiba and NEC Electronics have been working together on 45nm process technology development since February 2006 at Toshiba's Advanced Microelectronics Center in Yokohama. Under the new agreement, the two companies will extend the scope of their collaboration at the site to the 32nm generation, with the aim of accelerating development and sharing development costs.
At the 32nm generation, extremely advanced technologies and significant development resources are required to secure improvements in performance and power consumption. As a result, global semiconductor companies are responding by establishing alliances to achieve more resource-efficient development of process technologies. Toshiba and NEC Electronics have decided to combine their efforts in process technology development for production of devices based on 32nm technology.
The development of derivative and differentiated process technologies will be discussed separately by the two companies. Additionally, Toshiba and NEC Electronics continue to discuss joint manufacturing, and expect to reach a decision concerning this in 2008.
Source: Toshiba
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