 |
 |
 |
|
||
|
||
| ||
|
|
|
|
|
||
|
||
| ||
|
Transmeta updates Crusoe roadmap Radeon 9700 PRO: Gigabyte and CP Technology get a taste ServerWorks´ server chipset with Gigabit Ethernet Wistron launches Xbox production Dell printers might be produced by Foxconn Nanya and Winbond begin to ship DRAM for graphics cards 1GB DDR266 ECC SODIMM modules from Samsung P4PE: i845PE-based firstling from ASUS New 17-inch LCD panels from IBM Transmeta updates Crusoe roadmap Yesterday, at SG Cowen technological forum, Matthew Perry, Transmeta CEO, reported about company´s current affairs and presented an updated roadmap. November 7 will be a good day for Transmeta, because Hewlett-Packard, simultaneously with Microsoft worldwide announcement, will present its Crusoe-based portable PC.
In addition, Transmeta may be happy about the fact that 7 of 10 leading Japanese notebook makers use its chips in their products. Respectively, 4 out of 10 world largest makers use Crusoe processors. Currently Transmeta has samples of 1 GHz Crusoe TM5800, made on TSMC fabs using 0.13-micron process technology with copper interconnects. Chip area makes 55 sq.mm. And this is the updated company roadmap:
 Radeon 9700 PRO: Gigabyte and CP Technology get a taste According to messages from Taiwan, ATI Radeon 9700 PRO cards have already gained considerable popularity, not being yet widespread in retail. And the fame only grows with time. Well, it shouldn´t surprise anyone, as the answer from NVIDIA will appear in the market only after the end of the third quarter. Industrial sources report that growing demand for Radeon 9700 PRO cards already made Gigabyte Technology and CP Technology increase orders from ATI Technologies. The Canadian company was forced to order more from its production partner, TSMC, at once. It´s known that in August Gigabyte placed orders for additional 10 thousand Radeon 9700 PRO chips and already received the first consignments. CP Technology also received the first shipments early in September and had time to order more from ATI. By the way, as the gross profit for one Radeon 9700 PRO card currently makes 15-20%, analysts forecast that Gigabyte and CP Technology will nicely benefit. If ATI / TSMC do their part as well...
ServerWorks´ server chipset with Gigabit Ethernet Implementing the developments of parental Broadcom, ServerWorks announced the plans to release server logics with integrated Gigabit Ethernet adapters.In the future the company is going to implement Gigabit Ethernet into memory controller chip. This Gigabit Ethernet integration will be featured already in 90-nm chipsets. New Ethernet I/O bridges from ServerWorks will be produced in four versions. Grand Champion Ethernet I/O Bridge or CIOB-E will include control and physical level logics of dual-port 10/100/1000 Ethernet controller and also 64-bit / 133 MHz PCI-X host controller supporting up to four devices. CIOB-ES will additionally feature an auxillary dual back-panel interface for blade servers. 5704 version will be produced for low-end systems. It will support single-channel 133 MHz PCI-X and single-port Gigabit Ethernet. 5703 will support single 66/133 MHz PCI-X. New elements of server chipsets require 3-5 W and use 3.2 GB/sec ServerWorks IMB2 bus for memory controller connectivity. CIOB-E supports IPMI for the management and four SMBus ports. CIOB-E bridge is made using 0.13-micron process technology of Taiwanese TSMC. Samples are already available for $50 per unit in 1000-unit consignments.
Wistron launches Xbox production In the end of August Microsoft made new efforts to reduce Xbox expenses, including the transition of manufacture to Asia. This week Taiwanese Wistron confirmed that it had become the second Xbox maker (the first is Flextronics). Wistron said it had already launched pilot production in China. Volume shipments are planned to X-Mas.Finance side of the contract hasn´t been disclosed, but, most likely, Taiwanese company gets all the assembly, testing and packing. So, now the competition of Sony and Microsoft or PlayStation 2 vs. Xbox includes Flextronics and Wistron vs. Foxconn and Asustek.
Dell printers might be produced by Foxconn Some time ago Dell was rumoured to release printers under its brand in addition to PDAs. In mid-August the company officially confirmed this intention, and recently Dell representatives met with people from Taiwanese Foxconn Electronics (trademark of Hon Hai Precision Industry) and together they visited IUT (International United Technology), ink cartridge maker.Foxconn representative said it was early to claim that his company will make Dell printers. Though he added that entering the market with own printers will require some components. IUT hasn´t officially commented this yet. However, the company has already created a department for printer turrets and drivers for Dell and Foxconn OEM contract. Most likely, printers won´t be too expensive to sell them along with Dell PCs. Potential makers also include Lexmark and Epson, whose products Dell sells today.
Nanya and Winbond begin to ship DRAM for graphics cards Nanya and Winbond finished the development of 4 Mbit x 32 DDR chips for graphics adapters and started to ship samples to graphics and DRAM makers. Companies plan to launch the volume production closer to the year-end.Not long ago DRAM chips were shipped for high-end graphics cards via οεν contracts, so standard DRAM makers were not interested much. Nanya and Winbond entered this market, indicating the DRAM maker trend to transit to more expensive DDR production for high-performance cards. Distributors believe that DRAM developers will suffer most. Currently OEM customers prefer Samsung or Hynix products, so such makers, as Nanya and Winbond compete with developers more. But as Nanya and Winbond have their factories, and developers don´t, they are more fliexible in chip production and can control shipment volumes.
1GB DDR266 ECC SODIMM modules from Samsung Samsung Semiconductor announced the shipments of 1GB DDR266 ECC samples in SODIMM (Small Outline Dual In-Line Memory Module) packages for network and blade-servers. Modules are organized from nine 1 Gbit chips, that equals to 18 standard 512 Mbit DDR DRAM chips.New modules require 2.5 V. Volume production of 1 GB ECC SODIMM samples (M485L2923MTO-CBO) from Samsung will begin this September.
P4PE: i845PE-based firstling from ASUS The official announcement of new 845GE/845PE/845GV chipsets is at hand, as makers have been receiving samples from mid-August. As usual, information about some new boards appears before official press releases with chipset specifications. It seems it´s the time for new Intel chipset filrstlings. Being a bit ahead of time, ASUSTeK Computer presented its P4PE board on Intel 845PE officially supporting DDR333 and other processor overclocking features. P4PE brief specifications:
 The usual package also includes a DVD disc with a complete set of DVD/MPEG4/MP3 InterVideo software: WinDVD, WinCoder, WinRip and WinProducer. All new ASUS boards will features a BLUE PCI Slot innovation. With additional functionality it will enable all wireless connectivity, including Bluetooth, without an additional controller.
New 17-inch LCD panels from IBM IBM started to receive orders for its new 17-inch LCD monitors: T750 (analog and digital DVI-D) and T710 (one input). T750 features 1280x1024 (SXGA) max. resolution, 500:1 contrast, 250 candles/sq.m max. brightness, 35 ms response time, 0.264 mm pixel size, 170° horizontal and vertical viewing angle; 31-81 kHz line scan, 55-75 Hz vertical scan. Dimensions: 436x248x431 mm, weight — 7 kg, approx. price — $830.
 T710 supports same resolution and features 350:1 contrast, 250 candles/sq.m brightness, 30 ms response time, 0.264 mm pixel size, 150° horizontal and 125° vertical viewing angle; 30-81 kHz / 56-75 Hz line/vertical scan, respectively. T710 dimensions: 414x208x457 mm, weight — 5.7 kg, approx. price — $670.
Write a comment below. No registration needed!
|
Platform · Video · Multimedia · Mobile · Other || About us & Privacy policy · Twitter · Facebook Copyright © Byrds Research & Publishing, Ltd., 1997–2011. All rights reserved. |
