Texas Instruments announced that Microsoft has selected TI's OMAP2420 applications processor as the first ARM11-based development platform for its Windows CE 6 beta release distributed this week to device makers worldwide. A Board Support Package for TI's OMAP2420 processor will be integrated into the Windows CE 6 Platform Builder toolkit. TI's OMAP2420 processor, which has shipped in millions of devices to date, will be the first ARM11-based solution that supports Windows CE 6, with a roadmap to include future OMAP processors.
The new OMAP2420 platform for Windows CE 6, expected to be available later this year, is well suited for richer multimedia and low power applications including portable navigation devices, media players, remote monitoring equipment and gaming devices. This platform showcases the next-generation features and capabilities of the redesigned Microsoft Windows CE 6 kernel on TI's ARM11-based OMAP 2 platform, which will benefit a wide range of device manufacturers designing on the OMAP 2 family of processors.
The OMAP2420 processor is built on TI's OMAP 2 "All-in-One" mobile entertainment architecture, which provides the foundation for mobile device manufacturers to merge today's high-end consumer electronics in smartphones and other converged portable multimedia devices. These processors enable high-quality digital TV, Hi-Fi music with 3D effects, DVD-quality video, high-end gaming functionality, digital cameras up to 6 megapixels, analog and digital broadcast reception, high-speed wireless connectivity, greater than VGA resolution color LCD displays and more.
The OMAP2420 processor also provides enhanced power and performance management through TI's SmartReflex solutions that incorporate a range of intelligent and adaptive hardware and software technologies that dynamically control voltage, frequency and power based on device activity, modes of operation and process and temperature variation.
TI's OMAP2420 stand-alone application processor is the first device in the marketplace to leverage the ARM11 micro-architecture and is TI's second generation of OMAP processors to use 90-nanometer technology. The OMAP2420 chip includes an ARM1136JS-F core, a TI programmable audio DSP, a TI imaging and video accelerator (IVA), a 2D/3D graphics accelerator offering up to 2 million polygons per second, integrated camera interface, M-Shield hardware-based security solution and more. The OMAP2420 processor is powering handsets on the market today.
Source: Texas Instruments
The majority of leading motherboard manufacturers are already finishing their work on products based on Intel P965 (Broadwater P) that is to be officially announced by Intel early in June. As you remember, Broadwater (P965 and G965) chipsets support Intel's next-generation processors with Core architecture, including Conroe, and are designed for masses. G965 (with DirectX 10 based integrated graphics) is to be released later, in Q3 2006, since it's graphics core is still under development.
Our colleagues from HKEPC managed to have a look at an engineering sample of an Intel P965 board by ECS, the P965-A. It supports 1066MHz FSB (266MHz x 4) and DDR2-800 memory. Its circuitry meets the VRM11 specs and the board is able to power Conroe CPUs, including the Extreme Editions. P965-A features a single PCI Express x16 slot, a single PCI Express x4 slot, a couple of PCI Express x1 slots, and three PCI slots.
Also onboard: 10 x USB 2.0, 6 x SerialATA II, Intel Matrix Storage Technology (AHCI and RAID 0/1/5/10), and dual Gigabit Ethernet.
Since there's no Parallel ATA controller at all, we wonder what to do with existing optical drives, most of which have PATA interface. Perhaps, ECS will consider an additional IDE controller in the final modification.
Speaking of sound, ECS P965-A features the Realtek ALC885 codec, certified for Microsoft Vista Premium.
As you can see, ECS P965-A looks a solid value offering, though we doubt the first Conroe motherboards will be cheap. But there will be some affordable products (like ASRock 775i65G Rev 2.0) anyway.
Mitsubishi Electric, NEC, and Institute of Industrial Science, University of Tokyo have successfully interconnected quantum cryptography systems developed by Mitsubishi Electric and NEC, the first time such an experiment has been successful in Japan. The Institute of Industrial Science at University of Tokyo evaluated the system's security. Quantum cryptography guarantees absolute security, underwritten by the laws of quantum physics.
This achievement was the result of modifying different quantum encryption systems developed by NEC and Mitsubishi Electric, which were researched and developed under a quantum encryption technology project sponsored by the National Institute of Information and Communication (NICT), Research and Development on Quantum Cryptography, from 2001 to 2005.
Security of most modern cryptography is based on computational complexity, and the extraordinary time necessary for cryptanalysis. It has been pointed out that modern cryptography may be threatened by the increasing speed and ability of computers in the future. To that end, many are suggesting a shift to using quantum encryption. This type of optical cryptography uses quantum-state photons to carry data, and has the advantage of being able to detect eavesdropping. This results in a physically unbreakable, ultimate code. However, since there has been no standardization in the details of the encryption algorithms or the construction of optical devices necessary in communication, it has not been possible to interconnect different systems or build a communication network between different users. They have now developed a technology that can interconnect Mitsubishi Electric and NEC's cryptography systems. This was done on a NICT-developed JGN2 test bed network at the Akihabara access point. Results verify the potential for their system to be the foundation for the next generation of secure networks.
Firstly, they developed a new interface and shared encryption key, and confirmed mutual communication between the differing quantum cryptography systems developed by Mitsubishi Electric and NEC. This is a key technology in standardization of quantum cryptography systems, and will allow for a highly confidential communication network in the future.
Secondly, previously it was necessary to receive objective third party safety certification for the various systems that Mitsubishi Electric and NEC developed separately. This time the scientists conducted an observation experiment of information leaked by eavesdropping as well as weaknesses born from implementation, and both verified and confirmed the security of the interconnected quantum cryptography system.
The chart below represents an interconnected quantum encryption network made of Mitsubishi Electric (Device A, B) and NEC (Device C, D) quantum encryption systems. In the past, each system was constructed independently, and communication was done in a closed system. A way of relaying information was necessary in order to network the different systems. With this experiment, they were able to successfully interconnect a quantum encryption network without any affects on the different systems by developing a new relay method. The security of the network underwent a theoretical observation study at Tokyo University's Institute of Industrial Science.
Process for a shared key in a quantum encryption network: First set and apply an appropriate key to the various communications between devices A,B,C and D. Devices A and B will share the key K1, and devices C and D will share the key K2. Next, the key that should eventually be shared by Devices A and D should be produced at the center, and should be sent to Devices A and D passing through Devices B and C. Key K1 encrypted Key K3 will be sent to Device A from Device B, and key K2 encrypted key K3 will be sent to Device D from Device C. Devices A and D will decipher those and get key K3. Using the above procedure, devices A and D can, based on quantum encryption theory, safely share key K3. Using key K3 as an encryption key, Device A and Device D can safely share data.
It is hoped that using this technology it will be possible to realize quantum cryptographic networks within 5 years.
Infineon Technologies announced today that the first cell phone chips equipped with its advanced 65-nm CMOS process technology are now available. The dial-in to different GSM mobile communications networks and the resulting connections worked without a hitch. This new technology features higher performance at lower power consumption and is the most advanced semiconductor technology for logic circuitry that Infineon is currently preparing for mass production. First products in this new technology are expected to be market-ready towards the end of 2006.
The chip just tested puts more than 30 million transistors on a space of just 33mm² and proves that Infineon is able to produce such major digital and analog circuitry in cell phones as MCU/DSP cores, storage and analog/mixed-signal in 65-nm technology to operate with high reliability. This space-saving technology was also used to manufacture high-frequency circuits for the first time.
Infineon developed this technology in the 65/45-nm research and development alliance ICIS consisting of IBM, Chartered, Infineon and Samsung. The mobile communications chip developed by Infineon was produced in the frame of a manufacturing agreement with Chartered in Singapore.
Source: Infineon Technologies
Write a comment below. No registration needed!