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VIA Introduces AMOS-5001 Chassis Kit for Slim Em-ITX Embedded Systems

VIA Technologies today announced AMOS-5001, a specially designed chassis kit for Em-ITX form factor boards (e.g. EITX-3001) enabling rapid and easy assembly of fanless embedded system designs.



Measuring just 35.2 mm high and 231 mm wide, the ultra-compact VIA AMOS-5001 is slim enough to fit in even the most space-constrained environment. Systems built using VIA AMOS-5001 are also shock resistant up to 50G and can withstand temperatures from -20°C to 55°C.

VIA AMOS-5001 chassis kit features an original modular design comprised of only four mechanical parts that ensures the easy integration of VIA EITX-3001 series mainboards. An optional 2.5-inch HDD storage subsystem chassis is also available.



VIA AMOS-5001 is available now and is targeted at embedded segments including medical, POI/POS, digital signage, kiosk, industrial and building automation, and gaming and surveillance applications.

VIA AMOS-5001 chassis combines with the integrated heatsink design found on Em-ITX boards. The discrete aluminum heatsink has direct contact with the processor and chipset on reverse side of the board, forming a base for chassis assembly.



EITX-3001 motherboard specifications:

  • Em-ITX form factor: 17 x 12 cm
  • Low profile design
  • Dual-sided I/O edges
  • Integrated VIA Chrome9 HCM with DX9 3D/2D graphics
  • Hardware acceleration for MPEG-2, WMV9, VC1, and H.264 codecs
  • Versatile display configuration inc. VGA, HDMI and LVDS multi-display
  • Gigabit Ethernet
  • COM ports, including dual RS-232 and dual RS-232/422/485
  • Five USB 2.0 host ports and one USB device port
  • Supports 5-wire/4-wire resistive touch interface connector
  • Fanless and ultra low power consumption

Source: VIA Technologies


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