Sony introduced its first high-definition EVI robotic camera designed for videoconferencing, distance learning, houses of worship and corporate training. The single chip-based, pan/tilt/zoom camera features multi-format capabilities to output both standard- and high-definition video so users can easily migrate from standard-definition to HD.
The new EVI-HD1 model uses a 1080i CMOS sensor that delivers high-definition resolution in 720p, 1080i or 1080p. The camera can be used with compatible codecís and systems from other manufacturers, due to its ability to output standard-definition video (YC and composite), high-definition analog component (Y, Pub, Pr) or digital HD-SDI.
The unit incorporates a 10x optical zoom lens with a 70-degree horizontal field of view. The EVI-HD1 is also equipped with high-torque, high-speed direct drive motors that enable smooth, fast and quiet pan/tilt operations.
The cameraís pan/tilt/zoom controls can be operated by an easy-to-use supplied IR Remote Commander unit or via the RS-232C interface (VISCA protocol) with a host of commercially available controllers.
The EVI-HD1 HD camera will be available in January through authorized Sony distributors and resellers at a suggested list price of $4,495.
Super Talent Technology today announced general availability of 2GB 667MHz 240-pin DDR2 ECC Registered DIMMs (P/N: S2GTR4BMx) and 2GB 667MHz 240-pin DDR2 Fully Buffered DIMMs (P/N: S2GTF4EMS).
Super Talent designed the S2GTR4BMx RDIMM for maximum memory speed and density in Next-Generation AMD Opteron based servers. This module has been qualified fully loaded (32GB installed) in Supermicroís newest "8-way" Quad Dual-Core Opteron server boards including the H8QC8.
The S2GTF4EMS FB-DIMM was developed specifically to support the latest Intel Xeon based server platforms. Super Talentís FB-DIMM product family now includes 512MB, 1GB and 2GB densities.
Super Talentís 2GB 667MHz FB-DIMM has passed qualifications at CMTL, the memory industryís independent compatibility test lab.
Both these products are manufactured in Super Talentís San Jose, California factory, and are backed with a lifetime warranty. Both products are shipping now directly to OEM customers and through Super Talent distributors worldwide.
Source: Super Talent Technology
S3 Graphics today announced that the latest addition to the Chrome S27 PCI Express graphics card family, the Chrome S27 Low Profile 256MB/128bit 400MHz DDR2 board, is now available for immediate purchase through its online retail site, the GStore.
Fully supporting the graphics demands of Microsoft Windows Vista, these cards provide DirectX 9.0 implementation with 4 vertex and 8 pixel processors. The cards also support S3 MultiChrome technology.
These new half-height cards further extend the range of systems to include next generation sleek digital multimedia centers in the living room, in line with new design standards for space-constrained systems. The new Low Profile cards are currently available for purchase from the S3 Graphics' GStore at a price of just $79.99.
S3 Graphics Chrome S27 DDR2 cards feature a wide range of connectivity options including support for DVI and VGA display interfaces along with Macrovision-certified TV-out. This connectivity is further enhanced through native 1080p HDTV support and widescreen display capability with Chromotion 3.0, the next generation programmable video engine with hardware accelerated motion compensation and WMV-HD support. For home theatre applications that demand cool & quiet operation, the S3 Graphics Chrome S27 features an efficient and power smart design, coupled with Fujitsu's 90nm process technology.
Toshiba Corporation announced a 1.8-inch drive that offers a storage capacity of 100GB. The new drive, MK1011GAH, employs perpendicular magnetic recording (PMR) technology and an improved error correction code to secure the areal density of 240.8 megabits per square millimeter (155.3 gigabits per square inch). Toshiba will start mass production of this new best-in-class drive from January 2007.
Alongside capacity improvement, Toshiba has also improved power consumption to 0.003W/GB, as defined in the Ministry of Economy, Trade and Industry's Energy Conservation Law, assuring a more environmentally friendly design. The new drive also complies with the EU's RoHS directive, which came into force in July 2006.
Toshiba will feature the new drive at the International Consumer Electronics Show (CES) 2007, in Las Vegas, Nevada from January 8 to 11, at booth 12832.
Source: Toshiba Corporation
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PNY Technologies announced upcoming availability of their 4GB SD High Capacity (SDHC) card based on the SD Association Specification Version 2.00.
PNY Technologies' SDHC cards are rated Class 4 and can transfer data at a minimum of 4MB per second.
Only host devices that are compliant to SD Specifications Version 2.00 can access SDHC memory cards. However, most SDHC compatible devices are able to read and write to standard SD memory cards that are widely available on the market today. PNY Technologies' 4GB SDHC memory cards come with a lifetime warranty and will be available from major consumer electronics retailers in Q1 of 2007 and e-tailers in December 2006 for $119.99. An 8GB Class 4 SDHC memory card will be available in Q1 2007.
Source: PNY Technologies
NVIDIA Corporation introduced the immediate availability of the new NVIDIA nForce 680a SLI media and communications processor (MCP), designed specifically for the new AMD Quad FX Platform with Dual Socket Direct Connect Architecture. The exclusive core-logic launch partner for AMD Quad FX processors, the NVIDIA nForce 680a SLI MCP provides processing capabilities on a massive scale, by allowing multimedia and megatasking users to harness the power of up to 4 GPUs, 8 displays, 12 SATA hard drives, and 4 gigabit Ethernet connections, all from a single consumer desktop PC.
The NVIDIA nForce 680a SLI MCP is a motherboard core-logic solution providing a host of technologies that redefine the ultimate PC category. These include support for NVIDIA SLI multi-GPU technology, with four PCI Express slots that can be used to drive up to eight independent, high-resolution displays for extended work spaces; and advanced networking and storage capabilities, including support for up to 4 Gigabit Ethernet connections and 12 SATA hard drives for a combined 8 terabytes of media storage. Additionally, the NVIDIA nForce 680a SLI MCP has been architected to take advantage of the power behind AMD Athlon 64 FX-70 series processors, allowing users to also run multiple multi-threaded, CPU-intensive applications simultaneously.
System builders currently offering AMD Quad FX Platform-based PCs include Cyberpower, iBuypower, Maingear, Vigor, and others. The ASUS L1N64-SLI WS motherboard featuring the NVIDIA nForce 680a SLI MCP is also available now through the system builder channel and regular e-tail outlets.
Source: NVIDIA Corporation
Intel Corporation today announced design completion of its first mobile WiMAX baseband chip. Combined with the companyís previously announced single-chip, multi-band WiMAX/Wi-Fi radio, the pair creates a complete chipset called the Intel WiMAX Connection 2300.
The Intel WiMAX Connection 2300 chipset design was demonstrated during Executive Vice President and Chief Sales and Marketing Officer Sean Maloneyís keynote at the 3G World Congress and Mobility Marketplace in Hong Kong.
Maloney showed an Intel Centrino Duo mobile technology-based laptop with mobile WiMAX (IEEE 802.16e-2005), Wi-Fi (IEEE 802.11n), and high-speed downlink packet access (HSDPA) 3G capabilities successfully accessing the Internet at broadband speeds over a mobile WiMAX network.
The completed design of the Intel WiMAX Connection 2300 brings Intel a step closer to an integrated wireless system-on-chip that will help drive WiMAX adoption by maximizing useable space in mobile devices. As laptops become smaller, for example, they will have limited space for new technologies. Integration also helps enable ubiquitous connectivity on ultra mobile PCs, consumer electronics and handheld devices that have significant size constraints for the number of cards or components.
With global frequency support for standards-based Wi-Fi and WiMAX, scalable channel bandwidth, and high-performance multiple-antennas, the Intel WiMAX Connection 2300 will help bring about mobile communications and rich content across supported networks anywhere in the world. For the first time, Intel incorporated multiple input/multiple output (MIMO) functionality into the baseband chip to enhance the signal quality and throughput of wireless bandwidth. The baseband chip also employs the same software for Intelís WiMAX and Wi-Fi solutions to help ensure unified management for connectivity. Over-the-air provisioning supports easy configuration and enables consumer activation of services, shifting the traditional hands on service provider business model to a direct activation one based purely on consumer purchases of mobile devices. The baseband chip also has low power requirements for increased battery life and lower thermals to support smaller and thinner designs.
With the initial Intel WiMAX Connection 2300 chipset design now complete, Intel plans to focus on validating and testing the product, with plans to sample both card and module forms beginning in late 2007.
Source: Intel Corporation
Kyocera Corporation and its group companies are exhibiting at the ITU 2006, held from December 4 to 8 in Hong Kong, with the focus on a display of CDMA mobile handsets. The products in the booth have been selected to present Kyocera's 'design concept' towards the mobile communication terminals.
For the Japanese market, as a general trend, handsets are becoming larger due to the increasing variety of functions. Two of the terminals offered by Kyocera this year are lightweight and slim in response to user opinions, while being equipped with enriched functions and wide clear displays. The A5521K model released this spring is squeezed into a package of just 18 mm thickness, and the brand-new W44K has drawn the attention of the market for its mere 15 mm depth.
San Diego-based Kyocera Wireless Corp. offers a strong line of miniature and cutting-edge terminals mainly for Americas and a part of Asia. K612 (Strobe/Switch_Back) is intended for young and trend-conscious users. The compact and ergonomic sleek clamshell design is suitable for talking, and users can also enjoy smooth message communication using the hidden QWERTY keypad.
Source: Kyocera Corporation
Iomega Corporation enhanced its external storage solution for Apple's Mac mini computers by doubling the capacity of the Iomega MiniMax Desktop Hard Drive USB 2.0/FireWire from 250 GB to 500 GB.
The stackable Iomega MiniMax Drive keeps the same features, including a three-port USB 2.0 hub, three FireWire ports, a smart power switch that powers up and down in tandem with the Mac mini, and an interactive cooling system with thermal probe that automatically regulates fan speed.
The Iomega MiniMax 500GB Drive measures 6.5" square and 2" tall. It has the same footprint and matches the industrial design of the Mac mini. Its 7200 RPM hard drive with 8MB cache adds 500GB of storage to the Mac mini's internal 60GB or 80GB native capacity. And with Dantz Retrospect backup software included, Mac mini users get hassle-free backup and data recovery to secure their files, photos, songs, and other data.
The Iomega MiniMax 500GB Desktop Hard Drive is compatible with Macintosh G3 or greater (blue and white G3 only), iMac or Mac Mini computer with built-in USB connection and Mac OS 10.2 or above.
The Iomega MiniMax 500GB Drive can also be reformatted for use with Microsoft Windows 2000/XP Home or Professional; instructions included.
The Iomega MiniMax 500GB Desktop Hard Drive is available for $279.95 (U.S. suggested retail.) from www.iomega.com and select online and Web retailers. The product is currently available in Europe, as well.
Source: Iomega Corporation
Launching the next generation of energy-efficient computing, AMD announced the transition to 65nm process technology, beginning with the immediate availability of energy-efficient AMD Athlon 64 X2 dual-core desktop processors. The move to 65nm process technology enables AMD to produce more processors on a 300mm wafer, for increased production capacity, while continuing to aggressively scale performance and reduce power consumption. By mid-2007, AMD expects to be fully converted to 65nm production at Fab 36.
OEMS offering systems ready for Microsoft Windows Vista with 65nm AMD Athlon 64 X2 dual-core processors immediately, and beginning in Q1 of 2007, include Acer, Dell, Founder, Gateway, HP, Lenovo, Packard Bell, and TongFang, as well as leading system builders worldwide.
Building on AMDís 90nm high-performance, low-power Silicon-on-Insulator (SOI) technology, AMDís 65nm SOI technology takes full advantage of our 90nm high-performance technology, scalability and power efficiency. The move to 65nm allows for reductions in line widths which enable AMD to produce more processors on a 300mm wafer, for increased production capacity. AMDís 65nm processes have evolved from a technology agreement with IBM that has been highly beneficial to AMD.
Pricing for the 65nm AMD Athlon 64 dual-core processors 5000+, 4800+, 4400+, and 4000+ are $301, $271, $214, and $169, respectively in 1KU PIB.
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