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OCZ Introduces PC3-12800 Flex XLC Series

OCZ Technology Group launched the OCZ PC3-12800 Flex XLC kit that features proprietary Flex XLC (Xtreme Liquid Convention) heatsink for improved heat dissipation via a hybrid copper and aluminum design alterable between passive air or water cooling. This "flexible" design gives enthusiasts the option to run the modules passively or water cooled via the integrated liquid injection system. The concurrent use of both technologies (water-cooling) promotes maximum heat dissipation, allowing the memory to operate at extreme speeds without the high temperatures that inhibit or damage the module’s ICs.

The PC3-12800 modules run at 1600MHz and feature 6-6-6-18 timings. The modules are optimized for the top-end DDR3 platforms and will be available in 2GB (2x1024MB) dual-channel kits.

Specs:

  • 1600MHz DDR3
  • CL 6-6-6-18
  • Available in 2GB (2x1024) Dual Channel Kits (OCZ3FX16002GK)
  • Unbuffered
  • OCZ Lifetime Warranty
  • 2.05 Volts
  • 240-pin DIMM
  • 2 x 1/4" ID (inner diameter) barbs
  • FlexXLC Heatsink
  • 2.1V EVP

Source: OCZ Technology Group

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