Infineon Delivers GDDR3 Memory For ATI Mobility Radeon X1600
Toshiba And M-Systems Introduce New DiskOnChip H3 Drives
Infineon Delivers GDDR3 Memory For ATI Mobility Radeon X1600
Infineon today announced that its 512Mbit GDDR3 graphics DRAM were selected by ATI Technologies for use with its Mobility Radeon X1600 graphics processor targeting notebook PCs.
The Infineon 512Mbit GDDR3 graphics DRAM supports clock frequencies of up to 800 MHz and uses a 32-bit interface. It is capable of handling data bandwidths of up to 1.6 Gbps per pin. In addition Infineon's power saving trench technology is said to offer significantly less power consumption than other DRAMs at a given performance and improve battery lifetime.
Infineon's 512Mbit and 256Mbit GDDR3 DRAM is organized as 16Mx32 and 8Mx32 and is packaged in a small FBGA body sized 11x14mm.
The GDDR3 is manufactured at Infineon’s manufacturing sites in Dresden, Germany, and Richmond, USA, and available in volume quantities.
Source: Infineon
Toshiba And M-Systems Introduce New DiskOnChip H3 Drives
M-Systems and Toshiba today announced that the companies will offer DiskOnChip (DOC) H3, a new generation of on-board, high-density embedded flash drives based on DiskOnChip architecture, for mobile handsets and consumer electronics devices. DOC H3 will allow device designers to integrate on-board storage utilizing Toshiba's latest multi-level cell NAND flash, and M-Systems' built-in TrueFFS flash management software in firmware.
DOC H3 utilizes 70nm generation MLC NAND flash. By changing the product configuration from a monolithic design to a multi-chip design, Toshiba and M-Systems gain access to the latest advances in NAND flash technology and shorten DOC development time. DOC H3 manages its NAND flash media from within its controller integrated circuit, allowing customers to reduce product development cycles.
DOC H3 will be made available in a variety of densities ranging from 256MB to 2GB. First engineering samples of DOC H3 are expected to be available in the second quarter of 2006, with mass production slated for the third quarter of 2006.
Source: Toshiba
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