Panasonic Develops New MEMS Microphone
Matsushita Electronic Industrial has developed a slim MEMS microphone suitable for portable electronic appliances typifying mobile phones. Sample shipment will start at the end of May 2007. The new MEMS microphone is constructed from an acoustic transducer (MEMS chip) made of MEMS technology and a CMOS amplifier, realizing low profile, at the same time, high heat resistance which enables Pb-free reflow solder mounting.
The new MEMS microphone contributes to reducing the height of portable electronic appliances, as well as reducing the mounting cost in their production process. It also contributes to realizing environment-conscious appliances by high heat resistance of 260 degree C which is required by Pb-free automatic reflow solder for print circuit board surface mounting.
The new MEMS microphone has the following technologies:
- Solid metal shield structure and mounting technology realizing 1.05mm low profile;
- Newly developed technology of high heat resistance inorganic multilayer electret diaphragm formation;
- CMOS amplifier design technology realizing low power consumption, low noise and low output impedance.
Sample shipments will start on May 2007, price depending on quantity.
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