Epson develops flexible 8-bit asynchronous microprocessor 3GSM World Congress: NVIDIA unveils GoForce 3D 4800 GPU GALAXY GeForce 6600 AGP bears Zalman VF700 cooler Epson develops flexible 8-bit asynchronous microprocessor Seiko Epson developed the new flexible 8-bit asynchronous microprocessor using low-temperature polysilicon thin-film transistors (LTPS-TFTs) on a plastic substrate. It has energy consumption reduced by 70% compared to the existing synchronous microprocessors. The combination of Epson´s SUFTLA technology, LTPS-TFTs technology, and asynchronous circuit design technology allowed to create stable displays that are large in size, and that use substrates that are both flexible and variable in shape. SUFTLA is an Epson developed technique that makes it possible to transfer LTPS-TFT circuits onto flexible substrates. In the current project, Epson is aiming to build on its traditional strengths to firmly establish the field of flexible microelectronics technology. ![]() Features:
3GSM World Congress: NVIDIA unveils GoForce 3D 4800 GPU The growing capabilities of cell phones have long ago inspired demand for mobile GPUs. This time, having dated the release to 3GSM World Congress, NVIDIA unveiled its new GoForce 3D 4800 GPU. ![]() NVIDIA GoForce 4800 features hardware MPEG-4 decoder supporting resolutions up to 640x480 (can play video from SD cards), hardware JPEG encoder supporting resolutions up to 2048x1536 and hardware game accelerator. Besides, the GPU provides duplex videoconferencing at CIF resolution (352x288) at up to 30 fps. As for 3D capabilities, the GPU is said to be 40% more powerful than that of the previous generation (GoForce 4500, I guess), while its shader architecture can map up to 6 textures. According to the press release, GoForce 3D 4800 utilizes nPower innovation that halves energy consumption comparing to other cell phones. The first mobile handsets on NVIDIA GoForce 3D 4800 are expected late in 2005 already.
GALAXY GeForce 6600 AGP bears Zalman VF700 cooler The South Korean Zalman Tech, specializing in PC cooling, is popular among vendors as well. For example, Sapphire Technologies has been installing heat-piped ZM80x-HP onto its top "Ultimate Edition" cards for a long time. So, Zalman´s updated product range couldn´t be missed by graphics card vendors. ![]() GALAXY Technology was one of the first to announce its GALAXY GeForce 6600 AGP with a new VF700 cooler made purely of aluminium fins (and thus outstanding from Zalman´s VF700-Cu, VF700-ALCu models). As end users lose nothing because of the absence of such hypothetical and potentially cheaper type of VF700-Al for sale, companies purchasing such products from the manufacturer are to save much on the more expensive copper. Besides, it suits the moderate heat emission of 110nm NV43 core well enough. ![]() The aforementioned GALAXY GeForce 6600 AGP has an D-Sub connector instead of the second DVI-I. It also features 128 MB DDR, 300/550 MHz clock rate and AGP 8x interface. Eight TSOP chips from Hynix are rotated by 45° (redesigned due to HSI bridge), and the four of them on the back side are not cooled anyhow: ![]() The card turns out to be rather high: 30mm of VF700 and several millimeters of GeForce 6600 GPU not only occupy the closest slot, but also make it harder to install something into the next as well. Providing the good noise/performance ratio this novelty costs about $170. Source: Akiba PC
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