OCZ Technology Group announced the PC2-9600 Flex XLC series. The PC2-9600 Flex modules are guaranteed to run at 1200MHz with ease thanks to the component screening and thermal management of "Flex."
The new DDR2-1200 modules feature OCZ’s original Flex XLC (Xtreme Liquid Convention) heatsinks which delivers improved heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. The Flex XLC module was engineered with this “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation. Thanks to OCZ’s Flex XLC heat management solution, the OCZ PC2-9600 operates with an optimal balance of extreme speeds and low latency without the high temperatures that inhibit or damage the module’s ICs.
The PC2-9600 Flex XLC modules are optimized for the latest cutting edge platforms and will be available in 2GB (2x1024MB) dual channel kits. As part of OCZ’s line-up of premium memory, the DDR2-1200 series is backed by a Lifetime Warranty.
Source: OCZ Technology Group
SiS announced that the first SiSM671-based notebook PC, Clevo M721S/M720S, is introduced to market. This new model is co-developed by SiS and Clevo, and is compatible for Windows Vista.
The Clevo M721S/M720S combines 12.1" LCD monitor and weighs 1.8kg. Among everything else, it offers customers UMTS/HSDPA support and a fingerprint scanner.
With SiSM671 integrated chipset, Clevo M721S/M720S notebook PCs supports Intel Core 2 Duo, Pentium 4 and Pentium D processors. Also, it supports up to 4GB of DDR2-667/533 memory. Embedded with SiS Mirage 3 graphics engine, which supports DirectX 9.0, Vertex Shader 2.0 and Pixel Shader 2.0.
The SiSM671 Northbridge is coupled with the SiS968 Southbridge. It supports PCI Express x1 interface, Serial ATA, 3 x USB2.0 ports, HDA and 10/100Mbps Ethernet.
Tyan Computer Corporation launched the Tempest i5000VS (S5372-LC), the latest Intel platform featuring the Intel 5000V chipset (codenamed Blackford-VS), with complementary support of Quad-Core & Dual-Core Intel Xeon processors.
Tempest i5000VS (S5372-LC), the compacted CEB (12" x 10.5") motherboard supports two quad-core or dual-core processors (Intel Xeon 5100/5100-LV/5300-LV/5300(80W) series) and six FBDIMM slots, offering up to 24GB of fully buffered DDR2-533/667 memory. The S5372-LC also accommodates multiple PCI Express/PCI-X expansion slots and a Remote System Management IPMI 2.0. The Tyan Taro card is additionally equipped on the SO-DIMM slot, providing support of SAS and SATA ports and RAID 0, 1 & 10, to comply with various applications and objectives.
The Tempest i5000VS (S5372-LC) will sample to selected customers in early Q2 of this year and will reach mass availability by mid Q2.
Source: Tyan Computer Corporation
Describing the latest trends in mobile computing at the Intel Developer Forum today, Intel Corporation executives said that personalization and content are key drivers behind increased demand for notebook PCs and mobile Internet devices (MIDs).
"The Internet is one of the driving forces in today's PC market and there is a desire for the Internet to be mobile," said David (Dadi) Perlmutter, Intel senior vice president and general manager, Mobility Group. "Intel is serving the market today with notebook PCs, and will expand its reach by adding WiMax to notebooks as well as small form factor MIDs in 2008."
Perlmutter continued by discussing the importance of high-performance processors to enable users to have mobile access to the internet. Intel continues to provide processors based on innovative silicon technology that delivers energy efficiency and improved battery life, including the next-generation Centrino processor technology "Santa Rosa."
Due in May, Santa Rosa processor technology is comprised of a next-generation Intel Core 2 Duo processor, the Mobile Intel 965 Express chipset family, Intel Next-Gen Wireless-N Network Connection, Intel 82566MM and 82566MC Gigabit Network Connection, and optional Intel Turbo memory. Perlmutter demonstrated how Intel Turbo Memory decreases resume time from notebook hibernation, thus increasing productivity and reducing system power consumption.
In the first half of 2008, Santa Rosa will be refreshed with Intel's innovative 45nm Hi-k dual core mobile processor, codenamed "Penryn." Later in 2008, Perlmutter said Intel will deliver "Montevina" processor technology, also with Penryn, for greater performance and energy efficiency. With approximately 40 percent smaller components, Montevina will be ideal for mini- and sub-notebooks, and will include integrated hardware decode for high-definition video.
For the first time, Intel will make its integrated Wi-Fi/WiMAX solution available as an option with Montevina-based notebooks, enabling people to connect to Wi-Fi and WiMAX networks worldwide. Mobile WiMAX provides multi-megabit speed, greater throughput and wider range versus other wireless broadband technologies.
Anand Chandrasekher, Intel senior vice president and general manager of the Ultra Mobility Group, described the evolution of the personal mobile Internet, outlined changes in Intel's silicon roadmap that will create radical reductions in power requirements and innovative new packaging technology, and disclosed a range of leading industry players Intel is working with to establish the MID and ultra-mobile PC (UMPC) categories.
Chandrasekher introduced the Intel Ultra Mobile platform 2007 (formerly codenamed "McCaslin"; see the specs) for MIDs and UMPCs and said systems will be available over the summer from Aigo, Asus, Fujitsu, Haier, HTC and Samsung. The Intel Ultra Mobile platform 2007 is based on the Intel processor A100 and A110, the Intel 945GU Express Chipset and the Intel ICH7U I/O Controller Hub.
Intel Ultra Mobile platform 2007
"Today's environment is primed for a truly personal, mobile Internet experience and the Intel Ultra Mobile platform 2007 combines the flexibility of a PC with the mobility of a handheld device," said Chandrasekher. "But we will not stop here. In 2008, Intel will deliver an entirely new platform based on Intel’s 45nm low-power microarchitecture designed from the ground up to let people to carry their personal mobile Internet in their pocket."
The HTC Shift based on Intel Ultra Mobile platform 2007
Pulling in the schedule by half a year, Chandrasekher said Intel will deliver its next-generation platform for MIDs and UMPCs – codenamed "Menlow" – in the first half of 2008. While demonstrating the world's first working Menlow-based prototype, he said it will be based on a new 45nm Hi-k low power microarchitecture-based processor, codenamed "Silverthorne," and next-generation chipset, codenamed "Poulsbo."
Chandrasekher also announced the formation of the Mobile Internet Device Innovation Alliance. Together, alliance members will work on engineering challenges, including power management, wireless communications, and software integration, that are associated with delivering the full Internet in ever-smaller MID form factors.
Intel's next-generation processors for the ultra-mobile, mobile, desktop, workstation and server segments will be based on the company's 45nm silicon process technology that uses its high-k metal gate transistors.
During his Technology Insight presentation, Intel Senior Fellow Mark Bohr said the company now has working versions of its Silverthorne processor based on its 45nm Hi-k low power microarchitecture for MIDs and UMPCs. Silverthorne joins already working versions of its 45nm Hi-k Intel Core 2 Duo, Core 2 Quad and Intel Xeon family of processors. Today, Intel has more than 15 different 45nm Hi-k product designs in various stages of development, and will have two 45nm manufacturing fabs in production by the end of the year, with four in production by the second half of 2008.
Intel is already working on technology for 32nm, 22nm and beyond. Bohr described several options that Intel is researching for future technology generations, including tri-gate transistors, Indium Antimonide quantum well transistors and carbon nanotube interconnects.
Source: Intel Corporation
SanDisk Corporation announced the new Sansa Shaker MP3 player designed for kids and families. A fun music player, the Sansa Shaker features many ways to enjoy and share songs, including two headphone jacks, a built-in speaker to listen without ear buds, and the ability to play SD cards loaded with your favorite music.
Changing songs on the player is a snap – or rather, a shake. Young music lovers can impress their friends by shaking the device to jump to another song, or use a simple controller band for moving forward and back through their song library. A second band manipulates volume.
The Sansa Shaker is available in pink and blue; it comes equipped with a USB cable, lanyard, five pre-loaded songs,and a colorful array of stickers so kids can customize their device. The Sansa Shaker includes an AAA battery that allows up to 15 hours of battery life when using a single pair of headphones. It also comes with a 512MB SD flash memory card.
The Shaker is expected to be available in the United States in late April at a manufacturer's suggested retail price of $39.99, with availability planned in other parts of the world later this year.
Source: SanDisk Corporation
Sharp has succeeded in developing a new LCD for mobile equipment such as mobile phones. The new LCD features the industry's highest contrast ratio of 2,000:1, a wide viewing angle of 176 degrees that is top class in the industry, and a high-speed response time of 8 ms.
One-Seg-compatible mobile phones are capable of receiving terrestrial digital TV broadcasts. The total number of shipments of such phones is expected to surpass 10 million in Japan this summer. Because similar broadcasting service has already started in Europe and the US, world demand for mobile phones able to receive digital TV broadcasting is expected to increase.
By fusing proprietary, high-resolution liquid-crystal-system technology with high-quality display technology cultivated through the development of AQUOS LCD TVs, Sharp has developed a new LCD for mobile equipment.
This autumn, Sharp is scheduled to make a sample shipment of the new LCDs for One-Seg-compatible mobile phones. Sharp will then use the new LCDs to expand its lineup of mobile phones and to further develop the application of these new LCDs in digital cameras.
NVIDIA Corporation announced the extension of the NVIDIA GeForce 8 Series line-up to include three new graphics processing units. The new GPUs that complete the first top-to-bottom family of DirectX 10 GPUs include:
All three new cards feature PureVideo HD technology which leverages the second-generation video-processing engine in the GeForce 8500 and GeForce 8600 GPUs to deliver the improved playback of HD DVD and Blu-ray movies on everyday PCs. The new programmable video processing engine takes on all of the high definition H.264 HD video decoding, freeing the CPU to perform other tasks and reducing power consumption, heat, and noise.
GeForce 8 Series GPUs are the only DirectX 10 GPUs currently available and are the reference GPUs for DirectX 10 API development and certification. GeForce 8 Series GPUs include all required hardware functionality defined in the Microsoft Direct3D 10 specification, with full support for the DirectX 10 unified shader instruction set and Shader Model 4 capabilities. In addition, every GeForce 8 Series GPU features the NVIDIA PureVideo HD video processor, the NVIDIA Lumenex engine for improved image quality, and the NVIDIA Quantum Effects technology for simulation and rendering of visual effects in games.
Graphics cards based on GeForce 8600 GTS GPUs are available now from leading retail outlets, system builders, and OEMs. Graphics cards based on GeForce 8600 GT and GeForce 8500 GT will be available on or before May 1, 2007.
Source: NVIDIA Corporation
Write a comment below. No registration needed!