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LG Introduces Viewty Camera Phone

IDF: Intel Demonstrates First 32nm Chip and Next-Gen Nehalem Microprocessor Architecture

IDF: Intel Reveals Plans for 2008

IDF: USB3.0 Specs Expected in H1 2008

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Pepcom Holiday Spectacular Coverage Pt 1 @ DragonSteelMods
IDF 07 SF: PCI-Express 3.0 and USB 3.0 @ Techgage
IDF 07 SF: Skulltrail - High-End Has New Meaning @ Techgage
Gigabyte iSolo 210 Computer Chassis Review @ Tweaknews.net
GH Interview: Tabula Rasa - You ask the questions!
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The iPhone in Today's World @ BlueTomorrow
1080p Projector Buying Guide @ Digital Trends
Tabula Rasa hands-on PC Preview @ TweakTown
OCZ PC2-9200 FlexXLC 2GB Dual Channel Memory Review @ PCStats
INTEL QX6850 Quad Core Extreme Processor Review @ HardwareLogic
NesteQ ECS 5001 500W PSU Review on Technic3D

LG Introduces Viewty Camera Phone

LG Electronics and DivX today announced their partnership to enable consumer media experience with the LG Viewty (LG-KU990), a new 5.0 mega-pixel digital camera phone available from LG Mobile. The DivX Mobile Certified LG Viewty supports DivX playback and joins the over 100 million DivX Certified devices shipped into the market today, including DVD players, in-car devices, digital still cameras and more.

The LG Viewty enables consumers to playback a wide range of DivX files from the PC on the go or output to a TV monitor without converting to another format. Consumers can also view DivX files from online video communities such as Stage6.com at ten times the speed of WCDMA through the HSDPA 3.6 high speed internet access capability.

According to the press release, the LG Viewty boasts a number of "world first" features, including 120 fps video recording, manual camera focus, image stabilizer and handwriting recognition that makes editing easy on the Viewty’s 3-inch wide LCD touch screen.

LG Viewty will go on sale from mid-October starting from Europe and on to other regions.

Source: LG Electronics

IDF: Intel Demonstrates First 32nm Chip and Next-Gen Nehalem Microprocessor Architecture

Intel Corporation President and CEO Paul Otellini showed the industry's first working chips built using 32-nanometer technology. Intel's 32nm process technology is on track to begin production in 2009.

Otellini also described the upcoming 45nm family of Penryn processors, which are based on the high-k metal gate transistor technology. The industry's first 45nm processors will be available from Intel in November. The company also demonstrated for the first time the next-generation chip architecture codenamed Nehalem, due out next year.

When Intel introduces Penryn in November, it will be the first high-volume 45nm processor. Penryn, along with the Silverthorne family of 45nm processors (available next year) will have the small feature size, low-power requirements and high-performance capabilities to meet a wide variety of computing needs from handhelds to servers. Intel is going to introduce 15 new 45nm processors by the end of the year and another 20 in the first quarter of 2008.

Otellini also announced that Intel's 45nm processors and 65nm chipsets would use halogen-free packaging technology beginning in 2008 to improve energy efficiency.

Looking to 2008, Otellini made the first public demonstration of Intel's Nehalem processor and said the company is on track to deliver the new processor design in the second half of the year. The Nehalem architecture will be the first Intel processor to use the QuickPath Interconnect system architecture. Quickpath will include integrated memory controller technology and improved communication links between system components to improve overall system performance.

Describing other innovations, Otellini showed the world's first 300mm wafer built using next-generation 32nm process technology. Intel's 32nm test chips incorporate logic and memory (SRAM) to house more than 1.9 billion transistors. The 32nm process uses the company's second-generation high-k and metal gate transistor technology.

Otellini also announced that a version of a Penryn dual-core processor operating at 25 watts will be available on the upcoming Montevina platform, which will include Intel's mobile WiMAX silicon. Several equipment manufacturers are already planning to introduce Montevina-based notebook PCs starting next year when the platform is introduced.

Source: Intel Corporation

IDF: Intel Reveals Plans for 2008

Intel Corporation executive Patrick Gelsinger gave a variety of updates on Intel's work with the industry on the company's processors, surrounding technologies and "tick-tock" design cadence, including new details on Intel's upcoming 45-nanometer products.

During his speech, Gelsinger showed the first-ever Intel 45nm High-k metal gate next-generation microarchitecture (Nehalem) dual-processor server that uses the hafnium instead of silicon in portions of the 700 million-plus transistors inside the processor die, which is about the size of a postage stamp. Nehalem is the codename of a new processor microarchitecture arriving in 2008 that will provide up to three times the peak memory bandwidth of current competing processors. He also showed broad industry support for the Intel QuickPath Architecture. The QuickPath Interconnect provides high-speed data paths to Nehalem's processor cores.

Gelsinger reviewed Intel's QuickAssist Technology and its escalation of industry product development. QuickAssist Technology, first disclosed at the IDF in Beijing in April, is Intel's suite of hardware and software technologies addressing the requirements of accelerators in enterprise platforms. He reviewed the first Intel device to include the Intel QuickAssist Integrated Accelerator for cryptography, codenamed Tolapai.

With availability targeted for 2008, Tolapai – a system on a chip – is claimed to deliver improvements in power-efficient performance and form factor with up to eight times the IP Security throughput, up to 20 percent reduction in power, and up to a 45 percent smaller footprint over previous multi-component security solutions in embedded and communications market segments.

On the heels of the latest-generation roll-out of Intel vPro processor technology, Gelsinger revealed plans to further evolve security and PC management through the 2008 product codenamed McCreary. McCreary will include new halogen and lead-free 45nm dual and quad-core processors, a new chipset codenamed Eaglelake, an integrated Trusted Platform Module (TPM) and a more secure, manageable data encryption solution codenamed Danbury.

Danbury technology builds data encryption and decryption directly into the hardware providing greater protection of encryption keys and allows much simpler system management and key recovery. Intel Active Management technology also enables these operations to occur in "out-of-band" environments, meaning even if the OS is down or inoperable.

Gelsinger also discussed the improvements that solid state disk technology can bring to enterprise server and storage technology for IA platforms. He announced that products delivering substantial improvements in read performance and power savings from Intel utilizing non-volatile memory technology will be available next year.

Gelsinger shared his vision for I/O consolidation on Ethernet and steps to get to a converged network that supports both Fibre Channel over Ethernet (FCoE) and local area networks. In support of this vision, he announced availability of Intel 82598 10 Gigabit Ethernet Controller now with full support for FCoE solution stack coming in 2008.

Source: Intel Corporation

IDF: USB3.0 Specs Expected in H1 2008

Intel Corporation along with HP, Microsoft Corporation, NEC Corporation, NXP Semiconductors and Texas Instruments Incorporated have formed the USB 3.0 Promoter Group to create a faster personal USB interconnect that can deliver over 10 times the speed of today's connection. The technology will target fast sync-and-go transfer applications in the PC, consumer and mobile segments that are necessary as digital media become ubiquitous and file sizes increase up to and beyond 25 Gigabytes.

USB 3.0 will create a backward-compatible standard with the same ease-of-use and plug and play capabilities of previous USB technologies. Targeting over 10x performance increase, the technology will draw from the same architecture of wired USB. In addition, the USB 3.0 specification will be optimized for low power and improved protocol efficiency. USB 3.0 ports and cabling will be designed to enable backward compatibility as well as future-proofing for optical capabilities.

Intel formed the USB 3.0 Promoter Group with the understanding that the USB-IF would act as the trade association for the USB 3.0 specification. A completed USB 3.0 specification is expected by the first half of 2008. USB 3.0 implementations will initially be in the form of discrete silicon.

Source: Intel Corporation

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